Polishing state monitoring apparatus and polishing apparatus
    31.
    发明授权
    Polishing state monitoring apparatus and polishing apparatus 有权
    抛光状态监测装置和抛光装置

    公开(公告)号:US07645181B2

    公开(公告)日:2010-01-12

    申请号:US12230317

    申请日:2008-08-27

    IPC分类号: B24B49/00 B24B51/00

    CPC分类号: B24B49/12 B24B37/013

    摘要: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.

    摘要翻译: 抛光状态监视装置测量被抛光表面的特征值,以确定抛光终点的定时。 抛光状态监视装置包括用于将光从光源施加到被抛光的工件的表面的发光单元,用于接收来自工件表面的反射光的光接收单元,用于将反射的 由光接收单元接收的多个光具有各自的波长的光;以及用于将检测到的光线累积的光接收元件作为电信息。 抛光状态监视装置还包括:光谱数据发生器,用于读取由光接收元件累积的电信息并产生反射光的光谱数据;以及处理器,用于基于工件的表面计算工件表面上的预定特征值 光谱数据生成器生成的光谱数据。

    Polishing state monitoring apparatus and polishing apparatus and method
    32.
    发明授权
    Polishing state monitoring apparatus and polishing apparatus and method 有权
    抛光状态监测装置及抛光装置及方法

    公开(公告)号:US07252575B2

    公开(公告)日:2007-08-07

    申请号:US10526933

    申请日:2003-10-15

    IPC分类号: B24B1/00 B24B49/00 B24B51/00

    CPC分类号: B24B49/12 B24B37/013

    摘要: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.

    摘要翻译: 抛光状态监视装置测量被抛光表面的特征值,以确定抛光终点的定时。 抛光状态监视装置包括用于将光从光源施加到被抛光的工件的表面的发光单元,用于接收来自工件表面的反射光的光接收单元,用于将反射的 由光接收单元接收的多个光具有各自的波长的光;以及用于将检测到的光线累积的光接收元件作为电信息。 抛光状态监视装置还包括:光谱数据发生器,用于读取由光接收元件累积的电信息并产生反射光的光谱数据;以及处理器,用于基于工件的表面计算工件表面上的预定特征值 光谱数据生成器生成的光谱数据。

    Substrate polishing apparatus
    33.
    发明授权
    Substrate polishing apparatus 有权
    基材抛光装置

    公开(公告)号:US07214122B2

    公开(公告)日:2007-05-08

    申请号:US11274112

    申请日:2005-11-16

    IPC分类号: B24B49/00

    摘要: A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table. The substrate polishing apparatus also includes a protection cover mounted on the polishing table and fitted into the through hole when the polishing pad is attached to the polishing table.

    摘要翻译: 基板抛光装置用于将诸如半导体晶片的基板的表面抛光到平面镜面。 基板研磨装置具有安装在研磨台上的用于研磨半导体基板的研磨台和研磨垫。 抛光垫在其中形成有通孔。 基板研磨装置还具有发光和接收装置,用于通过形成在抛光垫中的通孔将测量光发射到半导体衬底并接收来自半导体衬底的反射光,以测量半导体衬底上的膜。 发光和接收装置设置在抛光台中。 衬底抛光装置包括用于将流体供应到测量光的路径的供给通道。 供给通道具有可拆卸地安装在抛光台上的出口部分。 衬底抛光装置还包括安装在抛光台上并当抛光垫附接到抛光台时装配到通孔中的保护盖。

    Method and apparatus for measuring a polishing condition
    34.
    发明申请
    Method and apparatus for measuring a polishing condition 有权
    测量抛光条件的方法和装置

    公开(公告)号:US20060274326A1

    公开(公告)日:2006-12-07

    申请号:US10568085

    申请日:2004-06-16

    IPC分类号: G01B11/30

    CPC分类号: B24B37/013 B24B49/12

    摘要: A polished state monitoring apparatus capable of easily grasping the progress of polish is provided. The polished state monitoring apparatus monitors the progress of polish of a surface to be polished by obtaining a characteristic value indicating a state of the polished surface of an object 12 at each sampling point every predetermined interval while scanning the surface. The apparatus comprises light emitting means 21 capable of emitting light for irradiating the surface and computing units 26 for receiving light reflected from the surface to generate a characteristic value. Then, the apparatus fetches the characteristic values obtained from the sampling points at the same sampling timing during each scan and outputs the characteristic values. This enables the progress of the polish to be monitored in accordance with the distance from the center of the surface.

