公开(公告)号：US20030224111A1

公开(公告)日：2003-12-04

申请号：US10303956

申请日：2002-11-26

Applicant: NAGOYA MEKKI KOGYO KABUSHIKI KAISHA

Inventor： Nobuyuki Suganuma ,  Hiroshi Kobayashi ,  Suehiro Kamizono ,  Tom Wong

IPC: B05C003/00

CPC classification number: D06M11/83 ,  C23C18/1632 ,  C23C18/1653 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30

Abstract: A filament bundle is rewound from a reel, and passes through various sorts of liquid in processing vessels to be used for plating. The filament bundle passes through a fixed guide roller and a movable guide roller while it travels within the liquid in the processing vessel. The movable guide roller is moved periodically, the filament bundle is stretched and slackened by turns, whenever the filament bundle is slackened or untied, the bundle is loosened. The filament bundle with each filament subjected to the plating is taken up to a take-up reel.

Abstract translation: 长丝束从卷轴上倒带，并通过处理容器中的各种液体进行电镀。 当细丝束在处理容器内的液体中行进时，其穿过固定的引导辊和可移动导向辊。 可动引导辊周期性地移动，每当丝束松弛或解开时，丝束被拉伸和松弛，松开松开。 将经过电镀的每根细丝的丝束卷取到卷取卷轴上。

公开(公告)号：US20030205197A1

公开(公告)日：2003-11-06

申请号：US10456434

申请日：2003-06-06

Applicant: ChipPAC, Inc.

Inventor： Rajendra Pendse

IPC: B05C003/00

CPC classification number: H01L21/563 ,  H01L24/29 ,  H01L2224/11822 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method for encapsulating flip chip interconnects includes applying a limited quantity of encapsulating resin to the interconnect side of an integrated circuit chip, and thereafter bringing the chip together with a substrate under conditions that promote the bonding of bumps on the interconnect side of the chip with bonding pads on the substrate. In some embodiments, the step of applying resin to the chip includes dipping the interconnect side of the chip to a predetermined depth in a pool of resin, and then withdrawing the chip from the resin pool. In some embodiments the step of applying resin to the chip includes providing a reservoir having a bottom, providing a pool of resin in the reservoir to a shallow depth over the reservoir bottom, dipping the chip into the resin pool so that the bumps contact the reservoir bottom, and then withdrawing the chip from the resin pool. Also, apparatus for applying a precise volume of encapsulating resin to a chip, includes a reservoir having a bottom, and means for dispensing a pool of encapsulating resin to a predetermined depth over the reservoir bottom.

Abstract translation: 封装倒装芯片布线的方法包括将有限数量的封装树脂施加到集成电路芯片的互连侧，然后在促进芯片的互连侧上的凸块的接合的条件下将芯片与基板一起使用， 衬底上的接合焊盘。 在一些实施例中，将树脂施加到芯片的步骤包括将芯片的互连面浸入树脂池中的预定深度，然后从树脂池中取出芯片。 在一些实施方案中，将树脂施加到芯片的步骤包括提供具有底部的储存器，在储存器中的较浅深度处提供储存器中的树脂池，将芯片浸入树脂池中，使得凸块接触储存器 底部，然后从树脂池中取出芯片。 此外，将精密体积的密封树脂施加到芯片的装置包括具有底部的储存器，以及用于将封装树脂池分配到储存器底部上的预定深度的装置。

公开(公告)号：US20030194309A1

公开(公告)日：2003-10-16

申请号：US10413138

申请日：2003-04-15

Applicant: RENA Sondermaschinen GmbH

Inventor： Jurgen Gutekunst

IPC: B05C003/00

CPC classification number: B65G39/07 ,  B65G21/209 ,  B65G39/02 ,  B65G39/18

Abstract: The invention relates to transporting rollers (22) for transporting essentially flat articles, to holding-down means (23) for pressing the articles onto transporting rollers (22), and to a transporting system (30). In this case, the transporting roller (22) is of at least two-part configuration and comprises a spindle element and at least one track element (1), the latter enclosing the spindle element in a tubular manner. The invention consists in designing transporting rollers (22) such that the spindle element is flexurally rigid, and in presenting an essentially cylindrical holding-down means (23) which is of at least two-part configuration and comprises a spindle (8) and at least one sleeve (13), wherein the internal diameter of the sleeve is larger than the external diameter of the spindle, the spindle (8) and the sleeve (13) of the holding-down means are coupled, and a pin-like carry-along element which is oriented away from the spindle (8) and engages in a cutout (16) on at least one side of the sleeve (13) is fitted on the spindle (8). The invention allows articles to be processed continuously, while keeping to the correct track as precisely as possible, with careful handling, in the case of which, under a wide range of different conditions in respect of temperature, pressure and surrounding medium, the workpieces are exposed to only a low level of mechanical loading.

