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公开(公告)号：US07695347B2
公开(公告)日：2010-04-13
申请号：US10493494
申请日：2002-10-25
申请人： Hisashi Masumura , Kazuya Tomii , Shigenao Ito , Kenichi Anzai , Kenichi Inoue
发明人： Hisashi Masumura , Kazuya Tomii , Shigenao Ito , Kenichi Anzai , Kenichi Inoue
CPC分类号： H01L21/02024 , B24B37/042 , B24B37/24 , Y10T428/249955
摘要： A method for polishing a wafer effectively preventing a sag in an outer peripheral portion of a wafer and a polishing pad for polishing a wafer preferably used in the method for polishing a wafer are provided. The method for polishing a wafer comprises the step of: mirror-polishing a wafer with a main surface of the wafer being in contact with a polishing pad of non-woven fabric impregnated with resin, wherein a ratio of surface roughness of the polishing pad to compressibility thereof {surface roughness Ra (μm)/compressibility (%)} is 3.8 or more.
摘要翻译： 提供了用于抛光晶片的方法，其有效地防止晶片的外周部分的下垂以及用于抛光晶片的抛光垫的抛光垫。 抛光晶片的方法包括以下步骤：将晶片的主表面与浸渍有树脂的无纺织物的抛光垫接触的晶片进行镜面抛光，其中抛光垫的表面粗糙度与 （表面粗糙度Ra（μm）/压缩率（％））为3.8以上。
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32.发明申请Polishing Head, Polishing Apparatus and Polishing Method for Semiconductor Wafer 有权半导体晶圆抛光头，抛光装置和抛光方法公开(公告)号：US20080254720A1
公开(公告)日：2008-10-16
申请号：US11884833
申请日：2006-03-01
申请人： Hiromasa Hashimoto , Yasuharu Ariga , Hisashi Masumura , Kouzi Kitagawa , Toshimasa Kubota , Takahiro Matsuda
发明人： Hiromasa Hashimoto , Yasuharu Ariga , Hisashi Masumura , Kouzi Kitagawa , Toshimasa Kubota , Takahiro Matsuda
IPC分类号： B24B29/00 , B24B9/00 , H01L21/302
CPC分类号： B24B37/30
摘要： The present invention provides a polishing head 1 comprising a carrier 3, a guide ring 4, a dress ring 5, and a head body 2, wherein the head body 2 is rotatable, and holds the carrier 3, the guide ring 4, and the dress ring 5; the head body 2 has a reversed-bowl shape and has a hollow 8; the dress ring, and at least the guide ring or the carrier are held by being coupled to a lower brim of the head body via a diaphragm 6; the hollow of the head body is sealed. During polishing, the pressure of the sealed hollow is adjusted with a pressure regulating mechanism 9 communicating with the hollow, thereby elastically deforming the diaphragm. As a result, a wafer W can be polished while the wafer and the dress ring are pressed with a given pressing force against a polishing pad 11 on a turn table 12 with rotating the wafer held by the carrier and the dress ring. Consequently, there is provided a polishing head or the like with which excessive polishing in the outer periphery of a semiconductor wafer can be prevented and generation of impressions or scratches in the edge portion of the wafer can be prevented effectively.
