WRAP-AROUND GATE FIELD EFFECT TRANSISTOR
    32.
    发明申请
    WRAP-AROUND GATE FIELD EFFECT TRANSISTOR 失效
    封边栅场效应晶体管

    公开(公告)号:US20080206937A1

    公开(公告)日:2008-08-28

    申请号:US12114180

    申请日:2008-05-02

    IPC分类号: H01L21/336

    摘要: A field effect transistor is formed having wrap-around, vertically-aligned, dual gate electrodes. Starting with a silicon-on-insulator (SOI) structure having a buried silicon island, a vertical reference edge is defined, by creating a cavity within the SOI structure, and used during two etch-back steps that can be reliably performed. The first etch-back removes a portion of an oxide layer for a first distance over which a gate conductor material is then applied. The second etch-back removes a portion of the gate conductor material for a second distance. The difference between the first and second distances defines the gate length of the eventual device. After stripping away the oxide layers, a vertical gate electrode is revealed that surrounds the buried silicon island on all four side surfaces.

    摘要翻译: 形成具有环绕,垂直排列的双栅电极的场效应晶体管。 从具有掩埋硅岛的绝缘体上硅(SOI)结构开始,通过在SOI结构内产生空腔并在可以可靠地执行的两个回蚀步骤期间使用垂直参考边缘。 第一次回蚀将氧化物层的一部分去除第一距离,然后施加栅极导体材料。 第二次回蚀将栅极导体材料的一部分移除第二距离。 第一和第二距离之间的差异定义了最终设备的栅极长度。 剥离氧化物层后,显示出在所有四个侧表面上包围掩埋硅岛的垂直栅电极。

    SHALLOW TRENCH ISOLATION FILL BY LIQUID PHASE DEPOSITION OF SiO2
    33.
    发明申请
    SHALLOW TRENCH ISOLATION FILL BY LIQUID PHASE DEPOSITION OF SiO2 审中-公开
    通过SiO 2的液相沉积沉积分离膜

    公开(公告)号:US20080197448A1

    公开(公告)日:2008-08-21

    申请号:US12112549

    申请日:2008-04-30

    IPC分类号: H01L29/00

    摘要: To isolate two active regions formed on a silicon-on-insulator (SOI) substrate, a shallow trench isolation region is filled with liquid phase deposited silicon dioxide (LPD-SiO2) while avoiding covering the active areas with the oxide. By selectively depositing the oxide in this manner, the polishing needed to planarize the wafer is significantly reduced as compared to a chemical-vapor deposited oxide layer that covers the entire wafer surface. Additionally, the LPD-SiO2 does not include the growth seams that CVD silicon dioxide does. Accordingly, the etch rate of the LPD-SiO2 is uniform across its entire expanse thereby preventing cavities and other etching irregularities present in prior art shallow trench isolation regions in which the etch rate of growth seams exceeds that of the other oxide areas.

    摘要翻译: 为了隔离形成在绝缘体上硅(SOI)衬底上的两个有源区,浅沟槽隔离区填充有液相沉积二氧化硅(LPD-SiO 2),同时避免覆盖有源区 与氧化物。 通过以这种方式选择性地沉积氧化物,与覆盖整个晶片表面的化学气相沉积氧化物层相比,平坦化晶片所需的抛光显着降低。 此外,LPD-SiO 2不包括CVD二氧化硅的生长接缝。 因此,LPD-SiO 2的蚀刻速率在其整个宽度上是均匀的,从而防止存在于现有技术的浅沟槽隔离区域中的空穴和其它蚀刻不规则性,其中生长接缝的蚀刻速率超过 其他氧化物区域。

    Alternating phase mask built by additive film deposition
    37.
    发明授权
    Alternating phase mask built by additive film deposition 失效
    通过添加膜沉积建立的交替相位掩模

    公开(公告)号:US06998204B2

    公开(公告)日:2006-02-14

    申请号:US10707009

    申请日:2003-11-13

    IPC分类号: G01F9/00

    CPC分类号: G03F1/30 G03F1/54 G03F1/68

    摘要: The invention provides a method of forming a phase shift mask and the resulting phase shift mask. The method forms a non-transparent film on a transparent substrate and patterns an etch stop layer on the non-transparent film. The invention patterns the non-transparent film using the etch stop layer to expose areas of the transparent substrate. Next, the invention forms a mask on the non-transparent film to protect selected areas of the transparent substrate and forms a phase shift oxide on exposed areas of the transparent substrate. Subsequently, the mask is removed and the phase shift oxide is polished down to the etch stop layer, after which the etch stop layer is removed.

