公开(公告)号：US11050135B2

公开(公告)日：2021-06-29

申请号：US16884064

申请日：2020-05-27

Applicant: MEDIATEK INC.

Inventor： Yen-Ju Lu ,  Wen-Chou Wu

IPC: H01L23/34 ,  H01Q1/22 ,  H01Q1/48 ,  H01Q1/52 ,  H01Q21/12 ,  H01Q9/26 ,  H01Q21/06 ,  H01L23/28 ,  H01L23/528 ,  H01L23/64 ,  H01L23/66

Abstract: An Antenna-in-Package (AiP) includes an interface layer having at least an antenna layer and an insulating layer disposed under the antenna layer. The antenna layer includes a first antenna region and a second antenna region spaced apart from the first antenna region. An integrated circuit die is disposed on the interface layer. The integrated circuit die is interposed between the first antenna region and the second antenna region. The first antenna region includes a first antenna element, a second antenna element extending along a first direction, and a feeding network electrically connecting the first antenna element and the second antenna element to the integrated circuit die. The feeding network, the first antenna element, and the second antenna element are coplanar. A plurality of solder balls is disposed on a surface of the interface layer.

公开(公告)号：US10784206B2

公开(公告)日：2020-09-22

申请号：US16163614

申请日：2018-10-18

Applicant: MEDIATEK Inc.

Inventor： Wen-Sung Hsu ,  Tao Cheng ,  Nan-Cheng Chen ,  Che-Ya Chou ,  Wen-Chou Wu ,  Yen-Ju Lu ,  Chih-Ming Hung ,  Wei-Hsiu Hsu

IPC: H01L23/538 ,  H01L21/683 ,  H01Q9/04 ,  H01L23/498 ,  H01Q1/22 ,  H01L23/31 ,  H01L25/10 ,  H01L23/50 ,  H01Q21/06 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00 ,  H01L25/065 ,  H01L25/16 ,  H01L23/66 ,  H01L23/14

Abstract: A semiconductor package includes a first substrate, a first layer structure, a second layer structure and a first antenna layer. The first antenna layer is formed on at least one of the first layer structure and the second layer structure. The first layer structure is formed between the first substrate and the second layer structure.

公开(公告)号：US20190310314A1

公开(公告)日：2019-10-10

申请号：US16359954

申请日：2019-03-20

Applicant: MEDIATEK INC.

Inventor： Chih-Yang Liu ,  Ying-Chou Shih ,  Yen-Ju Lu ,  Chih-Ming Hung ,  Jui-Lin Hsu

IPC: G01R31/302 ,  H01Q1/22 ,  G01R31/303 ,  G01R31/28

Abstract: A wireless test system includes a load board having an upper surface and a lower surface. The load board has a testing antenna disposed on the load board. A socket for receiving a device under test (DUT) having an antenna structure therein is disposed on the upper surface of the load board. The antenna structure is aligned with the testing antenna. The wireless test system further includes a handler for picking up and delivering the DUT to the socket. The handler has a clamp for holding and pressing the DUT. The clamp is grounded during testing and functions as a ground reflector that reflects and reverses radiation pattern of the DUT from an upward direction to a downward direction toward the testing antenna.

公开(公告)号：US20190131690A1

公开(公告)日：2019-05-02

申请号：US16145108

申请日：2018-09-27

Applicant: MEDIATEK INC.

Inventor： Yen-Ju Lu ,  Wen-Chou Wu

IPC: H01Q1/22 ,  H01L23/64 ,  H01L23/66 ,  H01L23/28 ,  H01L23/528

Abstract: An Antenna-in-Package (AiP) includes an interface layer, an integrated circuit die disposed on the interface layer, a molding compound disposed on the interface layer and encapsulating the integrated circuit die, and a plurality of solder balls disposed on a bottom surface of the interface layer. The interface layer includes an antenna layer, and an insulating layer between the antenna layer and the ground reflector layer. The antenna layer includes a first antenna region and a second antenna region spaced apart from the first antenna region. The integrated circuit die is interposed between the first antenna region and the second antenna region. The first antenna region is disposed adjacent to a first edge of the integrated circuit die, and the second antenna region is disposed adjacent to a second edge of the integrated circuit die, which is opposite to the first edge.

公开(公告)号：US20180248258A9

公开(公告)日：2018-08-30

申请号：US15685885

申请日：2017-08-24

Applicant: MediaTek Inc.

Inventor： Yen-Ju Lu ,  Yi-Chieh Lin ,  Wen-Chou Wu

IPC: H01Q1/52 ,  H01Q1/38 ,  H01Q21/24 ,  H01Q21/08 ,  H01Q21/06 ,  H01Q5/30

CPC classification number: H01Q1/523 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q1/525 ,  H01Q5/30 ,  H01Q5/378 ,  H01Q21/062 ,  H01Q21/08 ,  H01Q21/24

Abstract: A Radio Frequency (RF) device may include a plurality of antennas and one or more conductive traces configured to trap a portion of energy transmitted from at least one of the plurality of antennas. The one or more conductive traces are sized and positioned such that undesired coupling between the plurality of antennas may be suppressed while maintaining performance parameters of at least one of the plurality of antennas. The plurality of antennas and the one or more conductive traces may be formed using a redistribution layer coupled to a chip embedded in a molding layer.