摘要翻译： 本发明提供了一种抛光头1，其包括载体3，导向环4，连接环5和头部主体2，其中头部主体2可旋转，并且保持载体3，导向环4和 连衣裙5; 头体2具有倒碗形状并具有中空部8; 连接环，并且至少导向环或载体通过隔膜6联接到头本体的下边缘; 头体的中空被密封。 在抛光期间，通过与中空部连通的压力调节机构9来调节密封空心的压力，从而使隔膜弹性变形。 结果，晶片W可以被抛光，同时通过旋转由载体和连接环保持的晶片，在给定的压力下对转台12上的抛光垫11施加压力。 因此，提供了可以防止在半导体晶片的外周中进行过度抛光并且可以有效地防止在晶片的边缘部分产生印模或划痕的抛光头等。
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33.发明授权Polishing pad, polishing method, and polishing machine for mirror-polishing semiconductor wafers 失效抛光垫，抛光方法和用于镜面抛光半导体晶片的抛光机公开(公告)号：US06306021B1
公开(公告)日：2001-10-23
申请号：US09237881
申请日：1999-01-27
IPC分类号： B24B500
摘要： There is disclosed a polishing pad for mirror-polishing a semiconductor wafer, especially in a finish polishing process, by use of a polishing machine which includes a turn table on which a polishing pad is attached, a unit for feeding a polishing agent onto a surface of the polishing pad, and a mechanism for pressing a semiconductor wafer onto the surface of the polishing pad. The polishing pad includes a top layer formed of a porous soft material, a bottom layer formed of a rubber elastomer, and an intermediate layer formed of a hard plastic sheet. The hard plastic sheet is disposed between the top layer and the bottom layer and is bonded to the bottom layer. In the polishing pad, undulation produced in the bottom layer due to a horizontal force generated during polishing is prevented from being transferred to the top layer of the polishing pad, and unevenness in polishing stock removal stemming from warpage or undulation of a wafer itself can be mitigated.
摘要翻译： 公开了一种用于对半导体晶片进行镜面抛光的抛光垫，特别是在精抛光工艺中，通过使用抛光机，该抛光机包括其上安装有抛光垫的转台，用于将抛光剂供给到表面上的单元 的抛光垫，以及用于将半导体晶片压到抛光垫的表面上的机构。 抛光垫包括由多孔软质材料形成的顶层，由橡胶弹性体形成的底层和由硬塑料片形成的中间层。 硬塑料片设置在顶层和底层之间并结合到底层。 在抛光垫中，由于抛光期间产生的水平力，底层产生的波动被转移到抛光垫的顶层，并且由晶片本身的翘曲或起伏引起的抛光原料去除的不均匀性可以是 缓解
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公开(公告)号：US6135854A
公开(公告)日：2000-10-24
申请号：US233852
申请日：1999-01-19
CPC分类号： B24B49/12 , B24B37/08 , B24B37/345
摘要： An automatic workpiece transport apparatus for a double-side polishing machine is disclosed. A carrier is positioned at a predetermined position by a positioning unit, and an image of the top surface of the carrier is captured by use of a visual sensor. A computer performs image processing to obtain the center coordinates of the wafers or the workpiece holders while reference marks or the like provided on the carrier are used as references. The transport robot is moved and controlled based on the thus-detected coordinate data in order to load the wafers into the workpiece holders or to unload the wafers from the workpiece holders. Further, two visual sensors are provided at the tip end of the arm of the transport robot. These visual sensors send to the computer an image of the peripheral portion of the held wafer. Thus, the computer performs fine adjustment in positioning the wafer and the workpiece. The automatic workpiece transport apparatus can reliably load and unload semiconductor wafers to and from the carrier that holds semiconductor substrates.
摘要翻译： 公开了一种用于双面抛光机的自动工件输送装置。 载体通过定位单元定位在预定位置，并且通过使用视觉传感器捕获载体的顶表面的图像。 计算机执行图像处理以获得晶片或工件保持器的中心坐标，而使用设置在载体上的参考标记等作为参考。 基于由此检测的坐标数据来移动和控制传送机器人，以便将晶片加载到工件保持器中或者从工件保持器卸载晶片。 此外，在运输机器人的臂的末端设置有两个视觉传感器。 这些视觉传感器向计算机发送保持的晶片的周边部分的图像。 因此，计算机在定位晶片和工件时进行微调。 自动工件传送装置可以可靠地将半导体晶片装载到保持半导体衬底的载体上和从载体卸载半导体晶片。
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35.发明授权
公开(公告)号：US06120353A
公开(公告)日：2000-09-19
申请号：US248993
申请日：1999-02-12
申请人： Kiyoshi Suzuki , Hisashi Masumura , Teruaki Fukami
发明人： Kiyoshi Suzuki , Hisashi Masumura , Teruaki Fukami
CPC分类号： B24B37/24
摘要： In a polishing method for a semiconductor wafer in which polishing slurry is interposed between the semiconductor wafer and a polishing pad and the semiconductor wafer is mirror-polished by a polishing step for planarization, when polishing is conducted using a suede-like foam urethane resin polishing pad having physical properties of low compressibility lower than 9 % and high pore density equal to or higher than about 150 pores/cm.sup.2 as the polishing pad used in the polishing step, a mirror silicon wafer with good surface roughness of 50 bits in haze can be manufactured.
