Manufacturing method of a MEMS structure, a cantilever-type MEMS structure, and a sealed fluidic channel
    31.
    发明申请
    Manufacturing method of a MEMS structure, a cantilever-type MEMS structure, and a sealed fluidic channel 有权
    MEMS结构的制造方法,悬臂式MEMS结构和密封流体通道

    公开(公告)号:US20060166393A1

    公开(公告)日:2006-07-27

    申请号:US11301032

    申请日:2005-12-13

    IPC分类号: H01L21/00

    摘要: A method of manufacturing a MEMS structure including forming a porous layer having a predetermined thickness on the top surface of a substrate over an area where a cavity is to be formed; forming the cavity by etching the substrate below the porous layer; forming a membrane layer on the top surface to seal the cavity; and forming a structure on the upper side of the membrane layer. After forming a cantilever structure on the membrane layer and etching the membrane layer, a cantilever structure is produced in a floating state over the cavity. Also, at least one inlet hole and outlet hole can be formed in the porous layer and the membrane, thereby providing a sealed fluidic channel.

    摘要翻译: 一种制造MEMS结构的方法,包括在要形成空腔的区域上的衬底的顶表面上形成具有预定厚度的多孔层; 通过在多孔层下方蚀刻基底来形成空腔; 在顶表面上形成膜层以密封空腔; 并在膜层的上侧形成结构。 在膜层上形成悬臂结构并蚀刻膜层之后,在空腔上以悬浮状态产生悬臂结构。 此外,可以在多孔层和膜中形成至少一个入口孔和出口孔,从而提供密封的流体通道。

    Electrowetting device and method of manufacturing the same
    35.
    发明授权
    Electrowetting device and method of manufacturing the same 有权
    电动搅拌装置及其制造方法

    公开(公告)号:US09041999B2

    公开(公告)日:2015-05-26

    申请号:US13597986

    申请日:2012-08-29

    IPC分类号: G02B26/00

    CPC分类号: G02B26/005

    摘要: In one embodiment, the electrowetting device includes a first medium; a second medium that is not mixed with the first medium and has a refractive index different from a refractive index of the first medium; an upper electrode that adjusts an angle of a boundary surface between the first medium and the second medium; and a barrier wall that has a side surface surrounding the first and second mediums, allows the upper electrode to be disposed on a portion of the side surface, and has irregular widths.

    摘要翻译: 在一个实施例中,电润湿装置包括第一介质; 第二介质,其不与第一介质混合并且具有与第一介质的折射率不同的折射率; 上部电极,其调整所述第一介质和所述第二介质之间的边界面的角度; 并且具有围绕第一和第二介质的侧表面的阻挡壁允许上电极设置在侧表面的一部分上,并且具有不规则的宽度。

    Wafer level packaging cap and fabrication method thereof
    39.
    发明授权
    Wafer level packaging cap and fabrication method thereof 有权
    晶圆级封装盖及其制造方法

    公开(公告)号:US07528481B2

    公开(公告)日:2009-05-05

    申请号:US11491086

    申请日:2006-07-24

    IPC分类号: H01L23/12 H01L23/10

    摘要: A fabrication method of a wafer level packaging cap for covering a device wafer provided with a device thereon, includes forming an insulating layer on a wafer; removing a predetermined part of the insulating layer and exposing an upper surface of the wafer; forming a cap pad extending from an upper surface and the exposed surface of the wafer; forming a cavity on a lower surface of the wafer corresponding to the cap pad; etching a bottom surface of the cavity and exposing the cap pad which is connected to the wafer through the cavity; and forming metal lines extending from the lower surface of the wafer and the cavity, to electrically connect the cap pad which is exposed through the cavity.

    摘要翻译: 一种用于覆盖其上具有器件的器件晶片的晶片级封装帽的制造方法,包括在晶片上形成绝缘层; 去除所述绝缘层的预定部分并暴露所述晶片的上表面; 形成从所述晶片的上表面和所述暴露表面延伸的盖焊盘; 在与所述盖垫对应的所述晶片的下表面上形成空腔; 蚀刻空腔的底表面并暴露通过空腔连接到晶片的盖垫; 以及形成从所述晶片的下表面和所述腔延伸的金属线,以电连接通过所述空腔暴露的所述盖垫。