Communication apparatus, information processing device, and external cable connection method
    31.
    发明申请
    Communication apparatus, information processing device, and external cable connection method 有权
    通信装置,信息处理装置和外部电缆连接方法

    公开(公告)号:US20080068788A1

    公开(公告)日:2008-03-20

    申请号:US11984630

    申请日:2007-11-20

    IPC分类号: G06F1/16 H05K5/00 H05K7/00

    摘要: A communication apparatus which occupies small space and yet can be connected with numerous external cables and which permits a cooling arrangement to be constructed at low cost. An information processing device constituting the communication apparatus has external cable connection ports provided on both top and bottom surfaces thereof, and thus, more external cables can be connected than in the case of connecting the cables to the side surfaces. Also, the external cables connected to the ports are guided along the top and bottom surfaces toward the front of the communication apparatus with their heights restricted by external cable covers and, therefore, do not occupy substantial space above and below the device. Further, since the external cables are connected to the top and bottom surfaces, the front and rear surfaces of the device have spare space, making it possible to construct a ventilation arrangement such as vent holes and fans.

    摘要翻译: 一种通信设备,其占用较小的空间,并且可以与许多外部电缆连接,并且允许以低成本构造冷却装置。 构成通信装置的信息处理装置具有设置在其上表面和底表面上的外部电缆连接端口,因此可以连接更多的外部电缆,而不是将电缆连接到侧面。 此外,连接到端口的外部电缆沿着顶部和底部表面朝向通信设备的前部被引导,其高度由外部电缆盖限制,因此在设备上方和下方不占据实质空间。 此外,由于外部电缆连接到顶表面和底表面,所以装置的前表面和后表面具有备用空间,使得可以构造诸如通气孔和风扇的通风装置。

    Thin film deposition method and thin film deposition apparatus
    32.
    发明授权
    Thin film deposition method and thin film deposition apparatus 有权
    薄膜沉积法和薄膜沉积装置

    公开(公告)号:US07291357B2

    公开(公告)日:2007-11-06

    申请号:US10330385

    申请日:2002-12-26

    IPC分类号: B05D5/06

    摘要: A thin film deposition method for producing an optical film with an optical characteristic on a deposition substrate in a vacuum chamber is provided. The method may include preparing in the vacuum chamber a deposition source which is a source of the film producing material; holding the deposition substrate with a substrate holding member; arranging the deposition substrate and the deposition source such that, given that a vertical distance from the center of the deposition substrate to the deposition source is defined as ZK and a horizontal distance between the deposition substrate and the deposition source as Xk, Xk/Zk is set to satisfy a following equation 0.48≦Xk/Zk≦0.78; rotating the deposition substrate on a rotational axis which is orthogonal to the deposition substrate; and evaporating the film producing material of the deposition source to perform deposition on the deposition substrate.

    摘要翻译: 提供了一种用于在真空室中在沉积基板上制造具有光学特性的光学膜的薄膜沉积方法。 该方法可以包括在真空室中制备作为成膜材料源的沉积源; 用衬底保持构件保持沉积衬底; 布置沉积基板和沉积源,使得考虑到从沉积基板的中心到沉积源的垂直距离被定义为ZK,并且沉积基板和沉积源之间的水平距离为Xk,Xk / Zk为 设定为满足以下等式0.48 <= Xk / Zk <= 0.78; 使沉积衬底旋转在与沉积衬底正交的旋转轴上; 蒸发沉积源的薄膜生成材料,以在沉积基板上进行沉积。

    Electronic device and thermal type flow meter on vehicle
    34.
    发明授权
    Electronic device and thermal type flow meter on vehicle 有权
    汽车电子设备和热式流量计

    公开(公告)号:US07255837B2

    公开(公告)日:2007-08-14

    申请号:US10247628

    申请日:2002-09-20

    摘要: An airtight configuration for keeping down the permeation of corrosive gas from silicone adhesive, and for preventing corrosive gas from entering the case.An electronic device mounted on vehicle. The electronic device has at least one of a portion connecting components, and a portion sealing the clearance or hole where exists in the electronic device.The at least one of the connection portion and the seal portion is constituted by using adhesive or sealant which has at least one of a function adsorbing corrosive gas and a function trapping corrosive gas with chemical reaction.A car-mounted electronic device characterized by reduced permeation of corrosive gas into a case and high reliability.

