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162 条记录 (耗时 0.045 秒)

    Polishing apparatus
    33.
    发明授权
    Polishing apparatus 失效
    抛光设备

    公开(公告)号：US06358131B1

    公开(公告)日：2002-03-19

    申请号：US09625490

    申请日：2000-07-25

    申请人： Kunihiko Sakurai ,  Satoshi Wakabayashi ,  Tetsuji Togawa

    发明人： Kunihiko Sakurai ,  Satoshi Wakabayashi ,  Tetsuji Togawa

    IPC分类号： B24B500

    CPC分类号： B24B37/345 ,  B24B41/061

    摘要： The present invention provides a polishing apparatus comprising a polishing table having a polishing surface, a substrate carrier having an axis about which the substrate carrier is rotatable. The substrate carrier includes a plurality of substrate holders positioned around a circle about the axis of the substrate carrier and spaced apart from each other at equal angular distances, with each of the substrate holders being adapted to hold a substrate and bring it into contact with the polishing surface. The apparatus further comprises a substrate loading device laterally spaced apart from the polishing table, in which device a substrate is picked up by one of the substrate holders which is positioned at the substrate loading device, and a substrate unloading device laterally spaced apart from the polishing table, in which device one of the substrate holders which is positioned at the substrate unloading device releases a wafer onto the unloading device. The substrate carrier is indexably rotated about the stated axis in such a manner that one of the substrate holders is selectively positioned at the loading device, while another substrate holder is positioned at the unloading device and at least one of the other substrate holders is positioned over the polishing surface.

    摘要翻译： 本发明提供了一种抛光装置，其包括具有抛光表面的抛光台，具有基板载体可旋转的轴线的基板载体。 衬底载体包括多个衬底保持器，其围绕衬底载体的轴线围绕圆周定位，并以相等的角距彼此间隔开，衬底保持器中的每一个适于保持衬底并使其与 抛光面。 该装置还包括与抛光台横向间隔开的衬底加载装置，其中衬底被位于衬底装载装置的衬底保持器中的一个拾取，以及与抛光件横向间隔开的衬底卸载装置 工作台，其中位于衬底卸载装置的衬底保持器之一的装置将晶片释放到卸载装置上。 衬底载体可以以所述轴线可转动地旋转，使得衬底保持器中的一个选择性地定位在加载装置处，而另一衬底保持器定位在卸载装置处，并且至少一个衬底保持器位于 抛光面。

    Polishing apparatus having robotic transport apparatus
    35.
    发明授权
    Polishing apparatus having robotic transport apparatus 失效
    具有机器人输送装置的抛光装置

    公开(公告)号：US5893794A

    公开(公告)日：1999-04-13

    申请号：US808690

    申请日：1997-02-28

    申请人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Kunihiko Sakurai

    发明人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Kunihiko Sakurai

    IPC分类号： B65G49/07 ,  H01L21/677 ,  H01L21/687 ,  B24B7/06

    CPC分类号： H01L21/67766 ,  H01L21/68707 ,  Y10S451/914

    摘要： A robotic transport apparatus is capable of providing an effective waterproofing function of working components without using mechanical seals. The robotic transport apparatus includes a robot body, an arm assembly extendably attached to the robot body, and a workpiece holding section attached to the arm assembly. A pan member for waterproofing of the robot body is provided above the robot body and has an area not smaller than the workpiece holding section.

    摘要翻译： 机器人运输装置能够在不使用机械密封的情况下提供工作部件的有效防水功能。 机器人运输装置包括机器人主体，可伸缩地附接到机器人主体的臂组件和附接到臂组件的工件保持部。 机器人主体的防水盘构件设置在机器人主体的上方，具有不小于工件保持部的面积。

    Substrate holding apparatus
    36.
    发明授权
    Substrate holding apparatus 有权
    基板保持装置

    公开(公告)号：US07850509B2

    公开(公告)日：2010-12-14

    申请号：US12285936

    申请日：2008-10-16

    申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    IPC分类号： B24B7/22

    CPC分类号： B24B37/30 ,  B24B41/061

    摘要： The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

    摘要翻译： 本发明涉及一种用于将基板保持并压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体，用于接触基板的弹性垫和用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于接触弹性垫的弹性膜。 第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。

    Substrate holding apparatus and polishing apparatus
    38.
    发明授权
    Substrate holding apparatus and polishing apparatus 有权
    基板保持装置和抛光装置