Abstract translation: 本发明涉及用于将基本上平坦的物品运送到用于将物品压送到输送辊上的压紧装置（ 22 ）的输送辊（< / highlight>）和传送系统（ 30 ）。 在这种情况下，传送辊（ 22 ）具有至少两部分的构造，并且包括主轴元件和至少一个轨道元件（ 1 ），后者包围 主轴元件以管状方式。 本发明在于设计传送辊（ 22 ），使得主轴元件弯曲刚性，并且呈现基本上为圆柱形的压紧装置（ 23 ），其处于 至少两部分构造，并且包括主轴（ 8 ）和至少一个套筒（ 13 ），其中套筒的内径大于 主轴，压紧装置的主轴（ 8 ）和套筒（ 13 ）相耦合，并且一个销状的携带元件 主轴（ 8 ）并在套筒的至少一侧（ 13 ）上进入切口（ 16 ） （ 8 ）。 本发明允许制品被连续地加工，同时尽可能精确地保持在正确的轨道上，在小心处理的情况下，在温度，压力和周围介质的宽范围的不同条件下，工件是 仅暴露于低水平的机械负载。

公开(公告)号：US20030089312A1

公开(公告)日：2003-05-15

申请号：US10220687

申请日：2002-09-04

Inventor： Franz Ehrenleitner ,  Hans-Joachim Weinand

IPC: B05C003/00

CPC classification number: B65G49/0459

Abstract: An installation for painting objects, in particular vehicle bodies (4), has at least one bath (2, 3) containing a treatment fluid in which the objects (4) are to be immersed. The objects (4) are guided through the installation in a continuous or intermittent translatory movement with the aid of a conveyor device (5). A plurality of immersion devices is provided, which support the objects with the aid of a supporting structure (44). The latter is connected to the conveyor device (5) by way of a connecting structure. Each connecting structure has at least one steering linkage which in turn comprises two steering means (40, 41, 42, 43) arranged at a distance from one another. The steering means (40, 41, 42, 43) are each rotatably connected to the conveyor device (5) at one end and rotatably connected to the supporting structure (44) at the other end. At least one device (45 to 52) ensures that at least one of the two steering means (40, 41, 42, 43) of the steering linkage can be rotated about the axis produced by its articulated connection to the conveyor device (5). It is possible for very different kinematics of the immersion and removal movement to be realised with the aid of the immersion device described, including those movements in which the object is lowered in parallel alignment with its original orientation and those in which the object is rotated about a horizontal axis.

Abstract translation: 用于涂漆物体，特别是车体（4）的装置具有至少一个含有物体（4）将被浸入的处理流体的浴槽（2,3）。 物体（4）借助于输送装置（5）以连续或间歇的平移运动被导引通过装置。 提供了多个浸没装置，其借助于支撑结构（44）支撑物体。 后者通过连接结构连接到输送装置（5）。 每个连接结构具有至少一个转向联动装置，该转向联动装置又包括彼此间隔设置的两个转向装置（40,41,42,43）。 转向装置（40,41,42,43）在一端各自可旋转地连接到输送装置（5），并在另一端可旋转地连接到支撑结构（44）。 至少一个装置（45至52）确保转向连杆机构的两个转向装置（40,41,42,43）中的至少一个可以围绕由其与传送装置（5）的铰接连接产生的轴线旋转， 。 借助于所描述的浸没装置，可以实现浸没和移除运动的非常不同的运动学，包括那些运动，其中物体与其原始方向平行地对准地降下，而物体相对于其旋转的那些运动 水平轴。

公开(公告)号：US20030037727A1

公开(公告)日：2003-02-27

申请号：US10207524

申请日：2002-07-29

Inventor： Kenichi Yasuda ,  Nobuaki Kobayashi ,  Tadaaki Sumitani

IPC: B05C003/00

CPC classification number: G03G5/0525 ,  B05C3/09 ,  B05C3/109

Abstract: A coating apparatus for a plurality of cylindrical light sensitive members each for use in an electrophotography, is provided with a coating tank in which a coating liquid is stored; a dipping device to lift down the plurality of cylindrical base members into the coating liquid and to lift up the plurality of cylindrical base members above the coating liquid so that the plurality of cylindrical base members are coated with the coating liquid; and a plurality of drying hoods corresponding in number to the plurality of cylindrical base members and provided above the coating tank so that each of the plurality of cylindrical base members is lifted up from the coating tank into a respective drying hood among the plurality of cylindrical base members.

