SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    4.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20140246674A1

    公开(公告)日:2014-09-04

    申请号:US14278634

    申请日:2014-05-15

    Abstract: An object is to provide a semiconductor device including an oxide semiconductor film, which has stable electrical characteristics and high reliability. A stack of first and second material films is formed by forming the first material film (a film having a hexagonal crystal structure) having a thickness of 1 nm to 10 nm over an insulating surface and forming the second material film having a hexagonal crystal structure (a crystalline oxide semiconductor film) using the first material film as a nucleus. As the first material film, a material film having a wurtzite crystal structure (e.g., gallium nitride or aluminum nitride) or a material film having a corundum crystal structure (α-Al2O3, α-Ga2O3, In2O3, Ti2O3, V2O3, Cr2O3, or α-Fe2O3) is used.

    Abstract translation: 本发明的目的是提供一种具有稳定的电气特性和高可靠性的氧化物半导体膜的半导体装置。 通过在绝缘表面上形成厚度为1nm至10nm的第一材料膜(具有六方晶体结构的膜)形成第一和第二材料膜的叠层,并形成具有六方晶系结构的第二材料膜( 使用第一材料膜作为核的结晶氧化物半导体膜)。 作为第一材料膜,具有纤锌矿晶体结构的材料膜(例如氮化镓或氮化铝)或具有刚玉晶体结构的材料膜(α-Al 2 O 3,α-Ga 2 O 3,In 2 O 3,Ti 2 O 3,V 2 O 3,Cr 2 O 3,或 α-Fe 2 O 3)。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    5.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20150340509A1

    公开(公告)日:2015-11-26

    申请号:US14819772

    申请日:2015-08-06

    Abstract: An object is to provide a semiconductor device including an oxide semiconductor film, which has stable electrical characteristics and high reliability. A stack of first and second material films is formed by forming the first material film (a film having a hexagonal crystal structure) having a thickness of 1 nm to 10 nm over an insulating surface and forming the second material film having a hexagonal crystal structure (a crystalline oxide semiconductor film) using the first material film as a nucleus. As the first material film, a material film having a wurtzite crystal structure (e.g., gallium nitride or aluminum nitride) or a material film having a corundum crystal structure (α-Al2O3, α-Ga2O3, In2O3, Ti2O3, V2O3, Cr2O3, or α-Fe2O3) is used.

    Abstract translation: 本发明的目的是提供一种具有稳定的电气特性和高可靠性的氧化物半导体膜的半导体装置。 通过在绝缘表面上形成厚度为1nm至10nm的第一材料膜(具有六方晶体结构的膜)形成第一和第二材料膜的叠层,并形成具有六方晶系结构的第二材料膜( 使用第一材料膜作为核的结晶氧化物半导体膜)。 作为第一材料膜,具有纤锌矿晶体结构的材料膜(例如氮化镓或氮化铝)或具有刚玉晶体结构的材料膜(α-Al 2 O 3,α-Ga 2 O 3,In 2 O 3,Ti 2 O 3,V 2 O 3,Cr 2 O 3,或 α-Fe 2 O 3)。

    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    6.
    发明申请
    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号:US20150069385A1

    公开(公告)日:2015-03-12

    申请号:US14476767

    申请日:2014-09-04

    Abstract: A method for adjusting threshold of a semiconductor device is provided. In a plurality of semiconductor devices each including a semiconductor, a source or drain electrode electrically in contact with the semiconductor, a gate electrode, and a charge trap layer between a gate electrode and the semiconductor, a state where the potential of the gate electrode is set higher than the potential of the source or drain electrode while the semiconductor devices are heated at 150° C. or higher and 300° C. or lower is kept for one second or longer to trap electrons in the charge trap layer, so that the threshold is increased and Icut is reduced. Here, the potential difference between the gate electrode and the source or drain electrode is set so that it is different between the semiconductor devices, and the thresholds of the semiconductor devices are adjusted to be appropriate to each purpose.