    摘要翻译: 提供了能够容易地理解抛光进度的抛光状态监视装置。 抛光状态监视装置通过在扫描表面时以预定间隔每个采样点获得指示对象12的抛光表面的状态的特性值来监视待抛光表面的抛光进度。 该装置包括能够发射用于照射表面的光的发光装置21和用于接收从表面反射的光的计算单元26以产生特征值。 然后,设备在每次扫描期间以相同的采样定时从采样点获取的特征值,并输出特征值。 这使得根据距离表面中心的距离来监测抛光的进展。

    Polishing state monitoring apparatus and polishing apparatus and method

    公开(公告)号:US20060166606A1

    公开(公告)日:2006-07-27

    申请号:US10526933

    申请日:2003-10-15

    IPC分类号: G01N21/55 B24B49/00

    CPC分类号: B24B49/12 B24B37/013

    摘要: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.

    Substrate transfer controlling apparatus and substrate transferring method
    36.
    发明申请
    Substrate transfer controlling apparatus and substrate transferring method 有权
    基板转印控制装置和基板转印方法

    公开(公告)号:US20060161286A1

    公开(公告)日:2006-07-20

    申请号:US11385760

    申请日:2006-03-22

    IPC分类号: G06F19/00

    摘要: A substrate transfer controlling apparatus which can easily maximize the throughput of a substrate processing apparatus such as a semiconductor fabrication apparatus, and can satisfy a demand for immediacy of actions of a transfer device. The substrate transfer controlling apparatus includes an input device (12) for inputting times required for actions of transfer devices (1a through 1c) and times required to process substrates in processing devices (3a through 9d), and a schedule calculator (21) for calculating execution times of actions of the transfer devices (1a through 1c) for allowing the time when a final one of the substrates to be processed is fully processed and returned from the substrate processing apparatus to be earliest, based on a predetermined conditional formula including, as parameters, the inputted times. The substrate transfer controlling apparatus further includes an action commander (24) for instructing the corresponding transfer devices to perform the actions at the calculated execution times of the actions of the transfer devices (1a through 1c).

    摘要翻译: 一种基板传送控制装置,其能够容易地使诸如半导体制造装置的基板处理装置的吞吐量最大化,并且可以满足对传送装置的动作的即时性的要求。 基板传送控制装置包括:输入装置(12),用于输入传送装置(1a至1c)的动作所需的时间和处理装置(3a至9d)中处理基板所需的时间和时间表计算器 21),用于计算用于允许待处理的最后一个基板的时间从基板处理装置最早处理并返回到最早的传送装置(1a至1c)的执行时间,基于 包括作为输入时间的参数的预定条件公式。 基板传送控制装置还包括动作指令器(24),用于指示相应的传送装置在计算出的传送装置(1a至1c)的动作的执行时间执行动作。

    Process for the production of methionine
    37.
    发明申请
    Process for the production of methionine 审中-公开
    生产甲硫氨酸的方法

    公开(公告)号:US20050176115A1

    公开(公告)日:2005-08-11

    申请号:US10523146

    申请日:2003-07-22

    IPC分类号: C12P13/12

    CPC分类号: C12P13/12

    摘要: A practical method for producing methionine is presented. When a substance capable of producing methionine through hydrolysis is used as raw material and converted into methionine by using a biocatalyst, the biocatalyst is repeatedly usable and the accumulation amount of methionine dissolved in the reaction solution is increased, and methionine is obtained in a solid form from the reaction solution. Specifically, the present invention relates to a method for producing methionine comprising the following steps: a first step of converting raw material capable of producing methionine through hydrolysis of 2-amino-4-methylthiobutyronitrile, and 2-amino-4-methylthiobutanamide or the like in an aqueous ammonia solution, into methionine-containing aqueous ammonia solution, with a biocatalyst through hydrolysis, a second step of separating the biocatalyst from the methionine-containing aqueous ammonia solution obtained in the first step, and a third step of distilling ammonia out of the methionine-containing aqueous ammonia solution separated in the second step to deposit and separate crystals of methionine.

    摘要翻译: 提出了一种生产甲硫氨酸的实用方法。 当通过水解产生甲硫氨酸的物质被用作原料并且通过使用生物催化剂转化为甲硫氨酸时,生物催化剂是可重复使用的,并且溶解在反应溶液中的甲硫氨酸的积累量增加,以固体形式得到甲硫氨酸 从反应溶液中。 具体地说,本发明涉及一种生产甲硫氨酸的方法,包括以下步骤:通过2-氨基-4-甲硫基丁腈水解生成甲硫氨酸的原料和2-氨基-4-甲硫基丁酰胺等的第一步骤 在含氨基氨水溶液中通过水解生物催化剂,将第一步骤中得到的含有甲硫氨酸的氨水溶液分离生物催化剂的第二步骤,以及将氨蒸馏出来的第三步骤 在第二步中分离出含有甲硫氨酸的氨水溶液以沉积和分离蛋氨酸晶体。

    Substrate polishing apparatus
    38.
    发明授权

    公开(公告)号:US06758723B2

    公开(公告)日:2004-07-06

    申请号:US10329424

    申请日:2002-12-27

    IPC分类号: B24B100

    摘要: The substrate polishing apparatus for polishing a polishing surface of a substrate comprises a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device, wherein the table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.