    摘要翻译: 本发明提供一种形成相移掩模的方法和所得到的相移掩模。 该方法在透明基板上形成不透明的薄膜,并在非透明薄膜上形成蚀刻停止层。 本发明使用蚀刻停止层来图案化非透明膜以暴露透明基底的区域。 接下来,本发明在非透明膜上形成掩模,以保护透明基板的选定区域,并在透明基板的曝光区域上形成相移氧化物。 随后,去除掩模并将相移氧化物抛光到蚀刻停止层,之后去除蚀刻停止层。

    Immersion lithography with equalized pressure on at least projection optics component and wafer
    38.
    发明授权
    Immersion lithography with equalized pressure on at least projection optics component and wafer 有权
    至少在投影光学部件和晶片上具有均衡压力的浸没光刻

    公开(公告)号:US07385673B2

    公开(公告)日:2008-06-10

    申请号:US11160156

    申请日:2005-06-10

    IPC分类号: G03B27/42

    CPC分类号: G03F7/70341

    摘要: An immersion lithography apparatus and method, and a lithographic optical column structure are disclosed for conducting immersion lithography with at least the projection optics of the optical system and the wafer in different fluids at the same pressure. In particular, an immersion lithography apparatus is provided in which a supercritical fluid is introduced about the wafer, and another fluid, e.g., an inert gas, is introduced to at least the projection optics of the optical system at the same pressure to alleviate the need for a special lens. In addition, the invention includes an immersion lithography apparatus including a chamber filled with a supercritical immersion fluid and enclosing a wafer to be exposed and at least a projection optic component of the optical system.

    摘要翻译: 公开了一种浸没式光刻设备和方法以及平版印刷光学柱结构,用于在相同压力下用不同流体中的光学系统和晶片的至少投影光学器件进行浸没光刻。 特别地,提供了一种浸没式光刻设备,其中超临界流体被引入晶片周围,并且另一种流体(例如惰性气体)在相同的压力下被引入光学系统的至少投影光学器件以减轻需要 用于特殊镜头。 此外,本发明包括浸没式光刻设备,其包括填充有超临界浸没流体的腔室并且封装要暴露的晶片和至少光学系统的投影光学部件。

    Liquid-filled balloons for immersion lithography
    39.
    发明授权
    Liquid-filled balloons for immersion lithography 有权
    用于浸没式光刻的充满液体的气球

    公开(公告)号:US07026259B2

    公开(公告)日:2006-04-11

    申请号:US10707894

    申请日:2004-01-21

    IPC分类号: H01L21/26 G06F17/50 G03B27/42

    CPC分类号: G03F7/70341 Y10S438/947

    摘要: A liquid-filled balloon may be positioned between a workpiece, such as a semiconductor structure covered with a photoresist, and a lithography light source. The balloon includes a thin membrane that exhibits good optical and physical properties. Liquid contained in the balloon also exhibits good optical properties, including a refractive index higher than that of air. Light from the lithography light source passes through a mask, through a top layer of the balloon membrane, through the contained liquid, through a bottom layer of the balloon membrane, and onto the workpiece where it alters portions of the photoresist. As the liquid has a low absorption and a higher refractive index than air, the liquid-filled balloon system enhances resolution. Thus, the balloon provides optical benefits of liquid immersion without the complications of maintaining a liquid between (and in contact with) a lithographic light source mechanism and workpiece.

    摘要翻译: 液体填充的球囊可以位于诸如被光致抗蚀剂覆盖的半导体结构的工件和光刻光源之间。 气球包括显示出良好的光学和物理性质的薄膜。 包含在气囊中的液体也表现出良好的光学性能,包括折射率高于空气的折射率。 来自光刻光源的光通过球囊膜的顶层通过所包含的液体通过球囊膜的底层,并穿过其上改变部分光致抗蚀剂的工件。 由于液体具有比空气低的吸收和较高的折射率,所以充满液体的球囊系统提高了分辨率。 因此,气囊提供液体浸没的光学优点,而没有在平版印刷光源机构和工件之间(并与之接触)之间保持液体的并发症。

    IMMERSION LITHOGRAPHY WITH EQUALIZED PRESSURE ON AT LEAST PROJECTION OPTICS COMPONENT AND WAFER
    40.
    发明申请
    IMMERSION LITHOGRAPHY WITH EQUALIZED PRESSURE ON AT LEAST PROJECTION OPTICS COMPONENT AND WAFER 有权
    在最小投影光学元件和波长下具有均匀压力的倾斜平面图

    公开(公告)号:US20080165335A1

    公开(公告)日:2008-07-10

    申请号:US12051572

    申请日:2008-03-19

    IPC分类号: G03B27/42

    CPC分类号: G03F7/70341

    摘要: An immersion lithography apparatus and method, and a lithographic optical column structure are disclosed for conducting immersion lithography with at least the projection optics of the optical system and the wafer in different fluids at the same pressure. In particular, an immersion lithography apparatus is provided in which a supercritical fluid is introduced about the wafer, and another fluid, e.g., an inert gas, is introduced to at least the projection optics of the optical system at the same pressure to alleviate the need for a special lens. In addition, the invention includes an immersion lithography apparatus including a chamber filled with a supercritical immersion fluid and enclosing a wafer to be exposed and at least a projection optic component of the optical system.

    摘要翻译: 公开了一种浸没式光刻设备和方法以及平版印刷光学柱结构,用于在相同压力下用不同流体中的光学系统和晶片的至少投影光学器件进行浸没光刻。 特别地,提供了一种浸没式光刻设备,其中超临界流体被引入晶片周围,并且另一种流体(例如惰性气体)在相同的压力下被引入光学系统的至少投影光学器件以减轻需要 用于特殊镜头。 此外,本发明包括浸没式光刻设备,其包括填充有超临界浸没流体的腔室并且封装要暴露的晶片和至少光学系统的投影光学部件。