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    FIBER PRE-OXIDIZATION DEVICE
    34.
    发明申请
    FIBER PRE-OXIDIZATION DEVICE 审中-公开

    公开(公告)号：US20190233979A1

    公开(公告)日：2019-08-01

    申请号：US15951353

    申请日：2018-04-12

    Applicant: UHT UNITECH COMPANY LTD.

    Inventor： CHIH-YUNG WANG

    IPC: D01F11/16 ,  D01D10/04

    CPC classification number: D01F11/16 ,  D01D10/0454 ,  D01F9/145 ,  D01F9/22 ,  D01F9/322 ,  D01F9/328 ,  D10B2101/12 ,  D10B2321/10 ,  D10B2401/063 ,  H05B6/6491 ,  H05B6/788 ,  H05B2206/044

    Abstract: A fiber pre-oxidization device of the present disclosure basically has a transmitting unit and a microwave processing unit. The microwave processing unit is installed with at least one magnetron and a gas supplying unit, wherein the magnetron is disposed at an oven body of the transmitting unit, and the gas supplying unit is connected to the oven body. By focusing the microwave, an ultra-fast pre-oxidization process is applied on a fiber yarn bunch which continuously passes the oven body, and thus the fiber yarn bunch is processed to form an oxidation fiber yarn bunch. Thus, not only an oxidization time of an oxidation fiber can be reduced, but also the shell-core structure of the oxidation fiber can be reduced. Even, the oxidation fiber has no obvious shell-core. Accordingly, relatively positive and reliable means for increasing the performance of carbon fiber are provided.

    Systems and Methods for Annealing Semiconductor Structures
    35.
    发明申请
    Systems and Methods for Annealing Semiconductor Structures 审中-公开

    公开(公告)号：US20170301572A1

    公开(公告)日：2017-10-19

    申请号：US15639055

    申请日：2017-06-30

    Applicant: Taiwan Semiconductor Manufacturing Company Limited

    Inventor： Chun-Hsiung Tsai ,  Zi-Wei Fang ,  Chao-Hsiung Wang

    IPC: H01L21/67 ,  H05B6/80 ,  H01L21/324

    CPC classification number: H01L21/67115 ,  H01L21/324 ,  H05B6/6482 ,  H05B6/6491 ,  H05B6/80 ,  H05B6/806

    Abstract: Systems and methods are provided for annealing a semiconductor structure. In one embodiment, the method includes providing an energy-converting structure proximate a semiconductor structure, the energy-converting structure comprising a material having a loss tangent larger than that of the semiconductor structure; providing a heat reflecting structure between the semiconductor structure and the energy-converting structure; and providing microwave radiation to the energy-converting structure and the semiconductor structure. The semiconductor structure may include at least one material selected from the group consisting of boron-doped silicon germanium, silicon phosphide, titanium, nickel, silicon nitride, silicon dioxide, silicon carbide, n-type doped silicon, and aluminum capped silicon carbide. The heat reflecting structure may include a material substantially transparent to microwave radiation and having substantial reflectivity with respect to infrared radiation.

    DETACHABLE MICROWAVE BAKING PAN
    37.
    发明申请
    DETACHABLE MICROWAVE BAKING PAN 审中-公开
    可分离微波炉

    公开(公告)号：US20170071402A1

    公开(公告)日：2017-03-16

    申请号：US15253899

    申请日：2016-09-01

    Applicant: Herman Peng

    Inventor： Herman Peng

    IPC: A47J36/02 ,  B65D81/34 ,  A21B3/13

    CPC classification number: A47J36/027 ,  A21B3/132 ,  B65D81/3453 ,  H05B6/6408 ,  H05B6/6491

    Abstract: An improved detachable microwave baking pan, comprising an upper baking pan and a lower baking pan which are disposed separately, wherein the upper baking pan is provided with an upper baking pan cavity, and the lower baking pan is provided with a lower baking pan cavity; lower grips are disposed on the edge of two sides of the lower baking pan, and each lower grip is provided with an elastic fastener in an integrated extension manner; upper grips are disposed on the edges of two sides of the upper baking pan, and each upper grip is provided with a fastening protrusion which is in corresponding fastening fit with the elastic fastener; the elastic fasteners are matched with the fastening protrusions, such that the upper baking pan and the lower baking pan are combined into a whole; and the upper baking pan cavity and the lower baking pan cavity are communicated to jointly constitute a heating cavity suitable for baking food. The upper baking pan and the lower baking pan are always elastically fastened by means of the elastic property of the elastic fasteners 203, and even if the food in the heating cavity is uneven in thickness, it is assured that both sides of the food can be baked, and the food is uniformly heated in the baking process.

