公开(公告)号：US20220123165A1

公开(公告)日：2022-04-21

申请号：US17607030

申请日：2020-05-07

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L33/00 ,  H01L21/683 ,  H01L25/075

Abstract: The invention provides a micro LED suction body, and a method of manufacturing a micro LED display using the same. Proposed is a micro LED suction body for transferring micro LEDs from a first substrate to a second substrate and, more particularly, is a micro LED suction body for transferring micro LEDs by a vacuum suction method.

公开(公告)号：US20210337674A1

公开(公告)日：2021-10-28

申请号：US17232750

申请日：2021-04-16

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: H05K3/40 ,  G01R1/073

Abstract: Proposed are an anodic aluminum oxide mold made of an anodic aluminum oxide film, a manufacturing method thereof, a half-finished probe product, a manufacturing method thereof, a probe card, and a manufacturing method thereof.

公开(公告)号：US20210307159A1

公开(公告)日：2021-09-30

申请号：US17209178

申请日：2021-03-22

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Dong Eun LEE

IPC: H05K1/03 ,  H05K1/11

Abstract: Proposed is an anodic aluminum oxide structure made of anodic aluminum oxide and, more particularly, is an anodic aluminum oxide structure that minimizes damage to a material in the vicinity of a conductor and prevents a problem of delamination between the conductor and a member existing thereon.

公开(公告)号：US20210223507A1

公开(公告)日：2021-07-22

申请号：US17153433

申请日：2021-01-20

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Young Heum EOM ,  Sin Seok HAN

IPC: G02B7/182 ,  G03F7/20 ,  G02B5/10 ,  G02B5/00 ,  G02B27/30

Abstract: Light emission apparatus for an exposure machine is proposed. The light emission apparatus includes: a supporter; a plurality of light emission units individually installed on a first surface of the supporter and each having a plurality of light emitters generating light; and a plurality of reflectors individually installed on the first surface of the supporter to correspond to the light emission units, respectively, in which the reflectors are divided into a first reflective group in which reference axes of reflective beams are horizontal and a second reflective group in which reference axes of reflective beams are inclined.

公开(公告)号：US20210102975A1

公开(公告)日：2021-04-08

申请号：US17029979

申请日：2020-09-23

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01R1/073 ,  G01R31/28

Abstract: Proposed is a probe card for performing a circuit test on a wafer and, more particularly, a probe card capable of realizing a reduction in size and pitch of probe insertion holes.

公开(公告)号：US20210043797A1

公开(公告)日：2021-02-11

申请号：US16534699

申请日：2019-08-07

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/48 ,  H01L27/15

Abstract: The present invention relates to a transfer head and a method of manufacturing a micro LED display using the same. In particular, the present invention relates to a transfer head and a method of manufacturing a micro LED display using the same, the transfer head mounting normal micro LEDs on a display substrate without performing a complicated process of sorting out defective micro LEDs from the micro LEDs mounted on the display substrate and replacing the defective micro LEDs with normal micro LEDs.

公开(公告)号：US20210013259A1

公开(公告)日：2021-01-14

申请号：US16921564

申请日：2020-07-06

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L27/15 ,  H01L33/00 ,  H01L33/56 ,  H01L33/48

Abstract: Disclosed are a micro LED group substrate provided with a plurality of micro LEDs, a method of manufacturing the same, a micro LED display panel, and a method of manufacturing the same. More particularly, disclosed are a micro LED group substrate provided with a plurality of micro LEDs, a method of manufacturing the same, a micro LED display panel, and a method of manufacturing the same, wherein the need for a micro LED replacement process is eliminated.

公开(公告)号：US20200271693A1

公开(公告)日：2020-08-27

申请号：US16794147

申请日：2020-02-18

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01R1/073

Abstract: The present invention provides a guide plate for a probe card. The guide plate for the probe card according to the present invention includes: a first guide plate including a plurality of first pin insertion holes formed therein, and made of an anodic oxide film; and a second guide plate disposed to be spaced apart from the first guide plate by a predetermined distance, and including a plurality of second pin insertion holes through which probe pins passing through the first pin insertion holes pass, wherein a buffer part is provided at least partially on each of an upper portion and a lower portion of the first guide plate.

公开(公告)号：US20200083412A1

公开(公告)日：2020-03-12

申请号：US16563529

申请日：2019-09-06

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: H01L33/50 ,  H01L33/00

Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same that facilitate realizing of pixels of the micro LED structure.

公开(公告)号：US20190308332A1

公开(公告)日：2019-10-10

申请号：US16377083

申请日：2019-04-05

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN ,  Tae Hwan SONG

IPC: B25J15/06 ,  B65G47/91

Abstract: The present invention relates to a micro LED grip body and a system having the same for inspecting a micro LED, the micro LED grip body having a vacuum-suction structure capable of being used for transferring a micro LED, thereby solving problems of micro LED transfer heads that have been proposed in the related art.