    公开(公告)号：US07311585B2

    公开(公告)日：2007-12-25

    申请号：US11312571

    申请日：2005-12-21

    申请人： Tetsuji Togawa ,  Osamu Nabeya ,  Makoto Fukushima ,  Kunihiko Sakurai ,  Hiroshi Yoshida ,  Teruhiko Ichimura

    发明人： Tetsuji Togawa ,  Osamu Nabeya ,  Makoto Fukushima ,  Kunihiko Sakurai ,  Hiroshi Yoshida ,  Teruhiko Ichimura

    IPC分类号： B24B1/00

    CPC分类号： B24B37/30 ,  B24B41/061 ,  B24B49/105

    摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.

    摘要翻译： 本发明涉及一种用于将基板（例如半导体晶片）保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。 根据本发明的基板保持装置包括其中具有容纳空间的顶环主体和可在顶环体中的容纳空间内垂直移动的可垂直移动的构件。 具有弹性膜的邻接构件附接到可垂直移动构件的下表面。 邻接构件的弹性膜包括邻接部分，其具有向外突出的凸缘，与基底直接或间接接触;以及连接部分，其从邻接部分的凸缘的基部向上延伸并连接到 垂直活动件。 连接部由具有高于邻接部的材料的柔软性的材料制成。

    Polishing apparatus
    39.
    发明授权
    Polishing apparatus 有权
    抛光设备

    公开(公告)号：US06942541B2

    公开(公告)日：2005-09-13

    申请号：US09922776

    申请日：2001-08-07

    申请人： Tetsuji Togawa ,  Kunihiko Sakurai ,  Ritsuo Kikuta

    发明人： Tetsuji Togawa ,  Kunihiko Sakurai ,  Ritsuo Kikuta

    IPC分类号： H01L21/304 ,  B24B37/04 ,  B24B51/00 ,  B24B53/007 ,  B24B7/22

    CPC分类号： B24B37/345 ,  B24B37/04 ,  B24B51/00 ,  B24B53/017

    摘要： A polishing apparatus polishes a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a storage cassette for storing workpieces to be polished, at least two polishing units each having at least a turntable with a polishing cloth mounted thereon and a top ring for supporting a workpiece and pressing the workpiece against the polishing cloth, and a cleaning unit for cleaning a workpiece which has been polished by either one of the polishing units in such a state that the workpiece is removed from the top ring. The polishing apparatus further includes a transfer robot for transferring a workpiece between two of the storage cassette, the polishing units and the cleaning unit.

    摘要翻译： 抛光装置将诸如半导体晶片的工件抛光成平面镜面。 抛光装置包括用于存储要被抛光的工件的存储盒，至少两个抛光单元，每个抛光单元至少具有安装在其上的抛光布的转台和用于支撑工件并将工件压靠抛光布的顶环，以及 清洁单元，用于在工件从顶环移除的状态下清洁由任一个抛光单元抛光的工件。 抛光装置还包括用于在两个存储盒，抛光单元和清洁单元之间传送工件的传送机器人。

    Robotic transport apparatus
    40.
    发明授权
    Robotic transport apparatus 失效
    机器人运输设备

    公开(公告)号：US5961380A

    公开(公告)日：1999-10-05

    申请号：US12826

    申请日：1998-01-23

    申请人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Kunihiko Sakurai

    发明人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Kunihiko Sakurai

    IPC分类号： B65G49/07 ,  H01L21/677 ,  H01L21/687 ,  B24B47/02

    CPC分类号： H01L21/67766 ,  H01L21/68707 ,  Y10S451/914

    摘要： A robotic transport apparatus is capable of providing an effective waterproofing function of working components without using mechanical seals. The robotic transport apparatus includes a robot body, an arm assembly extendably attached to the robot body, and a workpiece holding section attached to the arm assembly. A pan member for waterproofing of the robot body is provided between the workpiece holding section and the robot body and has an area not smaller than the workpiece holding section.

    摘要翻译： 机器人运输装置能够在不使用机械密封的情况下提供工作部件的有效防水功能。 机器人运输装置包括机器人主体，可伸缩地附接到机器人主体的臂组件和附接到臂组件的工件保持部。 在工件保持部和机器人体之间设置用于机器人主体防水的盘构件，并且具有不小于工件保持部的面积。