摘要翻译： 在将半导体晶片插入在半导体晶片和研磨垫之间的半导体晶片的研磨方法中，通过用于平坦化的研磨工序对半导体晶片进行镜面抛光，在使用麂皮状泡沫聚氨酯树脂研磨 作为抛光步骤中使用的抛光垫，其具有低压缩率低于9％和高孔密度等于或高于约150孔/ cm 2的物理性能的垫可以是具有50位雾度的良好表面粗糙度的镜面硅晶片 制造。
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公开(公告)号：US5790252A
公开(公告)日：1998-08-04
申请号：US720065
申请日：1996-09-27
申请人： Hisashi Masumura , Hideo Kudo , Shingo Sumie , Hidetoshi Tsunaki , Yuji Hirao , Noritaka Morioka
发明人： Hisashi Masumura , Hideo Kudo , Shingo Sumie , Hidetoshi Tsunaki , Yuji Hirao , Noritaka Morioka
CPC分类号： H01L22/12
摘要： The invention seeks to permit evaluation of edge portion of like inclined surfaces of wafer with high accuracy without the conventional destruction process based on the selective etching process but with the contact-free, non-destructive and high accuracy optical acoustical process. To this end, the invention features determination of residual damages as crystal damages caused to wafer edge in an optical acoustical process, which comprises the steps of causing a measurement probe to face each of three exciting laser beam irradiation points on upper and lower inclined surfaces and at an accurate end of an edge portion of a semiconductor wafer, and determining a thermal response induced by the exciting laser beam by a laser interference process.
摘要翻译： 本发明试图允许以高精度评估晶片的倾斜表面的边缘部分，而不需要基于选择性蚀刻工艺的常规的破坏过程，而是利用无接触的非破坏性和高精度的光学声学过程。 为此，本发明的特征在于确定作为在光学声学过程中对晶片边缘引起的晶体损伤的残余损伤，其包括以下步骤：使测量探针面对上和下倾斜表面上的三个激发激光束照射点中的每一个， 在半导体晶片的边缘部分的精确端处，并且通过激光干涉处理确定由激发激光束引起的热响应。
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公开(公告)号：US20140113531A1
公开(公告)日：2014-04-24
申请号：US14123629
申请日：2012-05-31
申请人： Hisashi Masumura
发明人： Hisashi Masumura
IPC分类号： B24B37/32
摘要： A polishing head comprising an annular rigid ring; a rubber film attached to the rigid ring by using uniform tensile force; a back plate that is connected to the rigid ring and forms a space portion with the rubber film and the rigid ring; and an annular template that is provided at a peripheral portion of a lower surface portion of the rubber film concentrically with the rigid ring and configured to hold an edge portion of a workpiece, the polishing head holding a back surface of the workpiece on the lower surface portion of the rubber film and sliding a front surface of the workpiece on a polishing pad attached to a turn table to perform polishing. The polishing head and the polishing apparatus can be used for final polishing and uniformly polish the entire front surface regardless of the thickness of the template.
