公开(公告)号：US20220359420A1

公开(公告)日：2022-11-10

申请号：US17314916

申请日：2021-05-07

申请人： STATS ChipPAC Pte. Ltd.

发明人： ChangOh Kim ,  KyoungHee Park ,  SeongHwan Park ,  JinHee Jung

IPC分类号： H01L23/552 ,  H01L23/31 ,  H01L23/66 ,  H01Q1/22 ,  H01L21/56 ,  H01L21/48

摘要： A semiconductor device has a first package layer. A first shielding layer is formed over the first package layer. The first shielding layer is patterned to form a redistribution layer. An electrical component is disposed over the redistribution layer. An encapsulant is deposited over the electrical component. A second shielding layer is formed over the encapsulant. The second shielding layer is patterned. The patterning of the first shielding layer and second shielding layer can be done with a laser. The second shielding layer can be patterned to form an antenna.

公开(公告)号：US20220199545A1

公开(公告)日：2022-06-23

申请号：US17126621

申请日：2020-12-18

申请人： STATS ChipPAC Pte. Ltd.

发明人： ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC分类号： H01L23/552 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/033

摘要： A semiconductor device has a semiconductor package including a substrate comprising a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A fanged metal mask is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The fanged metal mask is removed after forming the shielding layer.

公开(公告)号：US20240113038A1

公开(公告)日：2024-04-04

申请号：US18511428

申请日：2023-11-16

申请人： STATS ChipPAC Pte. Ltd.

发明人： ChangOh Kim ,  KyoungHee Park ,  SeongHwan Park ,  JinHee Jung

IPC分类号： H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/66 ,  H01Q1/22

CPC分类号： H01L23/552 ,  H01L21/486 ,  H01L21/56 ,  H01L23/31 ,  H01L23/66 ,  H01Q1/2283

摘要： A semiconductor device has a first package layer. A first shielding layer is formed over the first package layer. The first shielding layer is patterned to form a redistribution layer. An electrical component is disposed over the redistribution layer. An encapsulant is deposited over the electrical component. A second shielding layer is formed over the encapsulant. The second shielding layer is patterned. The patterning of the first shielding layer and second shielding layer can be done with a laser. The second shielding layer can be patterned to form an antenna.

公开(公告)号：US20240063137A1

公开(公告)日：2024-02-22

申请号：US17820957

申请日：2022-08-19

申请人： STATS ChipPAC Pte. Ltd.

发明人： JinHee Jung ,  ChangOh Kim

IPC分类号： H01L23/552 ,  H01L23/00 ,  H01L25/16 ,  H01L23/498 ,  H01L21/48

CPC分类号： H01L23/552 ,  H01L24/16 ,  H01L25/165 ,  H01L25/162 ,  H01L23/49816 ,  H01L23/49838 ,  H01L21/4853 ,  H01L21/4817 ,  H01L2924/3025 ,  H01L2224/16225 ,  H01L2924/16151 ,  H01L2924/1616

摘要： A semiconductor device includes a substrate. An electrical component is disposed over the substrate. An encapsulant is deposited over the electrical component. A vertical interconnect structure is disposed in the encapsulant. A shielding layer is formed over the encapsulant and vertical interconnect structure. A groove is formed in the shielding layer around the vertical interconnect structure. A portion of the shielding layer remains over the vertical interconnect structure as a contact pad.

公开(公告)号：US20240006335A1

公开(公告)日：2024-01-04

申请号：US17810028

申请日：2022-06-30

申请人： STATS ChipPAC Pte. Ltd.

发明人： ChangOh Kim ,  JinHee Jung ,  OMin Kwon

IPC分类号： H01L23/552 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L21/56

CPC分类号： H01L23/552 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565

摘要： A semiconductor device has a substrate. A semiconductor die is disposed over the substrate. A first encapsulant is deposited over the semiconductor die. A ferromagnetic film is disposed over the first encapsulant. A second encapsulant is deposited over the ferromagnetic film. A shielding layer is optionally formed over the substrate, first encapsulant, and second encapsulant.

公开(公告)号：US20230207485A1

公开(公告)日：2023-06-29

申请号：US18174790

申请日：2023-02-27

申请人： STATS ChipPAC Pte. Ltd.

