公开(公告)号：US20130214406A1

公开(公告)日：2013-08-22

申请号：US13398534

申请日：2012-02-16

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: H01L23/36

CPC classification number: H01L23/46 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00

Abstract: A multi-chip module (MCM) structure comprises more than one semiconductor chip lying in a horizontal plane, the MCM having individual chip contact patches on the chips and a flexible heat sink having lateral compliance and extending in a plane in the MCM and secured in a heat exchange relation to the chips through the contact patches. The MCM has a mismatch between the coefficient of thermal expansion of the heat sink and the MCM and also has chip tilt and chip height mismatches. The flexible heat sink with lateral compliance minimizes or eliminates shear stress and shear strain developed in the horizontal direction at the interface between the heat sink and the chip contact patches by allowing for horizontal expansion and contraction of the heat sink relative to the MCM without moving the individual chip contact patches in a horizontal direction.

Abstract translation: 多芯片模块（MCM）结构包括位于水平面中的多于一个的半导体芯片，MCM在芯片上具有单独的芯片接触贴片，并且柔性散热器具有侧向顺应性并且在MCM中的平面中延伸并固定在 通过接触片与芯片的热交换关系。 MCM具有散热器的热膨胀系数与MCM之间的不匹配，并且还具有芯片倾斜和芯片高度失配。 具有横向顺从性的柔性散热器通过允许相对于MCM的散热器的水平膨胀和收缩，最小化或消除了在散热器和芯片接触片之间的界面处在水平方向上产生的剪切应力和剪切应变，而不移动 单个芯片接触片在水平方向。

公开(公告)号：US20130199767A1

公开(公告)日：2013-08-08

申请号：US13364907

申请日：2012-02-02

Applicant: John P. Karidis ,  Mark D. Schultz

Inventor： John P. Karidis ,  Mark D. Schultz

IPC: F28F7/00 ,  B23K37/00 ,  B23K31/02

CPC classification number: H01L23/473 ,  B23K1/0014 ,  B23K31/02 ,  B23K2101/14 ,  H01L21/4882 ,  H01L21/4885 ,  H01L23/3677 ,  H01L23/467 ,  H01L24/72 ,  H01L2924/01322 ,  H01L2924/00

Abstract: A heat sink includes a plurality of layers being disposed substantially parallel with a surface of a heat source. The layers include a plurality of pin portions spaced apart from each other in a planar arrangement wherein the pin portions of the layers are stacked and bonded to form pin fins extending in a transverse direction relative to the heat source to sink heat. A compliant layer is disposed between the pin fins and a mechanical load. The compliant layer provides compliance such that the pin fins accommodate dimensional differences when interfacing with the heat source.

Abstract translation: 散热器包括与热源的表面基本平行的多个层。 这些层包括以平面布置彼此间隔开的多个销部分，其中层的销部分被堆叠并结合以形成相对于热源在横向方向上延伸以散热的销散热片。 柔性层设置在销散热片和机械负载之间。 顺应层提供顺应性，使得当与热源接合时，销翅片适应尺寸差异。

公开(公告)号：US20110203108A1

公开(公告)日：2011-08-25

申请号：US12708774

申请日：2010-02-19

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: G01R31/02 ,  H01R43/00

CPC classification number: G01R1/06716 ,  G01R1/06744 ,  Y10T29/49224

Abstract: A probe apparatus is provided and includes a probe layer formed with a through-hole, a conductor, electrically coupled to test equipment, disposed on and insulated from a through-hole sidewall, a probe disposed within the through-hole to be spaced from the conductor and thereby movable upon application of an external force thereto and a compliant layer connected to the probe and sufficiently compliant to allow the probe to at least temporarily contact the conductor upon the application of the external force thereto.

Abstract translation: 提供了一种探针装置，包括形成有通孔的探针层，电连接到测试设备的导体，设置在通孔侧壁上并与绝缘体侧壁绝缘;探针，设置在通孔内以与通孔隔开 导体，从而在施加外力的同时可移动，以及连接到探针的顺应性层，并且足够柔顺，以允许探针在施加外力时至少临时接触导体。

公开(公告)号：US20090151907A1

公开(公告)日：2009-06-18

申请号：US11956024

申请日：2007-12-13

Applicant: John P. Karidis ,  Mark D. Schultz

Inventor： John P. Karidis ,  Mark D. Schultz

IPC: F28D15/00 ,  B21D53/02

CPC classification number: H01L23/473 ,  H01L21/4882 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

Abstract: A method for producing a compliant thermal interface device for cooling an integrated circuit includes steps of: cutting a plurality of high thermal conductivity sheets according to at least one selected pattern, the sheets made up of a first material; forming spring elements in at least one of the plurality of sheets, such that the sheets include both flat areas and spring elements; coating the sheets with a second material, wherein the second material is different from the first material; stacking the high thermal conductivity sheets; and bonding at least a portion of at least one of the stacked sheets using thermo-compression bonding.

