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公开(公告)号：US10897238B2
公开(公告)日：2021-01-19
申请号：US15088987
申请日：2016-04-01
Applicant: Intel Corporation
Inventor： Feras Eid , Georgios C. Dogiamis , Valluri R. Rao , Adel A. Elsherbini , Johanna M. Swan , Telesphor Kamgaing , Vijay K. Nair
Abstract: Embodiments of the invention include a filtering device that includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The piezoelectric filtering device expands and contracts laterally in a plane of an organic substrate in response to application of an electrical signal between the first and second electrodes.
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公开(公告)号：US10887439B2
公开(公告)日：2021-01-05
申请号：US15777093
申请日：2015-12-22
Applicant: Intel Corporation
Inventor： Telesphor Kamgaing , Georgios C. Dogiamis , Vijay K. Nair
IPC: H04M15/00 , H04M1/02 , H01Q1/38 , G06F1/16 , H01Q9/04 , H01Q21/00 , H01Q23/00 , H01Q25/00 , H01Q1/40 , H01Q21/28 , H01Q1/24 , H01Q21/22 , H01Q3/26 , H01Q1/22
Abstract: Embodiments of the invention include a microelectronic device that includes a die having at least one transceiver unit, a redistribution package coupled to the die, and a substrate coupled to the redistribution package. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.
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公开(公告)号：US20200303328A1
公开(公告)日：2020-09-24
申请号：US16394537
申请日：2019-04-25
Applicant: Intel Corporation
Inventor： Henning Braunisch , Adel A. Elsherbini , Georgios Dogiamis , Telesphor Kamgaing , Richard Dischler , Johanna M. Swan , Victor J. Prokoff
IPC: H01L23/66 , H01L23/538 , H01L25/065 , H01L23/00
Abstract: Embodiments may relate to a multi-chip microelectronic package that includes a first die and a second die coupled to a package substrate. The first and second dies may have respective radiative elements that are communicatively coupled with one another such that they may communicate via an electromagnetic signal with a frequency at or above approximately 20 gigahertz (GHz). Other embodiments may be described or claimed.
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公开(公告)号：US20200294940A1
公开(公告)日：2020-09-17
申请号：US16397923
申请日：2019-04-29
Applicant: Intel Corporation
Inventor： Georgios Dogiamis , Aleksandar Aleksov , Adel A. Elsherbini , Henning Braunisch , Johanna M. Swan , Telesphor Kamgaing
Abstract: Embodiments may relate to a semiconductor package that includes a package substrate coupled with a die. The package may further include a waveguide coupled with the first package substrate. The waveguide may include two or more layers of a dielectric material with a waveguide channel positioned between two layers of the two or more layers of the dielectric material. The waveguide channel may convey an electromagnetic signal with a frequency greater than 30 gigahertz (GHz). Other embodiments may be described or claimed.
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公开(公告)号：US20200273824A1
公开(公告)日：2020-08-27
申请号：US16369836
申请日：2019-03-29
Applicant: Intel Corporation
Inventor： Telesphor Kamgaing , Georgios Dogiamis , Hyung-Jin Lee , Henning Braunisch , Richard Dischler
Abstract: Embodiments may relate to a microelectronic package that includes a package substrate and a signal interconnect coupled with the face of the package substrate. The microelectronic package may further include a ground interconnect coupled with the face of the package substrate. The ground interconnect may at least partially surround the signal interconnect. Other embodiments may be described or claimed.
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Patent Agency Ranking
公开(公告)号：US10594294B2
公开(公告)日：2020-03-17
申请号：US15088830
申请日：2016-04-01
Applicant: Intel Corporation
Inventor： Adel A. Elsherbini , Feras Eid , Baris Bicen , Telesphor Kamgaing , Vijay K. Nair , Georgios C. Dogiamis , Johanna M. Swan , Valluri R. Rao
Abstract: Embodiments of the invention include a waveguide structure that includes a first piezoelectric transducer that is positioned in proximity to a first end of a cavity of an organic substrate. The first piezoelectric transducer receives an input electrical signal and generates an acoustic wave to be transmitted with a transmission medium. A second piezoelectric transducer is positioned in proximity to a second end of the cavity. The second piezoelectric transducer receives the acoustic wave from the transmission medium and generates an output electrical signal.
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公开(公告)号：US10484120B2
公开(公告)日：2019-11-19
申请号：US15721868
申请日：2017-09-30
Applicant: Intel Corporation
Inventor： Sasha N. Oster , Georgios C. Dogiamis , Telesphor Kamgaing , Adel A. Elsherbini , Johanna M. Swan , Erich N. Ewy
Abstract: Embodiments include a wavelength selective communication system for use in vehicles. In an embodiment, the communication system may include a primary dielectric waveguide having a first cross-sectional area. In an embodiment, a coupling arm dielectric waveguide may be communicatively coupled to the primary dielectric waveguide. In an embodiment, the coupling arm has a second cross-sectional area that is smaller than or equal to the cross-sectional area of the first cross-sectional area. According to an embodiment, the coupling arm is communicatively coupled to the primary dielectric waveguide by a waveguide connector.
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38.发明授权公开(公告)号：US10477596B2
公开(公告)日：2019-11-12
申请号：US15748580
申请日：2015-11-23
Applicant: Intel Corporation
Inventor： Telesphor Kamgaing , Rahul Khanna
IPC: H04W76/10 , H01L23/66 , H01L23/00 , H01L25/065 , H01L25/16 , H01Q1/22 , H04B1/48 , H04Q1/02 , H05K7/14 , H01Q3/30 , H04B1/38
Abstract: A blade computing system is described with a wireless communication between blades. In one embodiment, the system includes a first blade in the enclosure having a radio transceiver to communicate with a radio transceiver of a second blade in the enclosure. The second blade has a radio transceiver to communicate with the radio transceiver of the first blade. A switch in the enclosure communicates with the first blade and the second blade and establishes a connection through the respective radio transceivers between the first blade and the second blade.
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39.发明授权公开(公告)号：US10304686B2
公开(公告)日：2019-05-28
申请号：US15476842
申请日：2017-03-31
Applicant: INTEL CORPORATION
Inventor： Sasha N. Oster , Fay Hua , Telesphor Kamgaing , Adel A. Elsherbini , Henning Braunisch , Johanna M. Swan
IPC: H01L21/4763 , H01L21/285 , H01L21/768 , H01L21/033 , B82Y40/00
Abstract: Embodiments include devices and methods, including a method for processing a substrate. The method includes providing a substrate including a first portion and a second portion, the first portion including a feature, the feature including an electrically conductive region, the second portion including a dielectric surface region. The method also includes performing self-assembled monolayer (SAM) assisted structuring plating to form a structure comprising a metal on the dielectric surface region, the feature being formed using a process other than the SAM assisted structuring plating used to form the structure, and the structure being formed after the feature. Other embodiments are described and claimed.
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40.发明授权公开(公告)号：US10291283B2
公开(公告)日：2019-05-14
申请号：US15088996
申请日：2016-04-01
Applicant: Intel Corporation
Inventor： Telesphor Kamgaing , Feras Eid , Adel A. Elsherbini , Georgios C. Dogiamis , Vijay K. Nair , Johanna M. Swan , Valluri R. Rao
Abstract: Embodiments of the invention include a tunable radio frequency (RF) communication module that includes a transmitting component having at least one tunable component and a receiving component having at least one tunable component. The tunable RF communication module includes at least one piezoelectric switching device coupled to at least one of the transmitting and receiving components. The at least one piezoelectric switching device is formed within an organic substrate having organic material and is designed to tune at least one tunable component of the tunable RF communication module.
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