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37 条记录 (耗时 0.033 秒)

    CLEANING SHEET, TRANSFER MEMBER PROVIDED WITH CLEANING FUNCTION, AND METHOD FOR CLEANING SUBSTRATE PROCESSING APPARATUS
    31.
    发明申请
    CLEANING SHEET, TRANSFER MEMBER PROVIDED WITH CLEANING FUNCTION, AND METHOD FOR CLEANING SUBSTRATE PROCESSING APPARATUS 失效
    清洁片，具有清洁功能的转移构件以及清洁基板处理装置的方法

    公开(公告)号：US20110088721A1

    公开(公告)日：2011-04-21

    申请号：US12977762

    申请日：2010-12-23

    申请人： Daisuke Uenda ,  Yukio Arimitsu ,  Yoshio Terada ,  Yasuhiro Amano ,  Akihisa Murata

    发明人： Daisuke Uenda ,  Yukio Arimitsu ,  Yoshio Terada ,  Yasuhiro Amano ,  Akihisa Murata

    IPC分类号： B08B1/00

    CPC分类号： B08B1/00 ,  B08B7/0028 ,  H01L21/02096 ,  Y10T428/24355 ,  Y10T428/2457 ,  Y10T428/24612 ,  Y10T428/31

    摘要： A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 μm or less and a maximum height Rz of 1.0 μm or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.

    摘要翻译： 一种清洁片，包括具有0.05微米以下的算术平均粗糙度Ra和1.0微米或更小的最大高度Rz的微细凹凸形状的清洁层。 优选地，每1mm平坦表面的清洁层的基本表面积为1mm 2的平坦区域的硅晶片镜表面的基本表面积的150％或更多。 清洁片可以设置在转印构件的至少一个表面上，使得转印构件具有清洁功能。 当清洁片或具有清洁功能的转印元件在衬底处理设备中转移以代替待处理衬底时，清洁片接触并清洁衬底处理设备的位置。

    Heat-peelable pressure-sensitive adhesive sheet
    32.
    发明授权
    Heat-peelable pressure-sensitive adhesive sheet 失效
    热剥离性粘合片

    公开(公告)号：US07214424B2

    公开(公告)日：2007-05-08

    申请号：US10123113

    申请日：2002-04-17

    申请人： Kazuyuki Kiuchi ,  Toshiyuki Oshima ,  Akihisa Murata ,  Yukio Arimitsu

    发明人： Kazuyuki Kiuchi ,  Toshiyuki Oshima ,  Akihisa Murata ,  Yukio Arimitsu

    IPC分类号： B32B7/12

    CPC分类号： H01L21/6836 ,  C09J7/38 ,  C09J2201/36 ,  C09J2205/11 ,  C09J2433/00 ,  C09J2467/006 ,  H01L2221/68327 ,  Y10S428/901 ,  Y10T428/249987 ,  Y10T428/249991 ,  Y10T428/249992 ,  Y10T428/28 ,  Y10T428/2817 ,  Y10T428/2852

    摘要： A heat-peelable adhesive sheet which shows small increase in the degree of contamination caused by a heat treatment for lowering an adhesive force is disclosed. The heat-peelable pressure sensitive adhesive sheet comprises a heat-expandable layer containing heat-expandable microspheres and expanding upon heating, and a non-heat expandable pressure-sensitive adhesive layer formed on at least one side thereof. The heat-peelable pressure-sensitive adhesive sheet can achieve the desired adhesive properties such as an excellent adhesive force before heating and also show a quick lowering of the adhesive force upon heating. Further, it shows small increase in the degree of contamination due to the treatment for lowering the adhesive force. Due to those characteristics, the heat-peelable pressure-sensitive adhesive sheet is practically applicable to, for example, the production of electronic parts made of thinner semiconductor wafers.

    摘要翻译： 公开了一种可降低粘合力的热处理引起的污染程度小的可热剥离的粘合片。 可热剥离的压敏粘合片包括含有热膨胀性微球并在加热时膨胀的热膨胀层，以及在其至少一侧上形成的不可热膨胀的压敏粘合剂层。 可热剥离的粘合片可以达到所需的粘合性能，例如加热前的优异的粘合力，并且还显示加热时粘合力的快速降低。 此外，由于用于降低粘合力的处理，显示出小的污染程度的增加。 由于这些特征，可热剥离的粘合片实际上可应用于例如制造由较薄的半导体晶片制成的电子部件。

    Photopolymerizable composition and photosensitive lithographic printing plate
    37.
    发明授权
    Photopolymerizable composition and photosensitive lithographic printing plate 失效
    光聚合组合物和光敏平版印刷版

    公开(公告)号：US5738974A

    公开(公告)日：1998-04-14

    申请号：US520724

    申请日：1995-08-29

    申请人： Hideki Nagasaka ,  Toshiyuki Urano ,  Akihisa Murata

    发明人： Hideki Nagasaka ,  Toshiyuki Urano ,  Akihisa Murata

    IPC分类号： G03F7/029

    CPC分类号： G03F7/029 ,  Y10S430/12 ,  Y10S430/121 ,  Y10S430/127 ,  Y10S430/148

    摘要： A photopolymerizable composition comprising an addition polymerizable compound having at least one ethylenically unsaturated double bond and a photopolymerization initiator system, wherein the photopolymerization initiator system comprises: (a) a titanocene compound, and (b) at least one coumarin compound of the following formula (I): ##STR1## wherein (i) each of R.sup.1, R.sup.2 and R.sup.5 is a hydrogen atom, a halogen atom, an alkyl group or an alkoxy group, each of R.sup.3 and R.sup.4 is an alkyl group, provided that at least one of R.sup.3 and R.sup.4 is a C.sub.4-16 alkyl group, or (ii) R.sup.1 is a hydrogen atom, a halogen atom, an alkyl group or an alkoxy group, and at least one set of R.sup.2 and R.sup.3, and R.sup.4 and R.sup.5, is connected to form an alkylene group substituted by a lower alkyl group, provided that when they do not form the connecting group, each of R.sup.2 and R.sup.5 is a hydrogen atom, a halogen atom, an alkyl group or an alkoxy group, and each of R.sup.3 and R.sup.4 is an alkyl group; R.sup.6 is a hydrogen atom, an alkyl group, an alkoxy group, an acyl group, a cyano group, or a carboxyl group or a group of its ester derivative or amide derivative, and R.sup.7 is a heterocyclic residue having a total number of carbon atoms of from 3 to 17.

    摘要翻译： 一种可光聚合组合物，其包含具有至少一个烯属不饱和双键的加成聚合化合物和光聚合引发剂体系，其中所述光聚合引发剂体系包括：（a）二茂钛化合物和（b）至少一种下式的香豆素化合物 I）：其中（i）R1，R2和R5各自为氢原子，卤素原子，烷基或烷氧基，R3和R4各自为烷基，条件是在 R3和R4中的至少一个是C4-16烷基，或（ii）R1是氢原子，卤素原子，烷基或烷氧基，以及至少一个R2和R3以及R4和R5， 连接形成被低级烷基取代的亚烷基，条件是当它们不形成连接基团时，R 2和R 5各自为氢原子，卤素原子，烷基或烷氧基，R 3 R4为烷基; R6为氢原子，烷基，烷氧基，酰基，氰基或羧基或其酯衍生物或酰胺衍生物的基团，R7为碳原子数为 从3到17。