Abstract translation: 用于制造用于冷却集成电路的柔性热接口装置的方法包括以下步骤：根据至少一个选定图案切割多个高导热性片材，所述片材由第一材料制成; 在所述多个片材中的至少一个片材中形成弹簧元件，使得所述片材包括平坦区域和弹簧元件; 用第二材料涂覆片材，其中第二材料不同于第一材料; 堆叠高导热片材; 以及使用热压接合将所述堆叠片材中的至少一个的至少一部分结合。

公开(公告)号：US20080247165A1

公开(公告)日：2008-10-09

申请号：US11696265

申请日：2007-04-04

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: G01J3/46 ,  G02B27/30 ,  F21V23/04

CPC classification number: G01J3/50 ,  G02B27/20

Abstract: A method and apparatus for increasing the visibility in the visible spectrum of a laser pointer on a target. The laser pointer provides a laser source or sources of at least two distinct visible colors. The visibility of at least one of the laser source colors on the target is determined. The laser source color is selected from the given colors based on the determined visibility. The selected laser source color is directed to the target.

Abstract translation: 一种用于增加激光指示器在目标上的可见光谱中的可视性的方法和装置。 激光指示器提供至少两种不同可见颜色的激光源或源。 确定目标上的至少一种激光源颜色的可视性。 基于所确定的可视性，从给定的颜色中选择激光源颜色。 所选择的激光源颜色指向目标。

公开(公告)号：US07362582B2

公开(公告)日：2008-04-22

申请号：US11151905

申请日：2005-06-14

Applicant: John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: H05K7/20

CPC classification number: H01L23/433 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A structure for cooling an electronic device is disclosed. The structure includes a compressible top layer disposed over the electronic device. The structure further includes a plurality of rigid elements disposed between the top layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of rigid elements provide mechanical compliance. In another alternative, the structure further includes a conformable heat-conducting layer disposed over the electronic device, wherein a bottom end of the plurality of rigid elements is coupled to the conformable heat-conducting layer.

Abstract translation: 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的可压缩顶层。 该结构还包括设置在顶层和电子设备之间的多个刚性元件，用于提供来自电子设备的热路径，并且其中多个刚性元件提供机械顺应性。 在另一替代方案中，结构还包括设置在电子设备上的适形导热层，其中多个刚性元件的底端联接到适形导热层。

公开(公告)号：US07268963B2

公开(公告)日：2007-09-11

申请号：US10903153

申请日：2004-07-30

Applicant: Timothy J. Chainer ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： Timothy J. Chainer ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: G11B5/09 ,  G11B21/02 ,  G11B5/596

CPC classification number: G11B5/59633 ,  G11B5/59605

Abstract: Self-servo-writing of multi-slot timing patterns is described. Individual timing marks are replaced with groups of timing mark slots. At each timing mark location, a time measurement is made by detecting a timing mark in one of the slots. Also, extensions to the existing timing marks are written in other slots. The combination of timing measurements at every timing mark and extensions to those timing marks written at every opportunity improves the overall precision of the timing propagation. The improved accuracy of timing mark placement produces a commensurate improvement in the placement of the concomitantly written servo-data. In addition, the alignment accuracy of the written pattern is less sensitive to variations in rotation speed and variations in the shape of written transitions. Moreover, only a single disk revolution is required at each servo radius to write servo data and propagate the timing marks to maintain timing alignment.

Abstract translation: 描述了多时隙定时模式的自伺服写入。 单个定时标记被定时标记位置组替换。 在每个定时标记位置，通过检测其中一个时隙中的定时标记来进行时间测量。 此外，现有时序标记的扩展也写在其他插槽中。 每个定时标记的定时测量和在每个机会上写入的定时标记的扩展的组合可以提高定时传播的总体精度。 定时标记放置的改进精度在同时写入的伺服数据的位置上产生相应的改进。 此外，写入的图案的对准精度对旋转速度的变化和写入的转变的形状的变化较不敏感。 此外，在每个伺服半径处仅需要一次盘旋转以写入伺服数据并传播定时标记以保持定时对准。

公开(公告)号：US06633451B1

公开(公告)日：2003-10-14

申请号：US09426435

申请日：1999-10-25

Applicant: Timothy J. Chainer ,  Bucknell C. Webb ,  Mark D. Schultz ,  Edward J. Yarmchuk

Inventor： Timothy J. Chainer ,  Bucknell C. Webb ,  Mark D. Schultz ,  Edward J. Yarmchuk

IPC: G11B2102

CPC classification number: G11B5/59633

Abstract: A method is provided for writing a servo-pattern on a storage medium. According to the method, first timing marks are written at a first radial position of the storage medium, and the head is moved to a second radial position. Time intervals between selected pairs of the first timing marks are measured, and other timing marks are written at the second radial position of the storage medium. The measuring step is performed after the moving step. In one preferred method, the steps of moving, measuring, and writing other timing marks are repeated until the servo-pattern is written on an entire surface of the storage medium. A method is also provided for generating an initial aligned pattern of timing marks for self-servo-writing on a storage medium.