    Abstract translation: 一种改进的可拆卸微波烤盘，包括分别设置的上烤盘和下烤盘，其中上烤盘设置有上烤盘腔，下烤盘设置有下烤盘腔; 下把手设置在下烤盘的两侧的边缘上，并且每个下把手以一体的延伸方式设置有弹性紧固件; 上把手设置在上烤盘的两侧的边缘上，每个上把手设置有与弹性紧固件对应的紧固配合的紧固突起; 弹性紧固件与紧固突起配合，使得上烤盘和下烤盘组合成整体; 上烤盘腔和下烤盘腔共同构成适于烘烤食品的加热腔。 上部烤盘和下部烤盘总是通过弹性紧固件203的弹性而弹性地固定，即使加热腔中的食物厚度不均匀，也可以确保食物的两侧可以是 烘烤，食物在烘烤过程中均匀加热。

    SYSTEMS AND METHODS FOR ANNEALING SEMICONDUCTOR STRUCTURES
    38.
    发明申请
    SYSTEMS AND METHODS FOR ANNEALING SEMICONDUCTOR STRUCTURES 有权

    公开(公告)号：US20160351414A1

    公开(公告)日：2016-12-01

    申请号：US15234076

    申请日：2016-08-11

    Applicant: Taiwan Semiconductor Manufacturing Company Limited

    Inventor： CHUN-HSIUNG TSAI ,  ZI-WEI FANG ,  CHAO-HSIUNG WANG

    IPC: H01L21/324 ,  H05B6/80 ,  H05B6/64 ,  H01L21/67

    CPC classification number: H01L21/67115 ,  H01L21/324 ,  H05B6/6482 ,  H05B6/6491 ,  H05B6/80 ,  H05B6/806

    Abstract: Systems and methods are provided for annealing a semiconductor structure. In one embodiment, the method includes providing an energy-converting structure proximate a semiconductor structure, the energy-converting structure comprising a material having a loss tangent larger than that of the semiconductor structure; providing a heat reflecting structure between the semiconductor structure and the energy-converting structure; and providing microwave radiation to the energy-converting structure and the semiconductor structure. The semiconductor structure may include at least one material selected from the group consisting of boron-doped silicon germanium, silicon phosphide, titanium, nickel, silicon nitride, silicon dioxide, silicon carbide, n-type doped silicon, and aluminum capped silicon carbide. The heat reflecting structure may include a material substantially transparent to microwave radiation and having substantial reflectivity with respect to infrared radiation.

    APPARATUS FOR PROVIDING CUSTOMIZABLE HEAT ZONES IN AN OVEN
    39.
    发明申请
    APPARATUS FOR PROVIDING CUSTOMIZABLE HEAT ZONES IN AN OVEN 审中-公开
    在烤箱中提供可定制的热区的装置

    公开(公告)号：US20160345391A1

    公开(公告)日：2016-11-24

    申请号：US14717100

    申请日：2015-05-20

    Applicant: Illinois Tool Works Inc.

    Inventor： Joshua M. Linton

    IPC: H05B6/64

    CPC classification number: H05B6/6473 ,  H05B6/6408 ,  H05B6/6411 ,  H05B6/6488 ,  H05B6/6491 ,  H05B6/6494 ,  H05B6/70

    Abstract: An oven may include a cooking chamber configured to receive a food product, a radio frequency (RF) heating system configured to provide RF energy into the cooking chamber; and an energy conversion assembly provided as a cooking surface of the oven. The energy conversion assembly may be configured to convert at least some of the RF energy into thermal energy for heating the food product, while at least some other portion of the RF energy is directly applied to the food product to heat the food product.

    Abstract translation: 烤箱可以包括被配置为接收食物的烹饪室，被配置为向烹饪室提供RF能量的射频（RF）加热系统; 以及作为烤箱的烹饪表面设置的能量转换组件。 能量转换组件可以被配置为将至少一些RF能量转换成用于加热食品的热能，同时将RF能量的至少一些其它部分直接施加到食品以加热食品。

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