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    Packaged semiconductor die and CTE-engineering die pair
    1.
    发明授权
    Packaged semiconductor die and CTE-engineering die pair 有权

    公开(公告)号：US10381288B2

    公开(公告)日：2019-08-13

    申请号：US16133164

    申请日：2018-09-17

    申请人： Intel Corporation

    发明人： Chuan Hu

    IPC分类号： H01L23/373 ,  H01L21/48 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065

    摘要： Packaged semiconductor die and CTE-engineering die pairs and methods to form packaged semiconductor die and CTE-engineering die pairs are described. For example, a semiconductor package includes a substrate. A semiconductor die is embedded in the substrate and has a surface area. A CTE-engineering die is embedded in the substrate and coupled to the semiconductor die. The CTE-engineering die has a surface area the same and in alignment with the surface area of the semiconductor die.

    ELECTRIC CIRCUIT ON FLEXIBLE SUBSTRATE
    8.
    发明申请
    ELECTRIC CIRCUIT ON FLEXIBLE SUBSTRATE 有权
    柔性基板上的电路

    公开(公告)号：US20150282341A1

    公开(公告)日：2015-10-01

    申请号：US14227779

    申请日：2014-03-27

    申请人： Intel Corporation

    发明人： Chuan Hu ,  Siddarth Kumar

    IPC分类号： H05K5/00 ,  H05K1/11 ,  H05K5/06 ,  H05K1/18 ,  H05K3/30 ,  H05K1/03

    CPC分类号： H05K5/0095 ,  H01L21/56 ,  H01L23/3135 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0326 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/181 ,  H05K3/303 ,  H05K5/065 ,  H05K2201/0195 ,  Y10T29/49146 ,  H01L2924/00014

    摘要： Generally discussed herein are systems and apparatuses that can include a flexible substrate with a hermetic seal formed thereon. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a hermetic seal on a flexible substrate can include (1) forming an interconnect on a flexible substrate, (2) situating a device on the substrate near the interconnect, or (3) selectively depositing a first hermetic material on the device or interconnect so as to hermetically seal the device within the combination of the interconnect and first hermetic material.

    摘要翻译： 这里通常讨论的是可以包括其上形成有气密密封的柔性基底的系统和装置。 本公开还包括制造和使用系统和装置的技术。 根据一个实例，在柔性基板上进行气密密封的技术可以包括（1）在柔性基板上形成互连，（2）将布置在基板上的装置定位在互连件附近，或（3）选择性地沉积第一密封 材料在装置或互连上，以便在互连和第一密封材料的组合内气密地密封装置。