发明人： ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC分类号： H01L23/552 ,  H01L23/00 ,  H01L21/56 ,  H01L21/033 ,  H01L23/31

CPC分类号： H01L23/552 ,  H01L24/13 ,  H01L21/565 ,  H01L21/0334 ,  H01L23/3107 ,  H01L2924/15313

摘要： A semiconductor device has a semiconductor package including a substrate comprising a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A fanged metal mask is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The fanged metal mask is removed after forming the shielding layer.

公开(公告)号：US20230154812A1

公开(公告)日：2023-05-18

申请号：US18154993

申请日：2023-01-16

申请人： STATS ChipPAC Pte. Ltd.

发明人： JinHee Jung ,  ChangOh Kim

IPC分类号： H01L23/31 ,  H01L21/56 ,  H01L23/66 ,  H01L23/60

CPC分类号： H01L23/31 ,  H01L21/565 ,  H01L23/66 ,  H01L23/60

摘要： A semiconductor device has an electronic component assembly with a substrate and a plurality of electrical components disposed over the substrate. A conductive post is formed over the substrate. A molding compound sheet is disposed over the electrical component assembly. A carrier including a first electrical circuit pattern is disposed over the molding compound sheet. The carrier is pressed against the molding compound sheet to dispose a first encapsulant over and around the electrical component assembly and embed the first electrical circuit pattern in the first encapsulant. A shielding layer can be formed over the electrical components assembly. The carrier is removed to expose the first electrical circuit pattern. A second encapsulant is deposited over the first encapsulant and the first electrical circuit pattern. A second electrical circuit pattern is formed over the second encapsulant. A semiconductor package is disposed over the first electrical circuit pattern.

公开(公告)号：US11616025B2

公开(公告)日：2023-03-28

申请号：US17126621

申请日：2020-12-18

申请人： STATS ChipPAC Pte. Ltd.

发明人： ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC分类号： H01L23/552 ,  H01L23/00 ,  H01L21/56 ,  H01L21/033 ,  H01L23/31

摘要： A semiconductor device has a semiconductor package including a substrate comprising a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A fanged metal mask is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The fanged metal mask is removed after forming the shielding layer.

公开(公告)号：US11610847B2

公开(公告)日：2023-03-21

申请号：US17314916

申请日：2021-05-07

申请人： STATS ChipPAC Pte. Ltd.

发明人： ChangOh Kim ,  KyoungHee Park ,  SeongHwan Park ,  JinHee Jung

IPC分类号： H01L23/552 ,  H01L21/56 ,  H01L23/66 ,  H01L23/31 ,  H01L21/48 ,  H01Q1/22

摘要： A semiconductor device has a first package layer. A first shielding layer is formed over the first package layer. The first shielding layer is patterned to form a redistribution layer. An electrical component is disposed over the redistribution layer. An encapsulant is deposited over the electrical component. A second shielding layer is formed over the encapsulant. The second shielding layer is patterned. The patterning of the first shielding layer and second shielding layer can be done with a laser. The second shielding layer can be patterned to form an antenna.

公开(公告)号：US11581233B2

公开(公告)日：2023-02-14

申请号：US17307795

申请日：2021-05-04

申请人： STATS ChipPAC Pte. Ltd.

发明人： JinHee Jung ,  ChangOh Kim

IPC分类号： H01L23/31 ,  H01L23/60 ,  H01L23/66 ,  H01L21/56

摘要： A semiconductor device has an electronic component assembly with a substrate and a plurality of electrical components disposed over the substrate. A conductive post is formed over the substrate. A molding compound sheet is disposed over the electrical component assembly. A carrier including a first electrical circuit pattern is disposed over the molding compound sheet. The carrier is pressed against the molding compound sheet to dispose a first encapsulant over and around the electrical component assembly and embed the first electrical circuit pattern in the first encapsulant. A shielding layer can be formed over the electrical components assembly. The carrier is removed to expose the first electrical circuit pattern. A second encapsulant is deposited over the first encapsulant and the first electrical circuit pattern. A second electrical circuit pattern is formed over the second encapsulant. A semiconductor package is disposed over the first electrical circuit pattern.