    Abstract translation: 提供了一种用于调整半导体器件的阈值的方法。 在多个半导体器件中,每个半导体器件包括半导体,与半导体电接触的源极或漏极,栅电极和栅电极与半导体之间的电荷陷阱层,栅电极的电位为 设定为高于源极或漏极的电位,同时将半导体器件在150℃以上且300℃以下的温度加热保持1秒以上以在电荷陷阱层中捕获电子,使得 阈值增加并且Icut减小。 这里,栅电极和源电极或漏电极之间的电位差被设定为在半导体器件之间不同,并且将半导体器件的阈值调整为适合于每个目的。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    7.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
    半导体器件及制造半导体器件的方法

    公开(公告)号:US20150011046A1

    公开(公告)日:2015-01-08

    申请号:US14313145

    申请日:2014-06-24

    CPC classification number: H01L29/66969 H01L29/4908 H01L29/7869 H01L29/78696

    Abstract: A manufacturing method of a semiconductor device in which the threshold voltage is adjusted is provided. The semiconductor device includes a first semiconductor, an electrode electrically connected to the first semiconductor, a gate electrode, and an electron trap layer between the gate electrode and the first semiconductor. By performing heat treatment at higher than or equal to 125° C. and lower than or equal to 450° C. and, at the same time, keeping a potential of the gate electrode higher than a potential of the electrode for 1 second or more, the threshold voltage is increased.

    Abstract translation: 提供其中调整阈值电压的半导体器件的制造方法。 半导体器件包括第一半导体,电连接到第一半导体的电极,栅极电极和栅电极和第一半导体之间的电子陷阱层。 通过进行高于或等于125℃且低于或等于450℃的热处理,并且同时保持栅电极的电位高于电极的电位1秒以上 ,阈值电压增加。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    8.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
    半导体器件及制造半导体器件的方法

    公开(公告)号:US20150069387A1

    公开(公告)日:2015-03-12

    申请号:US14479623

    申请日:2014-09-08

    Abstract: A method for manufacturing a semiconductor device with adjusted threshold is provided. In a semiconductor device including a semiconductor, a source or drain electrode electrically connected to the semiconductor, a first gate electrode and a second gate electrode between which the semiconductor is provided, a charge trap layer provided between the first gate electrode and the semiconductor, and a gate insulating layer provided between the second gate electrode and the semiconductor, a threshold is increased by trapping electrons in the charge trap layer by keeping a potential of the first gate electrode at a potential higher than a potential of the source or drain electrode for 1 second or more while heating. After the threshold adjustment process, the first gate electrode is removed or insulated from other circuits. Alternatively, a resistor may be provided between the first gate electrode and other circuits.

    Abstract translation: 提供一种用于制造具有调节阈值的半导体器件的方法。 在包括半导体,与半导体电连接的源电极或漏电极的半导体器件中,设置有半导体的第一栅电极和第二栅电极,设置在第一栅电极和半导体之间的电荷陷阱层,以及 设置在第二栅电极和半导体之间的栅极绝缘层,通过将第一栅电极的电位保持在高于源电极或漏电极的电位的电位为1,通过在电荷陷阱层中俘获电子来增加阈值 第二次或多次加热。 在阈值调整处理之后,第一栅电极被去除或与其它电路绝缘。 或者,可以在第一栅极电极和其它电路之间设置电阻器。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    9.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
    半导体器件及制造半导体器件的方法

    公开(公告)号:US20150054548A1

    公开(公告)日:2015-02-26

    申请号:US14464966

    申请日:2014-08-21

    Abstract: A manufacturing method of a semiconductor device in which the threshold is adjusted is provided. In a semiconductor device including a plurality of transistors arranged in a matrix each including a semiconductor, a source or drain electrode electrically connected to the semiconductor, a gate electrode, and a charge trap layer between the gate electrode and the semiconductor, electrons are trapped in the charge trap layer by performing heat treatment and, simultaneously, keeping a potential of the gate electrode higher than that of the source or drain electrode for 1 second or more. By this process, the threshold increases and Icut decreases. A circuit that supplies a signal to the gate electrode (e.g., word line driver) is provided with a selection circuit formed of an OR gate, an XOR gate, or the like, whereby potentials of word lines can be simultaneously set higher than potentials of bit lines.

    Abstract translation: 提供了其中调整阈值的半导体器件的制造方法。 在包括以矩阵形式排列的多个晶体管的半导体器件中,每个晶体管包括半导体,与该半导体电连接的源极或漏极,栅电极和栅电极与半导体之间的电荷陷阱层,电子被俘获在 通过进行热处理,同时使栅电极的电位比源极或漏极的电位高1秒以上。 通过该过程,阈值增加并且Icut减小。 向门电极(例如字线驱动器)提供信号的电路设置有由或门,异或门等形成的选择电路,由此可以将字线的电位同时设置为高于电位 位线。

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