公开(公告)号：US5845660A

公开(公告)日：1998-12-08

申请号：US761752

申请日：1996-12-05

申请人： Naoki Shindo ,  Yuuji Kamikawa ,  Shori Mokuo ,  Yoshio Kumagai

发明人： Naoki Shindo ,  Yuuji Kamikawa ,  Shori Mokuo ,  Yoshio Kumagai

IPC分类号： H01L21/00 ,  B08B3/10

CPC分类号： H01L21/67028 ,  Y10S134/902

摘要： A substrate washing and drying apparatus comprising a processing section for holding wafers, to which process solution to wash and vapor for drying the wafers are introduced, a supply/discharge port for introducing solution to the process section, and discharging the solution from the process section, a solution supply mechanism for selecting one from a plurality of kinds of solution, a drying vapor generation section having a heater for generation vapor for drying, a discharging solution mechanism having an opening for rapidly discharging the solution from the processing section, resistivity detecting means for detecting a resistivity value of the process solution, and a controller for controlling the supply of solution to the process section based on the resistivity value detected by the resistivity detecting means.

摘要翻译： 一种基板清洗和干燥装置，其特征在于，包括用于保持晶片的处理部，向所述处理部引入用于将所述晶片干燥的处理液和用于干燥所述晶片的蒸气，用于将所述溶液导入所述处理部的供给排出口， 用于从多种溶液中选择一种的溶液供给机构，具有用于产生干燥产生蒸气的加热器的干燥蒸汽发生部，具有用于从处理部快速排出溶液的开口的排出溶液机构，电阻率检测装置 用于检测处理溶液的电阻率值;以及控制器，用于基于由电阻率检测装置检测的电阻率值来控制对处理部分的溶液的供应。

公开(公告)号：US5823008A

公开(公告)日：1998-10-20

申请号：US647941

申请日：1996-07-19

申请人： Isao Nikai ,  Motohisa Uda ,  Naoki Shindo ,  Takeshi Fuse

发明人： Isao Nikai ,  Motohisa Uda ,  Naoki Shindo ,  Takeshi Fuse

IPC分类号： F24F5/00 ,  F25B9/00 ,  F28D9/00 ,  F28F13/12 ,  F25D9/00

CPC分类号： F24F5/0085 ,  F25B9/004 ,  F28D9/0037 ,  F28F13/12

摘要： A mobile cold air supply unit which comprises, as housed in a single casing, an air compressor-expander constituted of an integral combination of a motor, an air compressor and an air expander, an air-to-water heat exchanger and an air-to-air heat exchanger, is furnished in the casing with air tubing for interconnecting the aforesaid components at an air pressure not higher than 5 kg/cm.sup.2, and is provided with a cold air discharge connection, a return air intake connection, a cooling water outlet connection and a cooling water intake connection.

摘要翻译： PCT No.PCT / JP95 / 02031 Sec。 371日期：1996年7月19日 102（e）日期1996年7月19日PCT提交1995年10月4日PCT公布。 公开号WO96 / 11367 日期：1996年04月18日移动式冷气供给单元，其由容纳在单个壳体内的空气压缩机 - 膨胀机构成，其由电动机，空气压缩机和空气膨胀机的一体组合构成，空气 - 水热 交换器和空气 - 空气热交换器，在壳体中设置有用于在不高于5kg / cm 2的空气压力下将前述部件互连的空气管，并且设置有冷空气排放连接，回气进气口 连接，冷却水出口连接和冷却水进水连接。

