公开(公告)号：US20210223507A1

公开(公告)日：2021-07-22

申请号：US17153433

申请日：2021-01-20

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Young Heum EOM ,  Sin Seok HAN

IPC: G02B7/182 ,  G03F7/20 ,  G02B5/10 ,  G02B5/00 ,  G02B27/30

Abstract: Light emission apparatus for an exposure machine is proposed. The light emission apparatus includes: a supporter; a plurality of light emission units individually installed on a first surface of the supporter and each having a plurality of light emitters generating light; and a plurality of reflectors individually installed on the first surface of the supporter to correspond to the light emission units, respectively, in which the reflectors are divided into a first reflective group in which reference axes of reflective beams are horizontal and a second reflective group in which reference axes of reflective beams are inclined.

公开(公告)号：US20240186533A1

公开(公告)日：2024-06-06

申请号：US18285852

申请日：2022-04-07

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Young Heum EOM ,  Sin Seok HAN

IPC: H01M4/90 ,  H01M4/86 ,  H01M8/10 ,  H01M8/1004

CPC classification number: H01M4/9016 ,  H01M4/8605 ,  H01M4/8657 ,  H01M8/1004 ,  H01M2008/1095

Abstract: The present invention provides a membrane-electrode assembly for a fuel cell, and a fuel cell comprising same, wherein the cross-sectional area for reaction activation can be increased compared to the prior art, and the reaction area can be made uniform for each product compared to the prior art by making reaction gases (H2 and O2) undergo an ionization process while reacting with catalyst material, provided on the inner walls of regularly arranged pores, while moving through channels following the pores.

公开(公告)号：US20250044321A1

公开(公告)日：2025-02-06

申请号：US18717410

申请日：2022-12-05

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Young Heum EOM ,  Sin Seok HAN

IPC: G01R1/067 ,  G01R1/073

Abstract: The present invention provides an electrically conductive contact pin for a Kelvin test and a test device comprising same, which can cope with the narrower pitch between electrodes of a semiconductor device.

公开(公告)号：US20160380168A1

公开(公告)日：2016-12-29

申请号：US14753915

申请日：2015-06-29

Applicant: Point Engineering Co., Ltd.

Inventor： Sin Seok HAN ,  Soo Young CHOI ,  Ki Myung NAM

IPC: H01L33/58 ,  H05K1/02 ,  H05K1/03 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L33/58 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62

Abstract: Disclosed is a chip substrate. The chip substrate includes: conductive portions laminated in one direction to constitute the chip substrate; insulation portions alternately laminated with the conductive portions to electrically isolate the conductive portions; a cavity formed at a predetermined depth in a recessed shape in a region including the insulation portions on an upper surface of the chip substrate; and a groove portion disposed outside the cavity in a spaced-apart relationship with the cavity and formed at a predetermined depth in a recessed shape. According to the present invention, an adhesive agent is applied in a groove portion formed in advance. It is therefore possible to prevent the adhesive agent from being exposed to the light emitted from optical elements and to prevent the adhesive agent from being denatured. This makes it possible to enhance the reliability of lens bonding. Furthermore, there is no need to use an expensive resistant adhesive agent. An existing typical adhesive agent may be used as it is. This provides an effect of saving costs. Thus, there is an advantage in that a low-priced existing bonding material may be applied to a high-priced UV-C (deep-UV) package.

Abstract translation: 公开了一种芯片基板。 芯片基板包括：在一个方向上层叠以构成芯片基板的导电部分; 绝缘部分与导电部分交替地层叠以电绝缘导电部分; 在所述芯片基板的上表面的包含所述绝缘部的区域中形成为凹状的预定深度的空腔; 以及凹槽部分，以与空腔间隔开的关系设置在空腔外部，并以预定的凹陷形状形成。 根据本发明，在预先形成的槽部中涂布粘接剂。 因此，可以防止粘合剂暴露于从光学元件发出的光并防止粘合剂变性。 这使得可以提高透镜粘合的可靠性。 此外，不需要使用昂贵的耐热粘合剂。 可以直接使用现有的典型粘合剂。 这提供了节省成本的效果。 因此，优点在于低价格的现有粘合材料可以应用于高价位UV-C（深UV）封装。