Abstract translation: 提供一种用于将伺服图案写入存储介质的方法。 根据该方法，将第一定时标记写入存储介质的第一径向位置，并且将头移动到第二径向位置。 测量所选择的第一定时标记对之间的时间间隔，并且其他定时标记被写入存储介质的第二径向位置。 测量步骤在移动步骤之后进行。 在一个优选的方法中，重复移动，测量和写入其它定时标记的步骤，直到伺服图案被写入存储介质的整个表面。 还提供了一种用于在存储介质上产生用于自伺服写入的定时标记的初始对准图案的方法。

公开(公告)号：US09151543B2

公开(公告)日：2015-10-06

申请号：US13184239

申请日：2011-07-15

Applicant: Madhusudan K. Iyengar ,  Pritish R. Parida ,  Mark D. Schultz

Inventor： Madhusudan K. Iyengar ,  Pritish R. Parida ,  Mark D. Schultz

IPC: F25B25/00 ,  F28D15/00 ,  H05K7/20

CPC classification number: H05K7/20836 ,  F28D15/00 ,  H05K7/2079

Abstract: A data center cooling system is operated in a first mode; it has an indoor portion wherein heat is absorbed from components in the data center, and an outdoor heat exchanger portion wherein outside air is used to cool a first heat transfer fluid (e.g., water) present in at least the outdoor heat exchanger portion of the cooling system during the first mode. The first heat transfer fluid is a relatively high performance heat transfer fluid (as compared to the second fluid), and has a first heat transfer fluid freezing point. A determination is made that an appropriate time has been reached to switch from the first mode to a second mode. Based on this determination, the outdoor heat exchanger portion of the data cooling system is switched to a second heat transfer fluid, which is a relatively low performance heat transfer fluid, as compared to the first heat transfer fluid. It has a second heat transfer fluid freezing point lower than the first heat transfer fluid freezing point, and the second heat transfer fluid freezing point is sufficiently low to operate without freezing when the outdoor air temperature drops below a first predetermined relationship with the first heat transfer fluid freezing point.

Abstract translation: 数据中心冷却系统以第一模式运行; 其具有室内部分，其中热量从数据中心的部件吸收;以及室外热交换器部分，其中外部空气被用于冷却至少在室外热交换器部分中存在的第一传热流体（例如，水） 第一模式下的冷却系统。 第一传热流体是相对高性能的传热流体（与第二流体相比），并且具有第一传热流体凝固点。 确定已经达到适当的时间以从第一模式切换到第二模式。 基于该判定，与第一传热流体相比，数据冷却系统的室外热交换器部分切换为相对低性能的传热流体的第二传热流体。 其具有比第一传热流体凝固点低的第二传热流体凝固点，并且当室外空气温度下降到与第一传热的第一预定关系时，第二传热流体凝固点足够低以在不冻结的情况下运行 流体凝固点。

公开(公告)号：US08746000B2

公开(公告)日：2014-06-10

申请号：US13587912

申请日：2012-08-16

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: F25D23/12

CPC classification number: H05K7/20836 ,  G05D23/00 ,  H05K7/20281

Abstract: According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools warm air generated by the rack of information technology equipment. The system may also include a liquid to liquid heat exchanger and an outdoor heat exchanger. The system may further include configurable pathways to connect and control fluid flow through the sidecar heat exchanger, the liquid to liquid heat exchanger, the rack of information technology equipment, and the outdoor heat exchanger based upon ambient temperature and/or ambient humidity to remove heat from the rack of information technology equipment.

Abstract translation: 根据一个实施例，用于从信息技术设备的机架移除热量的系统可以包括侧面的室内空气 - 液体热交换器，其冷却由信息技术设备的机架产生的热空气。 该系统还可以包括液体与液体热交换器和室外热交换器。 该系统可以进一步包括可配置的路径，以根据环境温度和/或环境湿度连接和控制通过旁侧热交换器，液体到液体热交换器，信息技术设备的机架和室外热交换器的流体流动，以去除热量 从信息技术设备架构。