公开(公告)号：US5730162A

公开(公告)日：1998-03-24

申请号：US583979

申请日：1996-01-11

申请人： Naoki Shindo ,  Shigenori Kitahara ,  Takayuki Toshima ,  Kenji Yokomizo

发明人： Naoki Shindo ,  Shigenori Kitahara ,  Takayuki Toshima ,  Kenji Yokomizo

IPC分类号： H01L21/00 ,  H01L21/306 ,  H01L21/677 ,  B08B13/00

CPC分类号： H01L21/67057 ,  H01L21/02052 ,  H01L21/67051 ,  H01L21/67781 ,  Y10S134/902 ,  Y10S414/137

摘要： A substrate washing apparatus includes a bath, a washing solution supply source, a first path for allowing the washing solution overflowing from the bath, a rinse solution supply source, a second path for passing the rinse solution, a common path communicating with the first and second paths and also with a bottom of the bath, a first valve, a second valve, a discharge path branched from the first path, and a control section, wherein the first valve includes a first body for opening/closing the first path, a third path arranged parallel to the first path and having a diameter smaller than a diameter of the first path, and a second body for opening/closing the third path, so that the first body is opened and the second body is closed, to allow the washing solution to flow into the bath, and on the other hand, the first body is closed, the second body is opened, to allow the rinse solution to flow into the bath, and the washing solution remaining in the first and third paths is discharged together with the rinse solution through the discharge path.

摘要翻译： 底物洗涤装置包括洗涤液，洗涤液供应源，用于使洗涤液从浴中溢出的第一路径，漂洗溶液供应源，用于通过冲洗溶液的第二路径，与第一和第二通道连通的共同路径 第二路径以及底部的第一阀，第一阀，第二阀，从第一路径分支的排出路径和控制部，其中第一阀包括用于打开/关闭第一路径的第一主体， 第三路径，其平行于第一路径布置并且具有小于第一路径的直径的直径;以及用于打开/关闭第三路径的第二主体，使得第一主体被打开并且第二主体被关闭，以允许 洗涤液流入浴中，另一方面关闭第一体，打开第二体，使冲洗液流入浴中，残留在第一和第三路径中的洗涤液排出 d与冲洗溶液一起通过排放路径。

公开(公告)号：US09691602B2

公开(公告)日：2017-06-27

申请号：US13546372

申请日：2012-07-11

申请人： Norihiro Ito ,  Kazuhiro Aiura ,  Naoki Shindo ,  Yosuke Hachiya ,  Takashi Nagai

发明人： Norihiro Ito ,  Kazuhiro Aiura ,  Naoki Shindo ,  Yosuke Hachiya ,  Takashi Nagai

IPC分类号： H01L21/02 ,  H01L21/67

CPC分类号： H01L21/02041 ,  H01L21/67051 ,  H01L21/6719 ,  Y02E60/34 ,  Y10T137/0318 ,  Y10T137/598

摘要： A top plate is provided with a top plate rotation mechanism configured to rotate the top plate in a horizontal plane. An outside cup peripheral case disposed around a cup is configured to move between an upper position, in which a top end of the cylinder is positioned above the cup, and a lower position located below the upper position. A nozzle support arm configured to support a nozzle is moved, in a horizontal direction, between an advanced position, in which the arm is advanced into the outside cup peripheral case via a side opening formed in a side surface of the outside cup peripheral case when the cylinder is located in the upper position, and a retracted position, in which the arm is retracted outward from the outside cup peripheral case.

公开(公告)号：US09190311B2

公开(公告)日：2015-11-17

申请号：US13351653

申请日：2012-01-17

申请人： Jiro Higashijima ,  Yosuke Hachiya ,  Kazuhiro Aiura ,  Norihiro Itoh ,  Naoki Shindo ,  Yuki Ito

发明人： Jiro Higashijima ,  Yosuke Hachiya ,  Kazuhiro Aiura ,  Norihiro Itoh ,  Naoki Shindo ,  Yuki Ito

IPC分类号： H01L21/687 ,  B08B3/04 ,  H01L21/67

CPC分类号： H01L21/68728 ,  B08B3/04 ,  B08B3/041 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6719 ,  H01L21/68742

摘要： Disclosed are a liquid processing apparatus and a liquid processing method that can prevent a substrate in a processing chamber from being contaminated due to contamination attached to a nozzle supporting arm that supports a nozzle. The liquid processing apparatus of the present disclosure includes: a processing chamber having a substrate holding unit configured to hold a substrate and a cup disposed around the substrate holding unit; a nozzle configured to supply a fluid to the substrate held by the substrate holding unit; and a nozzle supporting arm configured to support the nozzle. An arm cleaning unit configured to clean the nozzle supporting arm is installed in the liquid processing apparatus.

