摘要:
A radiation detection apparatus comprising semiconductor substrates each having a first surface on which a photoelectric conversion portion is formed and a second surface opposite to the first surface; a scintillator layer, placed over the first surfaces of the semiconductor substrates, for converting radiation into light; and an elastic member, placed between a base and the second surfaces, for supporting the second surfaces of the semiconductor substrates such that the first surfaces of the semiconductor substrates are flush with each other is provided. In measurement of the elastic member as a single body, an amount of stretch of a cubic specimen in a direction parallel to the first surface when being compressed in a direction perpendicular to the first surface is smaller than an amount of stretch of the specimen in the direction perpendicular to the first surface when being compressed in the direction parallel to the first surface.
摘要:
A radiation image pickup apparatus includes a base which transmits ultraviolet rays, a plurality of image pickup elements, a scintillator, at least one ultraviolet peelable adhesive arranged between the base and the image pickup elements so as to fix the base and the image pickup elements in a predetermined position with respect to each other, and a heat peelable adhesive arranged between the image pickup elements and the scintillators so as to fix the image pickup elements to the scintillator.
摘要:
A scintillator includes a scintillator layer which converts radiation into light, the scintillator layer having a first end forming part of a contour of the scintillator layer and a second end forming another part of the contour, wherein the first end and the second end are located on opposite sides of the scintillator layer when viewed from the center of the scintillator layer, wherein an efficiency of conversion from radiation into light decreases from the first end to the second end.
摘要:
A radiation imaging apparatus including: a plurality of conversion elements being arranged in one-dimensional or two-dimensional array on a substrate, and converting an incident radiation into an electric signal; and a light source for calibration emitting a light to the conversion elements. During a light output adjustment period for driving the light source, a driving level of the light source is adjusted based on a control signal produced by comparing an output signal from a conversion element with a predetermined initial output signal.
摘要:
A radiation imaging apparatus includes a substrate, at least one imaging element, a scintillator, a first heat peelable adhesive member which fixes the substrate to the imaging element, and a second heat peelable adhesive member which fixes the imaging element to the scintillator. An adhesive strength of the first heat peelable member is decreased by heat. A temperature of the first heat peelable adhesive member at which the adhesive strength is decreased is substantially equal to a temperature at which second heat peelable adhesive member fixes the imaging element to the scintillator. A heat transfer quantity per unit time of the substrate is different from that of the scintillator.
摘要:
The present invention provides a radiation image pickup apparatus in which one or more image pickup elements are easily exchanged.A radiation image pickup apparatus includes a base, at least one image pickup element, a scintillator, a first heat peelable adhesive layer which is arranged between the base and the image pickup element and which fixes the base and the image pickup element, and a second heat peelable adhesive layer which is arranged between the image pickup element and the scintillator and which fixes the image pickup element and the scintillator, and in the radiation image pickup element described above, the first heat peelable adhesive layer contains first heat-expandable microspheres, the second heat peelable adhesive layer contains second heat-expandable microspheres, and the first heat-expandable microspheres have a different expansion starting temperature from that of the second heat-expandable microspheres.
摘要:
A radiation image pickup apparatus includes a base which transmits ultraviolet rays, a plurality of image pickup elements, a scintillator, at least one ultraviolet peelable adhesive arranged between the base and the image pickup elements so as to fix the base and the image pickup elements in a predetermined position with respect to each other, and a heat peelable adhesive arranged between the image pickup elements and the scintillators so as to fix the image pickup elements to the scintillator.
摘要:
A radiation detection apparatus comprising semiconductor substrates each having a first surface on which a photoelectric conversion portion is formed and a second surface opposite to the first surface; a scintillator layer, placed over the first surfaces of the semiconductor substrates, for converting radiation into light; and an elastic member, placed between a base and the second surfaces, for supporting the second surfaces of the semiconductor substrates such that the first surfaces of the semiconductor substrates are flush with each other is provided. In measurement of the elastic member as a single body, an amount of stretch of a cubic specimen in a direction parallel to the first surface when being compressed in a direction perpendicular to the first surface is smaller than an amount of stretch of the specimen in the direction perpendicular to the first surface when being compressed in the direction parallel to the first surface.
摘要:
In a photoelectric conversion apparatus obtained by arranging and fixing a plurality of semiconductor element substrates onto a base with an adhesive, the levels of the upper surfaces of the substrates are adjusted with a desired thickness of the adhesive so as to set the upper surfaces within the same plane while the distance from the upper surface of the base to the semiconductor element surface of each substrate is kept to a design value, thereby realizing a photoelectric conversion apparatus constituted by a plurality of substrates arranged two-dimensionally, which eliminates level gaps between the substrate, and hence is free from problems such as a decrease in resolution, a deterioration in sensitivity, and peeling of a phosphor and the like.
摘要:
In a photoelectric conversion apparatus obtained by arranging and fixing a plurality of semiconductor element substrates onto a base with an adhesive, the levels of the upper surfaces of the substrates are adjusted with a desired thickness of the adhesive so as to set the upper surfaces within the same plane while the distance from the upper surface of the base to the semiconductor element surface of each substrate is kept to a design value, thereby realizing a photoelectric conversion apparatus constituted by a plurality of substrates arranged two-dimensionally, which eliminates level gaps between the substrates, and hence is free from problems such as a decrease in resolution, a deterioration in sensitivity, and peeling of a phosphor and the like.