公开(公告)号：USD986898S1

公开(公告)日：2023-05-23

申请号：US29805766

申请日：2021-08-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Seon Gyun Baek ,  Won-Gi Hong

Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a bottom perspective view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.

公开(公告)号：USD986249S1

公开(公告)日：2023-05-16

申请号：US29805777

申请日：2021-08-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Seon Gyun Baek ,  Won-Gi Hong

Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a bottom perspective view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.

公开(公告)号：US11507148B2

公开(公告)日：2022-11-22

申请号：US16909337

申请日：2020-06-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hanhong Lee ,  Jaehong Park ,  Yusuf Cinar ,  Seongyun Baek

IPC: G06F1/18 ,  F21V33/00 ,  F21V17/10 ,  F21Y115/10

Abstract: The present disclosure relates to a portable solid-state drive (SSD) module. The portable SSD module includes a case, an SSD, a light-emitting device (LED) module and a main bracket. The case may have a window. The SSD may be arranged in the case. The LED module may be arranged in the case to indicate an operation of the SSD through the window. The main bracket may be arranged in the case to support the LED module. Therefore, the LED module may be readily and firmly combined with the case.

公开(公告)号：US11490509B2

公开(公告)日：2022-11-01

申请号：US17358800

申请日：2021-06-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunki Yun ,  Kwangkyu Bang ,  Jihong Kim ,  Eunji Yu ,  Kyungjae Kim ,  Yusuf Cinar

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

Abstract: A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.

公开(公告)号：US11317540B2

公开(公告)日：2022-04-26

申请号：US16985290

申请日：2020-08-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchul Hur ,  Jaehong Park ,  Bumjun Kim ,  Yusuf Cinar ,  Hanhong Lee ,  Youngseok Hong ,  Doil Kong ,  Jaeheon Ma

IPC: H05K7/20 ,  H05K1/02 ,  G11B33/14

Abstract: A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.

公开(公告)号：US11112071B2

公开(公告)日：2021-09-07

申请号：US16878925

申请日：2020-05-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongyun Baek ,  Jaehong Park ,  Yusuf Cinar ,  Hanhong Lee

IPC: F21K9/69 ,  G06F1/16 ,  F21V5/02 ,  G06F3/06 ,  F21Y115/10

Abstract: An LED module may include at least one LED and an indicator. The indicator may include one or more diffusing surfaces defining an angular diffusing groove. The diffusing groove may receive the LED such that the LED is at least partially located within a volume space defined by the one or more diffusing surfaces. The diffusing groove may diffuse a light emitted from the LED and incident on the one or more diffusing surface of the diffusing groove such that the light is diffused into an interior of the indicator.

公开(公告)号：US20170094781A1

公开(公告)日：2017-03-30

申请号：US15176778

申请日：2016-06-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-Kyu Bang ,  Yusuf Cinar ,  Hwi-Jong Yoo

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H05K1/0269 ,  H05K1/0296 ,  H05K1/115 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/09727 ,  H05K2201/10159

Abstract: A memory module includes a module board extending in one direction, a plurality of electronic elements mounted on the module board, and at least one stress detection pattern in a position between the electronic elements or adjacent to one or more of the electronic elements on the module board and including a plurality of strips configured to indicate a stress level generated in the position by an external force applied to the module board.