Wireless pressure sensing Schrader valve
    31.
    发明授权
    Wireless pressure sensing Schrader valve 有权
    无线压力感应阀门

    公开(公告)号:US07328609B1

    公开(公告)日:2008-02-12

    申请号:US10977168

    申请日:2004-10-29

    IPC分类号: B60C23/02

    CPC分类号: B60C23/0408 B60C23/0496

    摘要: A wireless tire pressure sensing system based upon a Schrader valve design is provided. The system includes a valve body, a valve pin and a compression element for sealing engaging the valve body and the valve pin to maintain tire pressure. A pressure sensing device mounted within the valve body and connected to valve pin senses the pressure within the tire and provides its signal to the valve pin. The valve pin is adapted as a component of an antenna that transmits a wireless pressure signal to a remote receiver/transmitter mounted on the vehicle. The receiver/transmitter transmits a corresponding signal to a vehicle control system that generates a warning signal when the tire pressure is below a threshold safety value.

    摘要翻译: 提供了一种基于Schrader阀设计的无线轮胎压力感测系统。 该系统包括阀体,阀销和压缩元件,用于密封接合阀体和阀销以保持轮胎压力。 安装在阀体内并连接到阀针的压力感测装置感测轮胎内的压力并将其信号提供给阀销。 阀针被适配为将无线压力信号发送到安装在车辆上的远程接收器/发射器的天线的部件。 接收器/发射器将相应的信号发送到车辆控制系统,当轮胎压力低于阈值安全值时,其产生警告信号。

    Integrated switching voltage regulator using copper process technology
    33.
    发明授权
    Integrated switching voltage regulator using copper process technology 有权
    集成开关电压调节器采用铜工艺技术

    公开(公告)号:US07268410B1

    公开(公告)日:2007-09-11

    申请号:US11041658

    申请日:2005-01-24

    IPC分类号: H01L29/00

    CPC分类号: H02M7/003

    摘要: Improvements in the level of integration of a core buck and/or boost DC-DC voltage regulator sub-circuit lead to a lower manufacturing cost structure, an improved performance from lessened intrinsic parasitic resistance, a smaller die size and, thus, higher wafer yield. Further, by integrating certain components on-chip, the cost and complexity of the conventional hybrid circuit implementation is improved.

    摘要翻译: 核心降压和/或升压DC-DC电压调节器子电路的集成度的改进导致较低的制造成本结构,通过减小的内在寄生电阻改善的性能,更小的管芯尺寸以及因此更高的晶片产量 。 此外,通过集成片上的某些部件,提高了传统混合电路实现的成本和复杂性。

    DC-DC voltage converter with reduced output voltage ripple
    34.
    发明授权
    DC-DC voltage converter with reduced output voltage ripple 有权
    DC-DC电压转换器具有降低的输出电压纹波

    公开(公告)号:US07157891B1

    公开(公告)日:2007-01-02

    申请号:US11057967

    申请日:2005-02-15

    IPC分类号: G05F1/44

    CPC分类号: H02M3/1584 H02M2003/1586

    摘要: An integrated DC—DC converter circuit in which multiple switched circuits operate in parallel to drive the output electrode with multiple pulsed charging voltages such that the corresponding respective output ripple voltage components combine with destructive interference, thereby reducing the net output ripple voltage.

    摘要翻译: 一种集成的DC-DC转换器电路,其中多个开关电路并联操作以驱动具有多个脉冲充电电压的输出电极,使得相应的相应的输出纹波电压分量与破坏性干扰相结合,从而降低净输出纹波电压。

    Method of inducing movement of charge carriers through a semiconductor material
    37.
    发明授权
    Method of inducing movement of charge carriers through a semiconductor material 有权
    引起载流子通过半导体材料的移动的方法

    公开(公告)号:US06660537B1

    公开(公告)日:2003-12-09

    申请号:US10219211

    申请日:2002-08-15

    IPC分类号: H01L2100

    摘要: A conductive trace is formed over and insulated from a region of semiconductor material, such as a region adjacent to the n+ region of an n+/p− photodiode, and a sawtooth current is made to flow through the conductive trace. The sawtooth current induces charge carriers to move through the semiconductor material to a collection region in the semiconductor material.

    摘要翻译: 导电迹线形成在与半导体材料的区域(例如与n + / p-型光电二极管的n +区域相邻的区域)之上并与之绝缘,并且使锯齿电流流过导电迹线。 锯齿电流引起电荷载流子移动通过半导体材料到半导体材料中的收集区域。

    THERMALLY CONDUCTIVE SUBSTRATE FOR GALVANIC ISOLATION
    40.
    发明申请
    THERMALLY CONDUCTIVE SUBSTRATE FOR GALVANIC ISOLATION 有权
    用于血液分离的导热基质

    公开(公告)号:US20130001735A1

    公开(公告)日:2013-01-03

    申请号:US13170451

    申请日:2011-06-28

    IPC分类号: H01L29/02 H01L21/50

    摘要: A galvanic isolation integrated circuit system includes a semiconductor substrate; a layer of thermally conductive material, e.g., CVD nano- or poly-diamond thin film or boron nitride CVD thin film, formed over the semiconductor substrate; a first integrated circuit structure formed over the layer of thermally conductive material; a second integrated circuit structure formed over the layer of thermally conductive material, the second integrated circuit structure being spaced apart from the first integrated circuit structure; and a galvanic isolation structure formed over the layer of thermally conductive material between the first and second integrated circuit structures and connected to the first integrated circuit structure and the second integrated circuit structure.

    摘要翻译: 电隔离集成电路系统包括半导体衬底; 形成在半导体衬底上的导热材料层,例如CVD纳米或多晶金刚石薄膜或氮化硼CVD薄膜; 形成在导热材料层上的第一集成电路结构; 形成在所述导热材料层上的第二集成电路结构,所述第二集成电路结构与所述第一集成电路结构间隔开; 以及在第一和第二集成电路结构之间形成在导热材料层上并连接到第一集成电路结构和第二集成电路结构的电流隔离结构。