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18 条记录 (耗时 0.036 秒)

    Selective treatment of microelectric workpiece surfaces
    2.
    发明授权
    Selective treatment of microelectric workpiece surfaces 有权
    微电子工件表面的选择性处理

    公开(公告)号：US07399713B2

    公开(公告)日：2008-07-15

    申请号：US10632495

    申请日：2003-07-31

    申请人： Brian K. Aegerter ,  Curt T. Dundas ,  Tom L. Ritzdorf ,  Gary L. Curtis ,  Michael Jolley ,  Steven L. Peace

    发明人： Brian K. Aegerter ,  Curt T. Dundas ,  Tom L. Ritzdorf ,  Gary L. Curtis ,  Michael Jolley ,  Steven L. Peace

    IPC分类号： H01L21/302

    CPC分类号： H01L21/6715 ,  C23F1/18 ,  C23F1/30 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/6708 ,  Y10S134/902 ,  Y10S438/906

    摘要： This invention provides a process for treating a workpiece having a front side, a back side, and an outer perimeter. In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides or the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece as the workpiece and corresponding reactor are spinning about an axis of rotation that is generally orthogonal to the center of the face of the workpiece being processed. The flow rate of the one or more processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

    摘要翻译： 本发明提供了一种用于处理具有前侧，后侧和外周的工件的方法。 根据该过程，从前侧或后侧或工件中的至少一个的外周边缘选择性地施加或排除处理流体。 处理流体的排除和/或应用通过将一种或多种加工流体施加到工件上而发生，因为工件和相应的反应器围绕大致正交于被加工工件的面的中心的旋转轴旋转。 使用一种或多种加工流体的流量，流体压力和/或旋转速率来控制从外周边缘选择性地施加或排除处理流体的程度。

    Methods and apparatus for rinsing and drying
    3.
    发明授权
    Methods and apparatus for rinsing and drying 有权
    冲洗和干燥的方法和设备

    公开(公告)号：US07429537B2

    公开(公告)日：2008-09-30

    申请号：US11292823

    申请日：2005-12-02

    申请人： Brian K. Aegerter ,  Curt T. Dundas ,  Tom L. Ritzdorf ,  Gary L. Curtis ,  Michael Jolley

    发明人： Brian K. Aegerter ,  Curt T. Dundas ,  Tom L. Ritzdorf ,  Gary L. Curtis ,  Michael Jolley

    IPC分类号： H01L21/302

    CPC分类号： H01L21/67051 ,  B08B3/02 ,  H01L21/67028

    摘要： A method for rinsing and drying a workpiece includes placing the workpiece into a chamber and spinning the workpiece. A rinsing fluid, such as water, is applied onto the workpiece through a first outlet in the chamber, with the rinsing fluid moving outwardly towards the edge of the workpiece via centrifugal force, to rinse the workpiece. A drying fluid, such as an alcohol vapor, is applied onto the workpiece through the first outlet, with the drying fluid moving outwardly towards the edge of the workpiece via centrifugal force, to dry the workpiece. The drying fluid advantageously follows a meniscus of the rinsing fluid across the workpiece surface. The rinsing fluid, or the drying fluid, or both fluids, may be applied near or at a central area of the workpiece.

    摘要翻译： 用于冲洗和干燥工件的方法包括将工件放置在室中并旋转工件。 冲洗流体例如水通过腔室中的第一出口施加到工件上，漂洗流体通过离心力向外移动到工件的边缘，以冲洗工件。 干燥流体，例如醇蒸汽，通过第一出口施加到工件上，干燥流体通过离心力向外移动到工件的边缘，以干燥工件。 干燥流体有利地沿着穿过工件表面的冲洗流体的弯液面。 冲洗流体或干燥流体或两种流体可以施加在工件的中心区域附近或其附近。

    Selective treatment of microelectronic workpiece surfaces
    4.
    发明授权
    Selective treatment of microelectronic workpiece surfaces 有权
    微电子工件表面的选择性处理