摘要翻译： 公开了一种液体处理装置和液体处理方法，其可以防止处理室中的基板由于附着到支撑喷嘴的喷嘴支撑臂上的污染而被污染。 本公开的液体处理装置包括：处理室，具有被配置为保持基板的基板保持单元和设置在基板保持单元周围的杯子; 喷嘴，被配置为将流体供给到由所述基板保持单元保持的所述基板; 以及配置成支撑喷嘴的喷嘴支撑臂。 构造成清洁喷嘴支撑臂的手臂清洁单元安装在液体处理装置中。

公开(公告)号：US08303724B2

公开(公告)日：2012-11-06

申请号：US13206186

申请日：2011-08-09

申请人： Koukichi Hiroshiro ,  Yuji Kamikawa ,  Takayuki Toshima ,  Naoki Shindo

发明人： Koukichi Hiroshiro ,  Yuji Kamikawa ,  Takayuki Toshima ,  Naoki Shindo

IPC分类号： B08B3/00

CPC分类号： H01L21/02057 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/67057

摘要： Disclosed is a substrate processing apparatus for cleaning and drying a substrate such as a semiconductor wafer. This substrate processing apparatus includes a liquid processing unit for processing a substrate by immersing the substrate in stored purified water, a drying unit arranged above the liquid processing unit and configured to dry the substrate, a substrate transfer apparatus for transferring the substrate between the liquid processing unit and drying unit, a fluid supply mechanism for supplying a fluid mixture containing vapor or mist of purified water and vapor or mist of a volatile organic solvent to the drying unit, and a controller for controlling the supply of the fluid mixture.

摘要翻译： 公开了一种用于清洗和干燥诸如半导体晶片的衬底的衬底处理装置。 该基板处理装置包括：液体处理单元，用于通过将基板浸渍在储存的净化水中来处理基板;干燥单元，布置在液体处理单元上方并构造成干燥基板;基板输送装置，用于在液体处理 单元和干燥单元，用于将含有纯净水的蒸气或雾的挥发性有机溶剂的蒸气或雾的流体混合物供给到干燥单元的流体供给机构，以及用于控制流体混合物的供给的控制器。

公开(公告)号：US20110290280A1

公开(公告)日：2011-12-01

申请号：US13206186

申请日：2011-08-09

申请人： Koukichi HIROSHIRO ,  Yuji Kamikawa ,  Takayuki Toshima ,  Naoki Shindo

发明人： Koukichi HIROSHIRO ,  Yuji Kamikawa ,  Takayuki Toshima ,  Naoki Shindo

IPC分类号： B08B3/00

CPC分类号： H01L21/02057 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/67057

摘要： Disclosed is a substrate processing apparatus for cleaning and drying a substrate such as a semiconductor wafer. This substrate processing apparatus includes a liquid processing unit for processing a substrate by immersing the substrate in stored purified water, a drying unit arranged above the liquid processing unit and configured to dry the substrate, a substrate transfer apparatus for transferring the substrate between the liquid processing unit and drying unit, a fluid supply mechanism for supplying a fluid mixture containing vapor or mist of purified water and vapor or mist of a volatile organic solvent to the drying unit, and a controller for controlling the supply of the fluid mixture.

摘要翻译： 公开了一种用于清洗和干燥诸如半导体晶片的衬底的衬底处理装置。 该基板处理装置包括：液体处理单元，用于通过将基板浸渍在储存的净化水中来处理基板;干燥单元，布置在液体处理单元上方并构造成干燥基板;基板输送装置，用于在液体处理 单元和干燥单元，用于将含有纯净水的蒸气或雾的挥发性有机溶剂的蒸气或雾的流体混合物供给到干燥单元的流体供给机构，以及用于控制流体混合物的供给的控制器。

公开(公告)号：US07410543B2

公开(公告)日：2008-08-12

申请号：US10957003

申请日：2004-10-01

申请人： Takayuki Toshima ,  Naoki Shindo ,  Tadashi Iino

发明人： Takayuki Toshima ,  Naoki Shindo ,  Tadashi Iino

IPC分类号： B08B3/00 ,  B08B5/00

CPC分类号： H01L21/6708 ,  H01L21/31138 ,  Y10S134/902

摘要： Resists can be removed while metal contamination of wafers, etc. and generation of particles, and growth of oxide films are suppressed. A substrate processing method comprises feeding a processing gas, such as ozone gas, into a processing vessel to pressurize an atmosphere surrounding a substrate. A solvent gas, such as steam, is fed into the processing vessel while the processing gas is fed into the processing vessel, whereby a resist of the substrate can be removed with the solvent gas and the processing gas while metal corrosion, etc. can be prevented.

