公开(公告)号：US20050032391A1

公开(公告)日：2005-02-10

申请号：US10941346

申请日：2004-09-14

申请人： Steven L. Peace ,  Gary Curtis ,  Raymon Thompson ,  Brian Aegerter ,  Curt Dundas

发明人： Steven L. Peace ,  Gary Curtis ,  Raymon Thompson ,  Brian Aegerter ,  Curt Dundas

IPC分类号： H01L21/306 ,  B08B3/04 ,  H01L21/00 ,  H01L21/3213 ,  H01L21/302 ,  H01L21/461

CPC分类号： H01L21/6715 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S118/90 ,  Y10S438/906 ,  Y10S438/913

摘要： An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

摘要翻译： 用于处理半导体晶片或类似物品的装置包括具有由上下转子形成的处理室的反应器。 晶片支撑在转子之间。 转子由旋转电机旋转。 处理流体在中心位置被引入到晶片的顶表面或底表面上，或在两个表面上。 流体向外均匀地向各个方向流动。 晶片支架自动提升晶片，从而当转子在加工后彼此分离时，它可以由机器人从反应器中移出。

公开(公告)号：US06794291B2

公开(公告)日：2004-09-21

申请号：US10202074

申请日：2002-07-23

申请人： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

发明人： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

IPC分类号： H01L21311

CPC分类号： H01L21/6715 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S118/90 ,  Y10S438/906 ,  Y10S438/913

摘要： An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

摘要翻译： 用于处理半导体晶片或类似物品的设备包括具有由上下转子形成的处理室的反应器。 晶片支撑在转子之间。 转子由旋转电机旋转。 处理流体在中心位置被引入到晶片的顶表面或底表面上，或在两个表面上。 流体向外均匀地向各个方向流动。 晶片支架自动提升晶片，从而当转子在加工后彼此分离时，它可以由机器人从反应器中移出。

公开(公告)号：US06680253B2

公开(公告)日：2004-01-20

申请号：US09907522

申请日：2001-07-16

申请人： Paul Z. Wirth ,  Steven L. Peace

发明人： Paul Z. Wirth ,  Steven L. Peace

IPC分类号： H01L21311

CPC分类号： B08B3/04 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/6715 ,  Y10S118/90 ,  Y10S438/906 ,  Y10S438/913

摘要： A system for processing a workpiece includes a base having a bowl or recess for holding a liquid. A process reactor or head holds a workpiece between an upper rotor and a lower rotor. A head lifter lowers the head holding the workpiece into contact with the liquid. The head spins the workpiece during or after contact with the liquid. The upper and lower rotors have side openings for loading and unloading a workpiece into the head. The rotors are axially moveable to align the side openings.

摘要翻译： 用于处理工件的系统包括具有用于保持液体的碗或凹部的底座。 工艺反应器或头部将工件保持在上转子和下转子之间。 头部升降器降低了将工件保持与液体接触的头部。 在与液体接触期间或之后，头部旋转工件。 上下转子具有用于将工件装载和卸载到头部中的侧开口。 转子可轴向移动以对准侧开口。

公开(公告)号：US06413436B1

公开(公告)日：2002-07-02

申请号：US09437926

申请日：1999-11-10

申请人： Brian Aegerter ,  Curt T. Dundas ,  Michael Jolley ,  Tom L. Ritzdorf ,  Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson

发明人： Brian Aegerter ,  Curt T. Dundas ,  Michael Jolley ,  Tom L. Ritzdorf ,  Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson

IPC分类号： C23F102

CPC分类号： H01L21/67017 ,  C23F1/18 ,  H01L21/32134 ,  H01L21/6708 ,  Y10S438/928 ,  Y10S438/963

摘要： In a process for treating a workpiece such as a semiconductor wafer, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides of the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece while the workpiece and a reactor holding the workpiece are spinning. The flow rate of the processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

公开(公告)号：US5488522A

公开(公告)日：1996-01-30

申请号：US337740

申请日：1994-11-14

申请人： Steven L. Peace ,  Terry A. Precht

发明人： Steven L. Peace ,  Terry A. Precht

IPC分类号： G11B15/675 ,  G11B17/04 ,  G11B25/10

CPC分类号： G11B17/043 ,  G11B15/67523 ,  G11B25/10

摘要： Ejection apparatus for a computer mass storage media drive. The media drive includes two insertion openings for receiving two different storage media. An actuation arm receives an actuation force for initiating ejection of storage media position within the media drive out of the media drive. The actuation arm, when actuated, initiates the ejection of either a storage media inserted into the media drive by way of a first of the two insertion openings or a storage media inserted into the media drive by way of a second of the two insertion openings.

摘要翻译： 用于计算机大容量存储媒体驱动器的喷射装置。 介质驱动器包括用于接收两种不同存储介质的两个插入开口。 致动臂接收用于启动将介质驱动器内的存储介质位置排出介质驱动器的致动力。 致动臂当致动时，通过两个插入开口中的第一个或通过两个插入开口中的第二个插入到介质驱动器中的存储介质来启动插入到介质驱动器中的存储介质的弹出。