    公开(公告)号：US06632292B1

    公开(公告)日：2003-10-14

    申请号：US09672572

    申请日：2000-09-28

    申请人： Brian K. Aegerter ,  Curt T. Dundas ,  Tom L. Ritzdorf ,  Gary L. Curtis ,  Michael Jolley

    发明人： Brian K. Aegerter ,  Curt T. Dundas ,  Tom L. Ritzdorf ,  Gary L. Curtis ,  Michael Jolley

    IPC分类号： B08B700

    CPC分类号： H01L21/6715 ,  C23F1/18 ,  C23F1/30 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/6708 ,  Y10S134/902 ,  Y10S438/906

    摘要： This invention provides a process for treating a workpiece having a front side, a back side, and an outer perimeter. In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides or the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece as the workpiece and corresponding reactor are spinning about an axis of rotation that is generally orthogonal to the center of the face of the workpiece being processed. The flow rate of the one or more processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

    摘要翻译： 本发明提供了一种用于处理具有前侧，后侧和外周的工件的方法。 根据该过程，从前侧或后侧或工件中的至少一个的外周边缘选择性地施加或排除处理流体。 处理流体的排除和/或应用通过将一种或多种加工流体施加到工件上而发生，因为工件和相应的反应器围绕大致正交于被加工工件的面的中心的旋转轴旋转。 使用一种或多种加工流体的流量，流体压力和/或旋转速率来控制从外周边缘选择性地施加或排除处理流体的程度。

    Processes for removing residue from a workpiece
    5.
    发明申请
    Processes for removing residue from a workpiece 审中-公开
    从工件上清除残留物的工艺

    公开(公告)号：US20050233589A1

    公开(公告)日：2005-10-20

    申请号：US11151896

    申请日：2005-06-14

    申请人： Brian Aegerter ,  Curt Dundas ,  Tom Ritzdorf ,  Gary Curtis ,  Michael Jolley

    发明人： Brian Aegerter ,  Curt Dundas ,  Tom Ritzdorf ,  Gary Curtis ,  Michael Jolley

    IPC分类号： B08B3/00 ,  B44C1/22 ,  H01L21/00 ,  H01L21/302 ,  H01L21/311 ,  H01L21/3213

    CPC分类号： H01L21/31111 ,  H01L21/32134 ,  H01L21/67051 ,  H01L21/6708

    摘要： In a process for removing etch residue, liquid including an acid and an oxidizer is applied to the back side and peripheral edge of a wafer. The front or device side of the wafer is left unprocessed, or may be exposed to an inert fluid such as a purge gas (e.g., nitrogen or helium), to a rinse such as deionized water, or to another processing fluid such as a more highly diluted etchant. The front side of the wafer is either left unprocessed, or is processed to a lesser degree without damage to the underlying devices, metal interconnects or semiconductor layers.

    摘要翻译： 在去除蚀刻残留物的方法中，将包含酸和氧化剂的液体施加到晶片的背面和周缘。 晶片的前部或装置侧未被处理，或者可以暴露于诸如清除气体（例如氮气或氦气）的惰性流体到漂洗液如去离子水，或者暴露于另一种处理流体，例如更多 高度稀释的蚀刻剂。 晶片的前侧要么是未加工的，要么被加工程度较小，而不会损坏底层器件，金属互连或半导体层。

    Methods and apparatus for rinsing and drying
    6.
    发明申请
    Methods and apparatus for rinsing and drying 有权
    冲洗和干燥的方法和设备

    公开(公告)号：US20060070638A1

    公开(公告)日：2006-04-06

    申请号：US11292823

    申请日：2005-12-02

    申请人： Brian Aegerter ,  Curt Dundas ,  Tom Ritzdorf ,  Gary Curtis ,  Michael Jolley

    发明人： Brian Aegerter ,  Curt Dundas ,  Tom Ritzdorf ,  Gary Curtis ,  Michael Jolley