摘要翻译： 一种抛光头，包括环形刚性环; 通过使用均匀的拉力附着在刚性环上的橡胶膜; 背板，其连接到刚性环并与橡胶膜和刚性环形成空间部分; 以及环形模板，其设置在所述橡胶膜的下表面部分的周边部分，与所述刚性环同心并且构造成保持工件的边缘部分，所述抛光头将工件的后表面保持在下表面 橡胶膜的一部分，并将工件的前表面滑动到安装在转台上的抛光垫上，以进行抛光。 研磨头和抛光装置可以用于最终抛光，并且均匀地抛光整个前表面，而与模板的厚度无关。
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公开(公告)号：US08636561B2
公开(公告)日：2014-01-28
申请号：US13056249
申请日：2009-08-07
IPC分类号： B24B37/04 , H01L21/304
CPC分类号： B24B37/30
摘要： A polishing head for holding a workpiece when a surface of the workpiece is polished and a polishing apparatus provided with the polishing head, and more particularly a polishing head for holding the workpiece on a rubber film and a polishing apparatus provided with the polishing head. The polishing head and the polishing apparatus provided with the polishing head that can adjust the polishing profile on the basis of the shape of the workpiece before polishing and can stably obtain good flatness.
摘要翻译： 抛光工件的抛光头，抛光工件的表面和设置有抛光头的抛光装置，特别是用于将工件保持在橡胶膜上的抛光头和设置有抛光头的抛光装置。 抛光头和抛光装置具有抛光头，该抛光头可以在研磨前基于工件的形状调节抛光轮廓并且可以稳定地获得良好的平坦度。
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公开(公告)号：US20110136414A1
公开(公告)日：2011-06-09
申请号：US13056249
申请日：2009-08-07
IPC分类号： B24B37/04 , H01L21/304 , B24B37/00
CPC分类号： B24B37/30
摘要： A polishing head for holding a workpiece when a surface of the workpiece is polished and a polishing apparatus provided with the polishing head, and more particularly a polishing head for holding the workpiece on a rubber film and a polishing apparatus provided with the polishing head. The polishing head and the polishing apparatus provided with the polishing head that can adjust the polishing profile on the basis of the shape of the workpiece before polishing and can stably obtain good flatness.
摘要翻译： 抛光工件的抛光头，抛光工件的表面和设置有抛光头的抛光装置，特别是用于将工件保持在橡胶膜上的抛光头和设置有抛光头的抛光装置。 抛光头和抛光装置具有抛光头，该抛光头可以在研磨前基于工件的形状调节抛光轮廓并且可以稳定地获得良好的平坦度。
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公开(公告)号：US20100233945A1
公开(公告)日：2010-09-16
申请号：US12734119
申请日：2007-11-21
CPC分类号： B24B37/30 , B24B37/345 , Y10T29/49826
摘要： A polishing head having a disklike carrier in which an annular projecting portion and a carrier-engagement portion are formed in a peripheral portion, a disklike head body in which a head-body-engagement portion is formed outside, a diaphragm for connecting the head body with the carrier, a spacer located between the carrier-engagement portion and the head-body-engagement portion in a part of the carrier-engagement portion and/or the head-body-engagement portion, in which the spacer abuts on the carrier-engagement portion and/or the head-body-engagement portion at the time of lifting the head body so that the workpiece is demounted from the polishing pad by lifting the carrier with it inclined. As a result, there is provided a polishing head in which the workpiece can be easily, safely and surely demounted from the polishing pad by lifting the polishing head holding the workpiece without overhanging the polishing head from the turn table and the like.
摘要翻译： 一种抛光头，其具有圆盘状载体，其中环形突出部分和载体接合部分形成在周边部分中，盘状头体，其中头部体接合部分形成在外部;光阑，用于连接头部主体 在载体接合部分和头部本体接合部分之间的间隔件位于载体接合部分和/或头部本体接合部分的一部分中，间隔件邻接在载体接合部分上， 在抬起头部本体时使接合部和/或头体接合部通过使其倾斜地抬起托架而使抛光垫从抛光垫上拆下。 结果，提供了一种研磨头，其中通过提起保持工件的抛光头而不会使抛光头从转台等悬垂，从而可以从抛光垫容易地，安全地和可靠地拆卸工件。
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