MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN
    32.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN 有权
    多层陶瓷电子元件嵌入板和印刷电路板上嵌有多层陶瓷电子元件

    公开(公告)号:US20150122535A1

    公开(公告)日:2015-05-07

    申请号:US14171306

    申请日:2014-02-03

    Abstract: There is provided a multilayer ceramic electronic component to be embedded in a board including: a ceramic body including dielectric layers and having first and second main surfaces opposing one another, first and second lateral surfaces opposing one another, and first and second end surfaces opposing one another; first and second internal electrodes stacked to be spaced apart from both end surfaces of the ceramic body at a predetermined distance with the dielectric layers interposed therebetween, respectively; and first and second external electrodes formed in both end portions of the ceramic body, wherein the first and second external electrodes include first and second base electrodes and first and second terminal electrodes formed on the first and second base electrodes, respectively, and a non-conductive paste layer is formed on both lateral surfaces of the ceramic body.

    Abstract translation: 本发明提供一种嵌入板的多层陶瓷电子部件,包括:陶瓷体,其包括电介质层,并具有彼此相对的第一和第二主表面,彼此相对的第一和第二侧表面以及与其相对的第一和第二端面 另一个; 第一和第二内部电极分别堆叠成与陶瓷体的两个端面间隔开预定的距离,介电层插入其间; 以及形成在所述陶瓷体的两端部的第一外部电极和第二外部电极,其中,所述第一外部电极和所述第二外部电极分别包括形成在所述第一和第二基极上的第一和第二基极以及形成在所述第一和第二基极上的第一和第二端子电极, 导电浆料层形成在陶瓷体的两个侧表面上。

    MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN
    33.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN 有权
    多层陶瓷电子部件嵌入板和印刷电路板上嵌有多层陶瓷电子部件

    公开(公告)号:US20150053471A1

    公开(公告)日:2015-02-26

    申请号:US14083017

    申请日:2013-11-18

    Abstract: A multilayer ceramic electronic part to be embedded in a board includes a ceramic body including dielectric layers and having main surfaces, side surfaces, and end surfaces; first and second internal electrodes including first and second leads exposed to the main surfaces; and first and second external electrodes formed on the end surfaces and extending to the main surfaces, wherein when a length from one of ends of the first or second external electrode formed on the main surfaces to a point at which the first or second external electrode contacts the first and second leads is G, a length from one of the ends of the first or second external electrode to the end surfaces is BW, and a length from the end surfaces to a point at which the first or second external electrode contacts the first and second leads is M, 30 μm≦G

    Abstract translation: 要嵌入板中的多层陶瓷电子部件包括:陶瓷体,其包括电介质层,并具有主表面,侧表面和端表面; 第一和第二内部电极,包括暴露于主表面的第一和第二引线; 以及形成在所述端面上并延伸到所述主表面的第一外部电极和第二外部电极,其中,当形成在所述主表面上的所述第一或第二外部电极的一端的一端到所述第一或第二外部电极接触点 第一和第二引线是G,从第一或第二外部电极的端部之一到端面的长度为BW,以及从端面到第一或第二外部电极接触第一外部电极的点的长度 第二引线为M,30μm≦̸满足G

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