公开(公告)号：US11798950B2

公开(公告)日：2023-10-24

申请号：US17119077

申请日：2020-12-11

Applicant: Japan Display Inc.

Inventor： Hiroshi Kawanago ,  Kazufumi Watabe

IPC: H01L27/12 ,  H10K59/12 ,  H10K77/10 ,  H10K102/00 ,  H10K50/00 ,  G02F1/1333 ,  G09F9/30 ,  H10K71/80

CPC classification number: H01L27/1218 ,  G02F1/133305 ,  G02F2202/28 ,  H01L27/1262 ,  H10K59/12 ,  H10K59/1201 ,  H10K71/80 ,  H10K77/111

Abstract: The purpose of the present invention is to prevent forming of soot like black substance on the back of the TFT substrate of resin during laser ablation to separate the glass substrate from the TFT substrate. The present invention takes the following structure to counter measure the above problem. A display device having pixels formed on a first surface of the resin substrate including: a first layer, formed from nitride, being formed on a second surface of the resin substrate, the second surface being an opposite surface to the first surface, in which a second layer, which is a separation layer, is formed on the first layer.

公开(公告)号：US11742430B2

公开(公告)日：2023-08-29

申请号：US17347630

申请日：2021-06-15

Applicant: Japan Display Inc.

Inventor： Yohei Yamaguchi ,  Kazufumi Watabe ,  Tomoyuki Ariyoshi ,  Osamu Karikome ,  Ryohei Takaya

IPC: H01L29/786 ,  H01L27/12 ,  H01L29/49 ,  H01L29/45 ,  H01L29/423 ,  H01L29/40

CPC classification number: H01L29/7869 ,  H01L27/124 ,  H01L27/1214 ,  H01L27/1225 ,  H01L27/1248 ,  H01L29/401 ,  H01L29/42384 ,  H01L29/45 ,  H01L29/4908

Abstract: The invention allows stable fabrication of a TFT circuit board used in a display device and having thereon an oxide semiconductor TFT. A TFT circuit board includes a TFT that includes an oxide semiconductor. The TFT has a gate insulating film formed on part of the oxide semiconductor and a gate electrode formed on the gate insulating film. A portion of the oxide semiconductor that is covered with the gate electrode 104 and a portion of the oxide semiconductor that is not covered with the gate electrode are both covered with a first interlayer insulating film. The first interlayer insulating film is covered with a first film 106, and the first film is covered with a first AlO film.

公开(公告)号：US11063154B2

公开(公告)日：2021-07-13

申请号：US15649126

申请日：2017-07-13

Applicant: Japan Display Inc.

Inventor： Yohei Yamaguchi ,  Kazufumi Watabe ,  Tomoyuki Ariyoshi ,  Osamu Karikome ,  Ryohei Takaya

IPC: H01L29/786 ,  H01L27/12 ,  H01L29/45 ,  H01L29/49 ,  H01L29/423 ,  H01L29/40

Abstract: The invention allows stable fabrication of a TFT circuit board used in a display device and having thereon an oxide semiconductor TFT. A TFT circuit board includes a TFT that includes an oxide semiconductor. The TFT has a gate insulating film formed on part of the oxide semiconductor and a gate electrode formed on the gate insulating film. A portion of the oxide semiconductor that is covered with the gate electrode 104 and a portion of the oxide semiconductor that is not covered with the gate electrode are both covered with a first interlayer insulating film. The first interlayer insulating film is covered with a first film 106, and the first film is covered with a first AlO film.

公开(公告)号：US11056514B2

公开(公告)日：2021-07-06

申请号：US15659796

申请日：2017-07-26

Applicant: Japan Display Inc.

Inventor： Yoshinori Ishii ,  Kazufumi Watabe ,  Hidekazu Miyake

IPC: H01L27/12 ,  G02F1/13 ,  G02F1/1333 ,  G02F1/1362 ,  G02F1/1368 ,  H01L27/32 ,  H01L51/52 ,  H01L51/56 ,  G02F1/1343

Abstract: Separation of wirings formed on an organic passivation film is prevented in an organic EL display device or a liquid crystal display device. The organic EL display device includes a TFT formed on a substrate and an organic passivation film formed to cover the TFT. An intermediate film containing SiO or SiN is formed to cover the organic passivation film. An insulation film formed with an organic material is formed on the intermediate film. A reflective electrode is formed on the intermediate film. The reflective electrode is connected to the TFT via a through-hole formed in the organic passivation film and a through-hole formed in the intermediate film.

公开(公告)号：US10886469B2

公开(公告)日：2021-01-05

申请号：US16701821

申请日：2019-12-03

Applicant: Japan Display Inc.