    摘要翻译: 用于防止腐蚀性气体从硅酮粘合剂渗透并防止腐蚀性气体进入壳体的气密配置。 安装在车辆上的电子设备。 电子设备具有连接部件的部分和密封电子设备中存在的间隙或孔的部分中的至少一个。 连接部和密封部中的至少一个由使用具有吸附腐蚀性气体的功能和捕获具有化学反应的腐蚀性气体的功能中的至少一种的粘合剂或密封剂构成。 一种车载电子设备,其特征在于将腐蚀性气体渗透到壳体中并具有高可靠性。

    Temperature-sensing device
    35.
    发明申请
    Temperature-sensing device 审中-公开
    温度感应装置

    公开(公告)号:US20070018778A1

    公开(公告)日:2007-01-25

    申请号:US11491114

    申请日:2006-07-24

    申请人: Hiroyuki Abe

    发明人: Hiroyuki Abe

    IPC分类号: H01C7/13

    摘要: A temperature-sensing device includes an element with a resistance value varying with a temperature change, a lead extending on the axis of the element, and a resin coat surrounding the element, wherein a number of hydrophobic inorganic fillers with an average particle size of 5 μm or less exist on a surface of the resin coat. The temperature sensor may have a sealing electrode electrically connected to each end of the element, the lead being electrically connected to each of the sealing electrodes and extending on the axis direction of a composite body formed of the element and the sealing electrode, and an inorganic insulating member surrounding the element and covering at least part of the sealing electrodes, the resin coat covering at least a connecting portion between the electrode and the lead wire.

    摘要翻译: 温度检测装置包括具有随温度变化而变化的电阻值的元件,在该元件的轴线上延伸的引线和围绕该元件的树脂涂层,其中平均粒径为5的疏水性无机填料 在树脂涂层的表面上存在较少的母体。 温度传感器可以具有与元件的每个端部电连接的密封电极,引线电连接到每个密封电极并沿由元件和密封电极形成的复合体的轴线方向延伸, 所述绝缘构件围绕所述元件并且覆盖所述密封电极的至少一部分,所述树脂涂层至少覆盖所述电极和所述引线之间的连接部分。

    Semiconductor integrated circuit having controllable internal supply voltage
    37.
    发明授权
    Semiconductor integrated circuit having controllable internal supply voltage 失效
    具有可控内部电源电压的半导体集成电路

    公开(公告)号:US07071768B2

    公开(公告)日:2006-07-04

    申请号:US10628580

    申请日:2003-07-29

    IPC分类号: G05F1/10 G05F3/02

    CPC分类号: G11C5/147

    摘要: In an integrated circuit having an internal supply voltage generation circuit which generates an internal supply voltage by descending an external supply voltage, there is provided an internal circuit which operates with a supplied internal supply voltage. The internal supply voltage generation circuit changes an internal supply voltage level to be generated in accordance with an operation speed of the internal circuit. Preferably the semiconductor integrated circuit includes a clock control circuit which generates an internal clock signal the frequency of which is controlled in accordance with the operation speed of the internal circuit. When the internal clock signal is controlled to have a higher frequency, the internal supply voltage is controlled to be higher. Also, when the internal clock signal is controlled to have a lower frequency, the internal supply voltage is controlled to be lower.

    摘要翻译: 在具有通过降低外部电源电压而产生内部电源电压的内部电源电压产生电路的集成电路中,提供了以所提供的内部电源电压工作的内部电路。 内部电源电压产生电路根据内部电路的运行速度改变要产生的内部电源电压。 优选地,半导体集成电路包括时钟控制电路,其生成内部时钟信号,其频率根据内部电路的操作速度被控制。 内部时钟信号被控制为具有较高的频率时,内部电源电压被控制得更高。 此外,当内部时钟信号被控制为具有较低的频率时,内部电源电压被控制为较低。

    Cooling structure and cooling method for electronic equipment
    38.
    发明申请
    Cooling structure and cooling method for electronic equipment 失效
    电子设备冷却结构及冷却方式

    公开(公告)号:US20050122680A1

    公开(公告)日:2005-06-09

    申请号:US11034138

    申请日:2005-01-12

    IPC分类号: H05K5/00 H05K7/20

    CPC分类号: H05K7/20581 H05K7/207

    摘要: A cooling structure for electronic equipment including a plurality of electronic devices superposed on each other, each of the electronic devices having a lower part where an air ventilation part configured to ventilate air so as to cool the electronic device is provided, the cooling structure includes an air intake and exhaust hole forming part which is formed at an upper part of a first one of the electronic devices and below the air ventilation part of a second one of the electronic devices provided on the first electronic device. Air outside of the electronic equipment is taken into an inside of the first electronic device or air inside of the second electronic device is exhausted to the outside of the electronic equipment via the air intake and exhaust hole forming part, so that an amount of the air ventilated inside of the first electric device is controlled.

    摘要翻译: 一种用于电子设备的冷却结构,包括彼此叠置的多个电子设备,每个电子设备具有下部,其中空气通风部分构造成使空气通风以冷却电子设备,该冷却结构包括: 进气排气孔形成部分,其形成在第一电子设备的上部并且设置在第一电子设备上的第二电子设备的空气通风部分的下方。 电子设备外部的空气被吸入第一电子设备的内部,或者第二电子设备内部的空气经由进气和排气孔形成部件被排出到电子设备的外部,使得空气量 控制第一电气设备内的通风。