公开(公告)号：US11017951B2

公开(公告)日：2021-05-25

申请号：US16441709

申请日：2019-06-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Se Hun Park ,  Gu Won Ji

IPC: H01G4/248 ,  H01G4/30 ,  H01G4/12 ,  H01G4/012

Abstract: A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes, and having first to sixth surfaces; first and second external electrodes including first and second connection portions and first and second band portions, respectively; and first and second connection terminals disposed on the first and second band portions on the first surface of the capacitor body. The first and second connection terminals are each provided with a solder receiving portion to have a symmetrical shape in a direction connecting the third and fourth surfaces and a direction connecting the fifth and sixth surfaces.

公开(公告)号：US10980124B2

公开(公告)日：2021-04-13

申请号：US16507962

申请日：2019-07-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Gu Won Ji ,  Se Hun Park

IPC: H05K1/18 ,  H05K1/11 ,  H01G4/30 ,  H01G4/232 ,  H01G4/248 ,  H01G4/224 ,  H05K1/02 ,  H05K3/30 ,  H01G2/06 ,  H01G4/008 ,  H01G4/12

Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body in which internal electrodes are stacked to be parallel with respect to a mounting surface and external electrodes disposed on opposing end surfaces of the capacitor body, respectively, and a metal frame having a solder pocket and including a vertical portion, an upper horizontal portion extending from an upper end of the vertical portion, and a lower horizontal portion extending from a lower end of the vertical portion, the upper horizontal portion connected to an upper band portion of each of the external electrodes. 0.1≤G/CT≤0.7 is satisfied, in which CT is a height of the vertical portion and G is a distance between the lower band portion of each of the external electrodes and a lower end of the metal frame.

公开(公告)号：US10566137B2

公开(公告)日：2020-02-18

申请号：US15856590

申请日：2017-12-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Se Hun Park ,  Gu Won Ji ,  Heung Kil Park

IPC: H01G4/30 ,  H01G4/232 ,  H01G4/228 ,  H01G4/12 ,  H01G4/01 ,  H01G4/224 ,  H01G2/06 ,  H05K1/02

Abstract: A multilayer electronic component includes: a capacitor body including an active region including first and second internal electrodes and upper and lower cover regions; first and second external electrodes including first and second connected portions connected to the first and second internal electrodes and first and second band portions, respectively; and first and second bump terminals having conductive layers and disposed on the first and second band portions, respectively, wherein BW/3≤G≤BW and T/5

公开(公告)号：US10460875B2

公开(公告)日：2019-10-29

申请号：US16360549

申请日：2019-03-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Jae Yeol Choi ,  Young Ghyu Ahn ,  Soo Hwan Son ,  Se Hun Park ,  Gu Won Ji

IPC: H01G4/232 ,  H05K3/34 ,  H01G4/30 ,  H01G4/012 ,  H05K1/11 ,  H01G4/248 ,  H01G4/12 ,  H05K1/18

Abstract: A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween. One end of each of the first and second internal electrodes extends, respectively, to a third or fourth surface of the capacitor body. First and second external electrodes respectively include first and second connected portions disposed on the third and fourth surfaces, and first and second band portions respectively extended from the first and second connected portions to portions of a first surface of the capacitor body. A first connection terminal is disposed on the first band portion to provide a first solder accommodating portion, and a second connection terminal is disposed on the second band portion to provide a second solder accommodating portion.

公开(公告)号：US10347425B2

公开(公告)日：2019-07-09

申请号：US15810738

申请日：2017-11-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Jae Yeol Choi ,  Young Ghyu Ahn ,  Soo Hwan Son ,  Se Hun Park ,  Gu Won Ji

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/012 ,  H05K1/11 ,  H05K1/18 ,  H01G4/12 ,  H01G4/248

Abstract: A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween. One end of each of the first and second internal electrodes extends, respectively, to a third or fourth surface of the capacitor body. First and second external electrodes respectively include first and second connected portions disposed on the third and fourth surfaces, and first and second band portions respectively extended from the first and second connected portions to portions of a first surface of the capacitor body. A first connection terminal is disposed on the first band portion to provide a first solder accommodating portion, and a second connection terminal is disposed on the second band portion to provide a second solder accommodating portion.

公开(公告)号：US10325722B2

公开(公告)日：2019-06-18

申请号：US15879134

申请日：2018-01-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Gu Won Ji ,  Se Hun Park

IPC: H05K13/04 ,  H01G4/248 ,  H01G4/30 ,  H05K1/18 ,  H05K1/11 ,  H01G4/005

Abstract: A multilayer electronic component includes a capacitor body, a plurality of external electrodes disposed on a mounting surface of the capacitor body to be spaced apart from each other, and a connection terminal including land portions formed of insulators. The land portions have conductor layers formed on surfaces thereof, and are disposed on respective external electrodes. A bridge portion is disposed between land portions adjacent to each other. Cut portions are formed in the land portions. The multilayer electronic component can optionally be mounted on a circuit board having a plurality of electrode pads such that each land portion is mounted to a respective electrode pad of the circuit board.

公开(公告)号：US10192686B1

公开(公告)日：2019-01-29

申请号：US15879827

申请日：2018-01-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Gu Won Ji ,  Se Hun Park

IPC: H05K1/18 ,  H01G4/30 ,  H05K1/02 ,  H01G4/232

Abstract: There are provided a multilayer electronic component and a board having the same. The multilayer electronic component includes: a capacitor body; external electrodes including band portions and connected portions; connection terminals formed of insulators and disposed on the band portions; and insulating portions disposed on at least some circumferential surfaces of the connection terminals. The connection terminals include conductive patterns formed on surfaces thereof facing the band portions and surfaces thereof opposing the surfaces, cut portions are formed in some the circumferential surfaces connecting between the conductive patterns facing each other, connection patterns are formed on the cut portions to electrically connect between the conductive patterns facing each other, and the insulating portions are disposed so as not to cover the cut portions.

公开(公告)号：US10128050B1

公开(公告)日：2018-11-13

申请号：US15834863

申请日：2017-12-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Se Hun Park ,  Gu Won Ji ,  Heung Kil Park

IPC: H01G4/30 ,  H05K1/18 ,  H05K1/11 ,  H01G4/005 ,  H01G4/248 ,  H01G4/12

Abstract: A composite electronic component includes: a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body, and first and second external electrodes disposed on both end portions of the first ceramic body. The ceramic chip includes a second ceramic body disposed on a lower portion of the multilayer ceramic capacitor, and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes. A width of first regions of the second ceramic body in which the first and second terminal electrodes are disposed is wider than a width of a second region of the second ceramic body between the first regions.

公开(公告)号：US10062511B1

公开(公告)日：2018-08-28

申请号：US15812198

申请日：2017-11-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Se Hun Park ,  Gu Won Ji

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/12 ,  H05K1/11 ,  H05K1/18 ,  H01G4/012 ,  H01G4/248

CPC classification number: H01G4/232 ,  H01G2/06 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/248 ,  H01G4/30 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611

Abstract: A multilayer electronic component includes a capacitor body with first and second external electrodes on a mounting surface of the capacitor body. First and second connection terminals include insulators and are respectively connected to the first and second external electrodes. The first connection terminal includes first to third conductive patterns and a first cut portion a side surface. The second connection terminal includes fourth to sixth conductive patterns and a second cut portion in a side surface.