摘要翻译： 可以去除抗蚀剂，同时抑制晶片等的金属污染和颗粒的产生以及氧化膜的生长被抑制。 基板处理方法包括将诸如臭氧气体的处理气体进料到处理容器中以对基板周围的气氛加压。 将诸如蒸汽的溶剂气体加入处理容器中，同时将处理气体进料到处理容器中，由此可以用溶剂气体和处理气体除去基板的抗蚀剂，同时金属腐蚀等可以 防止了

公开(公告)号：US20070175062A1

公开(公告)日：2007-08-02

申请号：US10591971

申请日：2005-03-25

申请人： Takayuki Toshima ,  Naoki Shindo ,  Hiroshi Yano ,  Kotaro Tsurusaki

发明人： Takayuki Toshima ,  Naoki Shindo ,  Hiroshi Yano ,  Kotaro Tsurusaki

IPC分类号： F26B21/06 ,  F26B5/04

CPC分类号： H01L21/67034 ,  H01L21/67028 ,  H01L21/67757 ,  Y10S134/902

摘要： A substrate processing system 1 comprises: a processing tank 3 for processing substrates W with a processing liquid; a drying unit 6 disposed above the processing tank 3; and a carrying mechanism 8 for carrying the substrates W between the processing tank 3 and the drying unit 6. A processing gas supply line 21 for supplying a processing gas into the drying unit 6 and inert gas supply lines 24 and 25 for supplying an inert gas into the drying unit 6 are connected to the drying unit 6. A first discharge line for discharging an atmosphere purged from the drying unit 6 and a second discharge line 27 for forcibly exhausting the drying unit 6 are connected to the drying unit 6.

摘要翻译： 基板处理系统1包括：用处理液处理基板W的处理槽3; 设置在处理罐3上方的干燥单元6; 以及用于在处理槽3和干燥单元6之间承载基板W的承载机构8。 将用于将干燥单元6中的处理气体供给到处理气体供给管线21和用于向干燥单元6供给惰性气体的惰性气体供给管线24和25连接到干燥单元6。 用于排出从干燥单元6吹扫的气氛的第一排出管线和用于强制排出干燥单元6的第二排出管线27连接到干燥单元6。

公开(公告)号：US06729041B2

公开(公告)日：2004-05-04

申请号：US10034520

申请日：2001-12-28

申请人： Naoki Shindo ,  Tadashi Iino

发明人： Naoki Shindo ,  Tadashi Iino

IPC分类号： F26B300

CPC分类号： H01L21/6708 ,  Y10S134/902

摘要： This substrate processing apparatus supplies wafers W accommodated in a closed processing container 10 with ozone gas and steam for processing the wafers W. The apparatus includes an ozone-gas generator 40 for supplying the ozone gas into the processing container 10, a steam generator 30 for supplying the steam into the processing container 10 and a steam nozzle 35 arranged in the processing container 10 and connected to the steam generator 30. The steam nozzle 35 is equipped with a nozzle body 35a having a plurality of steam ejecting orifices 35f formed at appropriate intervals and a heater 35h for preventing dewdrops of the steam from being produced in the nozzle body 35a. Consequently, it is possible to prevent the formation of dewdrops of solvent steam, which may produce origins of particles in the closed processing container, unevenness in cleaning (etching), etc., and also possible to improve the processing efficiency.

摘要翻译： 该基板处理装置将容纳在封闭处理容器10内的晶片W供给臭氧气体和蒸汽用于处理晶片W.该装置包括用于向处理容器10供给臭氧气体的臭氧气体发生器40，用于 将蒸汽供给到处理容器10和设置在处理容器10中并连接到蒸汽发生器30的蒸汽喷嘴35.蒸汽喷嘴35配备有喷嘴体35a，喷嘴体35a具有以适当间隔形成的多个蒸汽喷射孔35f 以及用于防止在喷嘴体35a中产生蒸汽的露珠的加热器35h。 因此，可以防止在封闭的加工容器中产生颗粒的起因，清洗（蚀刻）等不均匀的溶剂蒸汽的露珠的形成，也可以提高加工效率。