摘要:
An exposure apparatus of a large-substrate single scan-exposure type by which a mask mark and a plate mark are two-dimensionally scanned in relatively narrow respective scan areas at the same time to effect highly accurate alignment. In the present invention, a first substrate and a second substrate are relatively moved in a predetermined direction with respect to a projection optical system, while an image of a pattern formed in the first substrate projectively impinges on the second substrate by way of the projection optical system. The projection optical system comprises a plurality of projection optical units arranged in a direction orthogonal to the scanning direction in order to form, on the second substrate, a same-magnification erected image of the pattern formed on the first substrate. The exposure apparatus has an alignment means for detecting a first mark formed on the first substrate and a second mark formed on the second substrate by optical scanning so as to measure a positional deviation between the first substrate and the second substrate.
摘要:
In an alignment method an apparatus for scanning an alignment mark formed on a substrate with a beam of light, and detecting the position of the alignment mark on the basis of a signal conforming to reflected light obtained from the alignment mark, a dummy mark of the same shape as the alignment mark is formed near the alignment mark formed on the substrate, the dummy mark and the alignment mark are continuously scanned by the beam of light, and during the time from after the beam of light has scanned the dummy mark until the scanning of the alignment mark is started, the intensity (signal level) of a first signal obtained in conformity with reflected light reflected by the dummy mark is found to thereby calculate the amplification factor of the signal, and during the scanning of the alignment mark, a second signal obtained in conformity with reflected Light reflected from the alignment mark is amplified with this amplification factor, and the position of the alignment mark is detected on the basis of the amplified second signal.
摘要:
The display element manufacturing apparatus has a transporting part, which transports a substrate in a first direction, a first alignment system, which detects fiducial marks, a second alignment system, which is arranged at a prescribed distance from the first alignment system in the first direction and detects fiducial marks, calculating parts, which detect the fiducial marks and calculate the expansion/contraction of the substrate in the first direction or the transport speed of the substrate, and a processing part, which processes a prescribed position of the substrate based on at least one of the expansion/contraction of the substrate in the first direction or the transport speed of the substrate and the fiducial marks.
摘要:
A method for exposing a substrate includes arranging, in a direction, pattern areas to projection systems respectively arranged at an interval and each having a magnifying magnification, the pattern areas having area widths each smaller than the interval and greater than a width obtained by dividing an exposure width of the projection system by the magnifying magnification; and successively transferring onto the substrate an image, projected by an associated projection system, of a first pattern provided in a first partial pattern area in each pattern area and an image, projected by the associated projection system, of a second pattern provided in a second partial pattern area in each pattern area and having at least a partial area different from the first partial pattern area in the direction in each pattern area. The occurrence of any stitch error is suppressed and the transfer accuracy is improved.
摘要:
A method for exposing a substrate includes arranging, in a direction, pattern areas to projection systems respectively arranged at an interval and each having a magnifying magnification, the pattern areas having area widths each smaller than the interval and greater than a width obtained by dividing an exposure width of the projection system by the magnifying magnification; and successively transferring onto the substrate an image, projected by an associated projection system, of a first pattern provided in a first partial pattern area in each pattern area and an image, projected by the associated projection system, of a second pattern provided in a second partial pattern area in each pattern area and having at least a partial area different from the first partial pattern area in the direction in each pattern area. The occurrence of any stitch error is suppressed and the transfer accuracy is improved.
摘要:
A method for fabricating a display device including forming a standard mark in a flexible substrate fed in a first direction, forming a partition wall in the flexible substrate, and forming an electrode by applying a conductive member at a predetermined position between the partition walls by an applicator based on the standard mark. An apparatus is provided that includes a transportation unit to transport a flexible substrate in a first direction, a mark formation unit to form a standard mark in the flexible substrate, a partition wall formation unit to form a partition wall in the flexible substrate, and an application unit to apply a conductive member to a predetermined position between the partition walls based on the standard mark. A display device is provided that includes a flexible substrate, a partition wall formed by pressing the flexible substrate, and an electrode formed by application between the partition walls.
摘要:
An exposure apparatus and methods for making and using the same. The exposure apparatus includes at least one projection optical system which projects illuminating light, a substrate stage which supports a substrate to be exposed by the illuminating light and which includes a first plurality of reference marks. The exposure apparatus also includes a mask stage which supports a mask that includes a mask pattern to be projected onto the substrate by at least one projection optical system. The mask further includes a second plurality of reference marks intended to correspond to the first plurality of reference marks. The second plurality of reference marks is integrally formed with the mask pattern. The projection optical system(s) project illuminating light based on the mask pattern and the second plurality of reference marks to produce a projected image corresponding to the mask pattern and a plurality of projected images corresponding to the second plurality of reference marks. The exposure apparatus also includes an adjustment mechanism which adjusts the position of the projected image on the substrate based on a plurality of positional relationships between the plurality of projected images and the first plurality of reference marks.
摘要:
A substrate coated with a photosensitive agent is exposed to light beams passing through a mask by projecting the light beams upon the substrate through a projection optical system, on which occasion areas having a large layer thickness of the photosensitive agent on the substrate are subjected to double exposures, i.e., the exposure through the projection optical system and an exposure through an optical system different therefrom.
摘要:
Disclosed is a projection exposure method for transferring a pattern formed on a mask onto a photosensitive substrate through a projection optical system. A light beam having a first wavelength for exposure is radiated through the projection optical system onto a first mark area including a fiducial mark on a fiducial plate installed on a substrate stage, reflected light from the first mark area is detected to obtain a position of the fiducial mark. A light beam having a second wavelength to which the photosensitive substrate is not photosensitive is radiated through the projection optical system onto the first mark area, reflected light from the first mark area is detected to obtain a position of the fiducial mark. A positional discrepancy of the fiducial mark caused by the difference in wavelength between the first and second wavelengths is previously calculated on the basis of results of the detection. The light beam having the second wavelength is radiated through the projection optical system onto an alignment mark on the photosensitive substrate, reflected light therefrom is detected to obtain a position of the photosensitive substrate under the light beam having the second wavelength. A positional discrepancy of the photosensitive substrate is corrected on the basis of a result of the detection and the calculation, and thus positional alignment for the photosensitive substrate is performed, followed by actual exposure.