摘要:
A first LED unit, a first reflector, a second LED unit, a second reflector, and a light source mount which supports the first LED unit and the second LED unit are provided in a light chamber. The first reflector is formed integrally with a projection lens and forwardly reflects direct light outputted from a first LED to the central axis of the lens. The second reflector is formed integrally with the projection lens and forwardly reflects direct light outputted from a second LED. The light source mount has a fixing portion adapted to perform the positioning of the projection lens, the first reflector and the second reflector, which are formed integrally with a connecting member, in the direction of the central axis of the lens. The light source mount also has a positioning projection and positioning recesses, which are adapted to perform the positioning of the projection lens, the first reflector and the second reflector in a direction perpendicular to the central axis.
摘要:
A first LED unit, a first reflector, a second LED unit, a second reflector, and a light source mount which supports the first LED unit and the second LED unit are provided in a light chamber. The first reflector is formed integrally with a projection lens and forwardly reflects direct light outputted from a first LED to the central axis of the lens. The second reflector is formed integrally with the projection lens and forwardly reflects direct light outputted from a second LED. The light source mount has a fixing portion adapted to perform the positioning of the projection lens, the first reflector and the second reflector, which are formed integrally with a connecting member, in the direction of the central axis of the lens. The light source mount also has a positioning projection and positioning recesses, which are adapted to perform the positioning of the projection lens, the first reflector and the second reflector in a direction perpendicular to the central axis.
摘要:
A method is disclosed for fabricating a semiconductor device having a memory employing a ferroelectric capacitor in which the orientation of the ferroelectric film is controlled. The method for fabricating the semiconductor device includes a first film deposition process for forming a first ferroelectric layer, and a second film deposition process for forming a second ferroelectric layer on the first ferroelectric layer. The film deposition temperature of the first film deposition process is set to at least 600° C.
摘要:
A method is disclosed for fabricating a semiconductor device having a memory employing a ferroelectric capacitor in which the orientation of the ferroelectric film is controlled. The method for fabricating the semiconductor device includes a first film deposition process for forming a first ferroelectric layer, and a second film deposition process for forming a second ferroelectric layer on the first ferroelectric layer. The film deposition temperature of the first film deposition process is set to at least 600° C.
摘要:
A method of manufacturing a micro-structure having a plurality of step-like elements, includes the steps of etching a first region of a substrate, corresponding to a lowest step of the step-like element, with an appropriate depth, whereby a surface of the lowest step of the step-like element is defined, and etching, subsequently, a second region of the substrate, corresponding to another step of the step-like element, with an appropriate depth, whereby a surface of that step of the step-like element is defined.
摘要:
The present invention provides a diffraction optical element comprising a first optical member having a first diffraction grating, a second optical member having a second diffraction grating, wherein the first and second optical members are stacked so that the first and second diffraction gratings face each other inside the stacked members and so that a space is formed between the diffraction gratings, and a sealing member for hermetically sealing the space between the diffraction gratings.
摘要:
A semiconductor memory device includes a memory cell capacitor for storing information, wherein the memory cell capacitor includes a capacitor insulation film of a double oxide on a lower electrode. The lower electrode has a layered structure of Ir/IrO.sub.2 /Ir or Ru/RuO.sub.2 /Ru acting as a diffusion barrier of oxygen or Pb. Further, the use of a Pt--Ir alloy is disclosed for the lower electrode.