TRANSISTOR AND SEMICONDUCTOR DEVICE
    34.
    发明申请
    TRANSISTOR AND SEMICONDUCTOR DEVICE 有权
    晶体管和半导体器件

    公开(公告)号:US20150069393A1

    公开(公告)日:2015-03-12

    申请号:US14547285

    申请日:2014-11-19

    CPC classification number: H01L29/7869 H01L29/408

    Abstract: Manufactured is a transistor including an oxide semiconductor layer, a source electrode layer and a drain electrode layer overlapping with part of the oxide semiconductor layer, a gate insulating layer overlapping with the oxide semiconductor layer, the source electrode layer, and the drain electrode layer, and a gate electrode overlapping with part of the oxide semiconductor layer with the gate insulating layer provided therebetween, wherein, after the oxide semiconductor layer which is to be a channel formation region is irradiated with light and the light irradiation is stopped, a relaxation time of carriers in photoresponse characteristics of the oxide semiconductor layer has at least two kinds of modes: τ1 and τ2, τ1

    Abstract translation: 制造的是包括与氧化物半导体层的一部分重叠的氧化物半导体层,源极电极层和漏极电极层,与氧化物半导体层重叠的栅极绝缘层,源极电极层和漏极电极层的晶体管, 以及与所述氧化物半导体层的与氧化物半导体层的一部分重叠的栅电极,其间设置有栅极绝缘层,其中,在作为沟道形成区域的氧化物半导体层被照射光并停止光照射之后,弛豫时间 氧化物半导体层的光响应特性中的载流子具有至少两种模式:τ1和τ2,τ1<τ2,τ2为300秒以下。 此外,制造包括晶体管的半导体器件。

    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    35.
    发明申请
    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 审中-公开
    半导体器件的制造方法

    公开(公告)号:US20150044818A1

    公开(公告)日:2015-02-12

    申请号:US14521710

    申请日:2014-10-23

    Abstract: It is an object to provide a manufacturing method of a structure of a thin film transistor including an oxide semiconductor film, in which threshold voltage at which a channel is formed is positive and as close to 0 V as possible. A protective insulating layer is formed to cover a thin film transistor including an oxide semiconductor layer that is dehydrated or dehydrogenated by first heat treatment, and second heat treatment at a temperature that is lower than that of the first heat treatment, in which the increase and decrease in temperature are repeated plural times, is performed, whereby a thin film transistor including an oxide semiconductor layer, in which threshold voltage at which a channel is formed is positive and as close to 0 V as possible without depending on the channel length, can be manufactured.

    Abstract translation: 本发明的目的是提供一种包括氧化物半导体膜的薄膜晶体管的结构的制造方法,其中形成沟道的阈值电压为正且尽可能接近0V。 形成保护绝缘层以覆盖包括通过第一热处理脱水或脱氢的氧化物半导体层的薄膜晶体管,以及在比第一热处理低的温度下进行第二热处理,其中, 重复多次温度的降低,由此,在不影响通道长度的情况下,包含氧化物半导体层的薄膜晶体管,其中形成沟道的阈值电压为正且尽可能接近0V,可以 制造。

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