    IPC分类号： B08B3/00 ,  B08B7/00

    CPC分类号： H01L21/67051 ,  B08B3/02 ,  H01L21/67028

    摘要： A method for rinsing and drying a workpiece includes placing the workpiece into a chamber and spinning the workpiece. A rinsing fluid, such as water, is applied onto the workpiece through a first outlet in the chamber, with the rinsing fluid moving outwardly towards the edge of the workpiece via centrifugal force, to rinse the workpiece. A drying fluid, such as an alcohol vapor, is applied onto the workpiece through the first outlet, with the drying fluid moving outwardly towards the edge of the workpiece via centrifugal force, to dry the workpiece. The drying fluid advantageously follows a meniscus of the rinsing fluid across the workpiece surface. The rinsing fluid, or the drying fluid, or both fluids, may be applied near or at a central area of the workpiece.

    摘要翻译： 用于冲洗和干燥工件的方法包括将工件放置在室中并旋转工件。 冲洗流体例如水通过腔室中的第一出口施加到工件上，漂洗流体通过离心力向外移动到工件的边缘，以冲洗工件。 干燥流体，例如醇蒸汽，通过第一出口施加到工件上，干燥流体通过离心力向外移动到工件的边缘，以干燥工件。 干燥流体有利地沿着穿过工件表面的冲洗流体的弯液面。 冲洗流体或干燥流体或两种流体可以施加在工件的中心区域附近或其附近。

    GOLF TOOL DEVICES
    9.
    发明申请
    GOLF TOOL DEVICES 审中-公开

    公开(公告)号：US20190151726A1

    公开(公告)日：2019-05-23

    申请号：US16197176

    申请日：2018-11-20

    申请人： Michael Jolley

    发明人： Michael Jolley ,  Kenneth Courian

    IPC分类号： A63B57/20 ,  A63B57/50 ,  A63B47/02

    CPC分类号： A63B57/207 ,  A63B47/02 ,  A63B53/14 ,  A63B57/353 ,  A63B57/50 ,  A63B60/06 ,  A63B60/22 ,  A63B2209/08

    摘要： Golf tool devices and golf clubs having those devices attached to, or incorporated with, their grips are disclosed. In some embodiments, the golf tool device includes a housing and a tool assembly attached to the housing. The tool assembly includes a base jaw and a gripper jaw pivotably connected to the base jaw. The tool assembly additionally includes a spring connected to the gripper jaw and configured to urge the gripper jaw toward the base jaw. The golf tool device additionally includes a mode selector assembly configured to selectively switch operation of the gripper jaw between at least two modes. The at least two modes include a first mode in which the gripper jaw moves in response to urging of the spring, and a second mode in which the gripper jaw is secured in a first position that is spaced away from the base jaw against urging of the spring.

    Probe head having a membrane suspended probe
    10.
    发明授权
    Probe head having a membrane suspended probe 有权
    探头具有膜悬浮探针

    公开(公告)号：US07368927B2

    公开(公告)日：2008-05-06

    申请号：US11175600

    申请日：2005-07-05

    申请人： Kenneth Smith ,  Michael Jolley ,  Victoria Van Syckel

    发明人： Kenneth Smith ,  Michael Jolley ,  Victoria Van Syckel

    IPC分类号： G01R31/02

    CPC分类号： G01R1/0735 ,  G01R1/07371

    摘要： A probe head including an elastic membrane capable of exerting a restoring force when one of the surfaces of the elastic membrane is distorted. A conductive probe includes a beam having a first end and a second end, with a probe tip proximate the first end for contacting a device under test. A beam contact proximate the second end of the beam. The beam being movable to deform at least one surface of the elastic membrane.

    摘要翻译： 探头，其包括当弹性膜的一个表面之一变形时能够发挥恢复力的弹性膜。 导电探针包括具有第一端和第二端的梁，探针尖靠近第一端以接触待测器件。 靠近梁的第二端的梁接触。 梁可移动以使弹性膜的至少一个表面变形。