Inventor： Hiroshi Kawanago ,  Kazufumi Watabe

IPC: H01L27/32 ,  H01L51/00 ,  H05B33/10 ,  H05B33/12 ,  H05B45/00 ,  H01L51/52

Abstract: A method of manufacturing a display device, including: a stacking step of stacking, on a glass substrate, a sacrificial resin layer, a metal layer, a transparent metal oxide layer, a base material resin layer, and a functional layer including at least one of a pixel circuit-constituting layer driving a plurality of pixels and a color filter layer, in this order; a radiating step of radiating a pulsed light of a xenon flash lamp to the metal layer through the glass substrate and the sacrificial resin layer; and a detaching step of reducing a force of adhesion between the sacrificial resin layer and the metal layer with the pulsed light radiated in the radiating step, and detaching the sacrificial resin layer from the metal layer.

公开(公告)号：US10403652B2

公开(公告)日：2019-09-03

申请号：US15661086

申请日：2017-07-27

Applicant: Japan Display Inc.

Inventor： Yoshinori Ishii ,  Kazufumi Watabe ,  Hidekazu Miyake

IPC: H01L27/12 ,  H01L33/00 ,  H01L29/786 ,  G02F1/13 ,  G02F1/1333 ,  G02F1/1368 ,  H01L27/32 ,  H01L51/52 ,  G02F1/1362

Abstract: An organic EL display device has a semiconductor circuit substrate comprising a TFT and an organic passivation layer thereon. An AlO layer is formed over the organic passivation layer, and an electrode layer is formed on the AlO layer. The electrode layer connects with TFT via a through hole formed in the AlO layer and in the organic passivation layer.

公开(公告)号：US10115774B2

公开(公告)日：2018-10-30

申请号：US15242799

申请日：2016-08-22

Applicant: Japan Display Inc.

Inventor： Takeshi Kuriyagawa ,  Kazufumi Watabe

IPC: H01L51/52 ,  H01L27/32

Abstract: A base body including a plurality of first regions and a second region having a shape surrounding each of the first regions is prepared. A resin layer is formed in the plurality of first regions while avoiding the second region. A buried layer having a moisture-proof property higher than the resin layer is formed in the second region. A functional layer including a self-emitting element layer emitting light whose luminance is controlled for each of a plurality of unit pixels constituting an image is formed on the resin layer and the buried layer. The buried layer and the functional layer are cut along a line passing through the second region, so as to separate the resin layer into a plurality of portions respectively corresponding to the plurality of first regions.

公开(公告)号：US10115740B2

公开(公告)日：2018-10-30

申请号：US15405511

申请日：2017-01-13

Applicant: Japan Display Inc.

Inventor： Akihiro Hanada ,  Hajime Watakabe ,  Kazufumi Watabe

IPC: H01L29/12 ,  H01L29/40 ,  H01L23/48 ,  H01L27/12 ,  H01L29/423 ,  H01L29/51 ,  H01L29/786

Abstract: According to one embodiment, a semiconductor device includes an insulating substrate, a first semiconductor layer formed of silicon and positioned above the insulating substrate, a second semiconductor layer formed of a metal oxide and positioned above the first semiconductor layer, a first insulating film formed of a silicon nitride and positioned between the first semiconductor layer and the second semiconductor layer, and a block layer positioned between the first semiconductor film and the second semiconductor layer, the block layer hydrogen diffusion of which is lower than that of the first insulating film.

公开(公告)号：US09978989B2

公开(公告)日：2018-05-22

申请号：US15229629

申请日：2016-08-05

Applicant: Japan Display Inc.

Inventor： Kazufumi Watabe ,  Hiroshi Kawanago ,  Manabu Yamashita ,  Hideaki Ishige

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/00 ,  H01L51/56

CPC classification number: H01L51/5253 ,  H01L27/3244 ,  H01L51/003 ,  H01L51/5203 ,  H01L51/56 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/566

Abstract: First rib layers made of an inorganic material are formed in first frame regions of a first glass substrate. First resin layers are formed in first product regions after the first rib layers are formed. First functional layers which include light emitting element layers as a result of luminance of each of unit pixels forming an image being controlled and sealing layers covering the light emitting element layers are formed on the first rib layers and the first resin layers. The first rib layers and the first functional layers are cut along lines passing through the first frame regions while avoiding the first product regions in order to separate the first product regions from each other. In the step of cutting the first rib layers and the first functional layers, the first rib layers and the sealing layers are cut.

公开(公告)号：US09960317B2

公开(公告)日：2018-05-01

申请号：US15630243

申请日：2017-06-22

Applicant: Japan Display Inc.

Inventor： Kenji Toribatake ,  Kazufumi Watabe

IPC: H01L33/52 ,  H01L23/544 ,  H01L33/00

CPC classification number: H01L33/0095 ,  H01L23/544 ,  H01L33/52 ,  H01L51/50 ,  H01L2223/54426

Abstract: A lamination includes a sheet substrate and a display element layer. The sheet substrate includes a plurality of product regions cut out into a plurality of products and a blank region surrounding the product regions. The display element layer is formed on each of a plurality of display areas placed on each of the plurality of product regions for displaying an image. The sheet substrate adheres to a top of a substrate. The substrate has light transmissivity. A protective film is adhered to the lamination so as to cover the display areas. A divider line is formed in a blank region that surrounds the product regions by removing a portion of the lamination. The substrate is removed from the sheet substrate by irradiating the sheet substrate with a laser beam.