公开(公告)号：US10539531B2

公开(公告)日：2020-01-21

申请号：US16376983

申请日：2019-04-05

Applicant: Nuctech Company Limited

Inventor： Qingjun Zhang ,  Yuanjing Li ,  Zhiqiang Chen ,  Ziran Zhao ,  Yinong Liu ,  Yaohong Liu ,  Huishao He ,  Qiufeng Ma ,  Weiping Zhu ,  Xiang Zou ,  Jianping Chang ,  Song Liang

IPC: H01J49/00 ,  G01N27/62 ,  H01J49/04 ,  G01N1/02 ,  G01N1/22 ,  G01N1/40 ,  G01N30/60 ,  G01N30/72 ,  G01N1/42

Abstract: A detection apparatus and a detection method are disclosed. In one aspect, the detection apparatus includes a sampling device for collecting samples to be checked. It further includes a sample pre-processing device configured to pre-process the sample from the sampling device. It further includes a sample analyzing device for separating samples from the pre-processing device and for analyzing the separated samples. The detection apparatus is miniaturized and highly precise, and is capable of quickly and accurately detecting gaseous phase or particulate substances, and it has applications for safety inspections at airports, ports, and subway stations.

公开(公告)号：US10510683B2

公开(公告)日：2019-12-17

申请号：US15718919

申请日：2017-09-28

Applicant: Tsinghua University ,  NUCTECH COMPANY LIMITED

Inventor： Wenjian Zhang ,  Qingjun Zhang ,  Yuanjing Li ,  Zhiqiang Chen ,  Ziran Zhao ,  Yinong Liu ,  Yaohong Liu ,  Xiang Zou ,  Huishao He ,  Shuwei Li ,  Nan Bai

IPC: H01L25/00 ,  H01L23/00 ,  H01L31/024 ,  H01L31/18 ,  H01L23/15 ,  H01L23/498 ,  H01L31/02 ,  H01L31/0203 ,  H01L27/146

Abstract: The present disclosure proposes a packaging structure for a metallic bonding based opto-electronic device and a manufacturing method thereof. According to the embodiments, the packaging structure for an opto-electronic device may comprise an opto-electronic chip and a packaging base. The opto-electronic chip comprises: a substrate having a first substrate surface and a second substrate surface opposite to each other; an opto-electronic device formed on the substrate; and electrodes for the opto-electronic device which are formed on the first substrate surface. The packaging base has a first base surface and a second base surface opposite to each other, and comprises conductive channels extending from the first base surface to the second base surface. The opto-electronic chip is stacked on the packaging base in such a manner that the first substrate surface faces the packaging base, and the electrodes formed on the first substrate surface of the opto-electronic chip are bonded with corresponding conductive channels in the packaging base.

公开(公告)号：US10276359B2

公开(公告)日：2019-04-30

申请号：US15832193

申请日：2017-12-05

Applicant: Nuctech Company Limited

Inventor： Qingjun Zhang ,  Yuanjing Li ,  Zhiqiang Chen ,  Yanchun Wang ,  Ziran Zhao ,  Xianghua Li ,  Qiufeng Ma ,  Ge Li ,  Biao Cao ,  Qi Mao ,  Xiang Zou

IPC: G01N27/62 ,  H01J49/16 ,  H01J49/00 ,  H01J49/02

Abstract: The present disclosure provides an ion mobility spectrometer, which comprises: a power supply circuit, configured to provide a power supply voltage; a corona discharge configured to generate ions to be subjected to measurement, through corona discharge; an ion migration circuit configured to control migration of the ions; a migration zone structure configured to realize, under control of the ion migration circuit, mobility spectrum measurement of the ions which pass through the migration zone structure; a redundant charge extraction electrode arranged between the corona discharge structure and the migration zone structure, so that the ions which are generated by the corona discharge structure can pass therethrough to reach the migration zone structure; and a redundant charge extraction circuit, wherein the redundant charge extraction electrode is connected to the ground through the redundant charge extraction circuit.

公开(公告)号：US09983321B2

公开(公告)日：2018-05-29

申请号：US15258209

申请日：2016-09-07

Applicant: Nuctech Company Limited ,  TSINGHUA UNIVERSITY

Inventor： Qingjun Zhang ,  Yuanjing Li ,  Zhiqiang Chen ,  Ziran Zhao ,  Yinong Liu ,  Yaohong Liu ,  Xiang Zou ,  Huishao He ,  Shuwei Li ,  Jianping Chang ,  Wenjian Zhang

IPC: G01T7/00 ,  G01J1/02

CPC classification number: G01T7/00 ,  G01J1/0271 ,  G01J2001/0276

Abstract: The invention discloses a safety inspection detector and a goods safety inspection system. The safety inspection detector at least comprises a circuit board, a first housing, a second housing, a detection module and a connecting interface. The detection module and the connecting interface are mounted on the circuit board. The first housing is pressed and connected to a first surface of the circuit board, and the second housing is pressed and connected to a second surface of the circuit board. The first housing and the second housing can hermetically wrap the detection module and electronic devices on the circuit board, but bypass the connecting interface to realize leading-out and connection with related interconnected cables by utilizing the connecting interface. The housings can be used for sealing and protecting sensitive electronic devices in the detector, thus being moisture proof and preventing interference.