公开(公告)号：US20250096449A1

公开(公告)日：2025-03-20

申请号：US18966756

申请日：2024-12-03

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Bichoy BAHR ,  Benjamin Stassen COOK ,  Scott R. SUMMERFELT

IPC: H01P3/12 ,  H01L23/31 ,  H01L25/18 ,  H05K1/18

Abstract: In some examples, a package includes a semiconductor die having a first surface and a second surface opposing the first surface, the semiconductor die including circuitry in the first surface. The package also includes an acoustic waveguide in the semiconductor die, the acoustic waveguide including an array of capacitors and a connector coupling the circuitry to the acoustic waveguide.

公开(公告)号：US20220406738A1

公开(公告)日：2022-12-22

申请号：US17732822

申请日：2022-04-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Swaminathan SANKARAN ,  Adam FRUEHLING ,  Baher HAROUN ,  Scott Robert SUMMERFELT ,  Benjamin Stassen COOK

IPC: H01L23/66 ,  H01Q1/22 ,  H01Q9/04

Abstract: An integrated circuit (IC) includes a semiconductor substrate having a first surface and a second surface opposite the first surface. A through wafer trench (TWT) extends from the first surface of the semiconductor substrate to the second surface of the semiconductor substrate. Dielectric material is in the TWT. An interconnect region has layers of dielectric on the first surface of the substrate. The interconnect region has a conductive transmit patch. An antenna is formed, at least in part, by the dielectric material in the TWT and the transmit patch in the interconnect region. The antenna is configured to transmit or receive electromagnetic radiation between the transmit patch and the second surface of the semiconductor substrate through the dielectric material within the trench.

公开(公告)号：US20220399628A1

公开(公告)日：2022-12-15

申请号：US17347365

申请日：2021-06-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Bichoy BAHR ,  Benjamin Stassen COOK ,  Scott R. SUMMERFELT

IPC: H01P3/12 ,  H05K1/18 ,  H01L25/18 ,  H01L23/31

Abstract: In some examples, a package comprises a semiconductor die having a first surface and a second surface opposing the first surface, the semiconductor die including circuitry formed in the first surface. The package includes an acoustic waveguide in the semiconductor die, the acoustic waveguide including an array of capacitors. The array of capacitors includes a transducer portion and a diffraction grating portion. The transducer portion is configured to convert signals between electrical signals and acoustic waves, and the diffraction grating portion is configured to direct the acoustic waves toward and receive the acoustic waves from the second surface.

公开(公告)号：US20220252637A1

公开(公告)日：2022-08-11

申请号：US17732475

申请日：2022-04-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Scott Robert SUMMERFELT ,  Benjamin Stassen COOK

IPC: G01P21/00 ,  G01P15/09

Abstract: A method includes measuring a temperature of a semiconductor die, in which the semiconductor die includes a piezoelectric device, a pyroelectric device, and a memory. The method further includes receiving a first signal from the pyroelectric device, and based on the first signal, determining a parameter to be combined with a second signal from the piezoelectric device. The method further includes storing the parameter and the measured temperature into the memory.

公开(公告)号：US20220250909A1

公开(公告)日：2022-08-11

申请号：US17729121

申请日：2022-04-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Luigi COLOMBO ,  Nazila DADVAND ,  Benjamin Stassen COOK ,  Archana VENUGOPAL

IPC: C01B21/064 ,  C23C16/34 ,  C23C18/32 ,  C23C18/16 ,  C23C18/36 ,  C23C18/28 ,  C23C18/30 ,  C23C18/20

Abstract: A microstructure comprises a plurality of interconnected units wherein the units are formed of hexagonal boron nitride (h-BN) tubes. The graphene tubes may be formed by photo-initiating the polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice, removing unpolymerized monomer, coating the polymer microlattice with a metal, removing the polymer microlattice to leave a metal microlattice, depositing an h-BN precursor on the metal microlattice, converting the h-BN precursor to h-BN, and removing the metal microlattice.

公开(公告)号：US20220102307A1

公开(公告)日：2022-03-31

申请号：US17544888

申请日：2021-12-07

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Scott Robert SUMMERFELT ,  Benjamin Stassen COOK ,  Ralf Jakobskrueger MUENSTER ,  Sreenivasan Kalyani KODURI

IPC: H01L23/00

Abstract: In some examples, an electronic device comprises a first component having a surface, a second component having a surface, and a bond layer positioned between the surfaces of the first and second components to couple the first and second components to each other. The bond layer includes a set of metallic nanowires and a dielectric portion. The dielectric portion comprises a polymer matrix and dielectric nanoparticles.

公开(公告)号：US20210218125A1

公开(公告)日：2021-07-15

申请号：US17116668

申请日：2020-12-09

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hassan Omar ALI ,  Benjamin Stassen COOK

IPC: H01Q1/22 ,  H01Q1/38 ,  H01Q23/00 ,  H01Q21/00

Abstract: A device comprises an integrated circuit (IC) die, a substrate, a printed circuit board (PCB), an antenna, and a waveguide stub. The IC die is affixed to the substrate, which comprises a signal launch on a surface of the substrate that is configured to emit or receive a signal. The substrate and the antenna are affixed to the PCB, such that the signal launch and a waveguide opening of the antenna are aligned and comprise a signal channel. The waveguide stub is arranged as a boundary around the signal channel. In some implementations, the waveguide stub has a height of λ/4, where λ represents a wavelength of the signal. In some implementations, the antenna includes the waveguide stub; in others, the substrate includes the waveguide stub.

公开(公告)号：US20210025948A1

公开(公告)日：2021-01-28

申请号：US16521053

申请日：2019-07-24

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jo BITO ,  Benjamin Stassen COOK ,  Dok Won LEE ,  Keith Ryan GREEN ,  Ricky Alan JACKSON ,  William David FRENCH

IPC: G01R33/00 ,  G01R33/07

Abstract: A structure includes a substrate which includes a surface. The structure also includes a horizontal-type Hall sensor positioned within the substrate and below the surface of the substrate. The structure further includes a patterned magnetic concentrator positioned above the surface of the substrate, and a protective overcoat layer positioned above the magnetic concentrator.

公开(公告)号：US20200321304A1

公开(公告)日：2020-10-08

申请号：US16843717

申请日：2020-04-08

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Scott Robert SUMMERFELT ,  Benjamin Stassen COOK ,  Ralf Jakobskrueger MUENSTER ,  Sreenivasan Kalyani KODURI

IPC: H01L23/00

Abstract: In some examples, an electronic device comprises a first component having a surface, a second component having a surface, and a bond layer positioned between the surfaces of the first and second components to couple the first and second components to each other. The bond layer includes a set of metallic nanowires and a dielectric portion. The dielectric portion comprises a polymer matrix and dielectric nanoparticles.

公开(公告)号：US20190206793A1

公开(公告)日：2019-07-04

申请号：US16236101

申请日：2018-12-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Archana VENUGOPAL ,  Benjamin Stassen COOK ,  Nazila DADVAND ,  Luigi COLOMBO

IPC: H01L23/528 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532 ,  C01B32/184

Abstract: A structure for a semiconductor device includes a dielectric layer and a metal layer. The structure also includes a plurality of unit cells. Each unit cell is formed of interconnected segments. The plurality of unit cells forms a lattice. The lattice is between the dielectric layer and the metal layer.