Abstract translation: 一种用于电子照相用的多个圆柱形感光元件的涂布设备设置有涂覆液体，其中存储涂布液体; 浸渍装置，用于将所述多个圆筒形基底构件提升到所述涂布液中，并且在所述涂布液上方提升所述多个圆筒形基部构件，使得所述多个圆筒形基部构件涂覆有所述涂布液; 以及多个干燥罩，其数量对应于多个圆筒形基座构件，并且设置在涂布槽上方，使得多个圆筒形基座构件中的每一个从涂布槽上升到多个圆筒形基座中的相应的干燥罩 会员

公开(公告)号：US20020150832A1

公开(公告)日：2002-10-17

申请号：US10087726

申请日：2002-03-01

Inventor： Takehiko Kinoshita ,  Tatsuya Kubota ,  Akihiko Matuyama

IPC: B05C003/00

CPC classification number: G03G5/0525 ,  B05C3/09 ,  B05D1/18

Abstract: A method of coating a photoconductive element for an electrophotographic image forming apparatus and an apparatus therefore are disclosed. A plurality of cylindrical bodies are immersed in a bath, which stores a coating liquid, at the same time and then lifted out of the bath. As a result, a photoconductive film is formed on each cylindrical body.

Abstract translation: 因此，公开了一种涂覆电子照相图像形成装置用感光体的方法及装置。 将多个圆柱体浸入浴中，同时储存涂布液，然后将其从浴中提出。 结果，在每个圆柱体上形成光电导膜。

公开(公告)号：US20020104480A1

公开(公告)日：2002-08-08

申请号：US09777587

申请日：2001-02-06

Applicant: Xerox Corporation.

Inventor： Eugene A. Swain

IPC: B05C003/00

CPC classification number: B05C3/109

Abstract: An apparatus including: (a) a vessel for a solution having a bottom end and an open top end, and defining a vertical axis perpendicular to the bottom end; (b) an insert device having a bottom surface and a top surface and nested within the vessel, wherein the insert device defines a passageway dimensioned for a substrate which is parallel to the vertical axis and extending through the insert device, and wherein the insert device also defines at least one bypass channel extending through the insert to allow solution within the vessel to flow to the top surface of the insert device; and (c) an overflow container positioned adjacent the vessel to catch solution runoff from the top surface of the insert device.

Abstract translation: 一种装置，包括：（a）用于溶液的容器，其具有底端和敞开的顶端，并且限定垂直于底端的垂直轴; （b）具有底表面和顶表面并嵌套在所述容器内的插入装置，其中所述插入装置限定尺寸适于基底的通道，所述通道平行于所述垂直轴线并延伸穿过所述插入装置，并且其中所述插入装置 还限定延伸穿过插入件的至少一个旁通通道，以允许容器内的溶液流到插入装置的顶表面; 和（c）位于容器附近的溢流容器，以从插入装置的顶表面捕获溶液径流。

公开(公告)号：US20020029742A1

公开(公告)日：2002-03-14

申请号：US09944233

申请日：2001-08-30

Inventor： Walter L. Moden ,  Syed S. Ahmad ,  Gregory M. Chapman ,  Tongbi Jiang

IPC: B05C003/00

CPC classification number: H01L24/06 ,  H01L21/67132 ,  H01L23/4951 ,  H01L24/27 ,  H01L24/45 ,  H01L24/48 ,  H01L24/743 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method and apparatus for achieving a level exposed surface of a viscous material pool for applying viscous material to at least one semiconductor component by contacting at least a portion of the semiconductor component with viscous material within a reservoir. A level viscous material exposed surface is achieved by using at least one mechanism in association with the reservoir. The mechanism is configured to level the exposed surface of viscous material and maintain the exposed surface at a substantially constant level. The reservoir may be shaped such that the exposed surface of viscous material is supplied to a precise location.

Abstract translation: 一种用于通过使至少一部分半导体部件与储存器内的粘性材料相接触来实现用于将粘性材料施加到至少一个半导体部件的粘性材料池的水平暴露表面的方法和装置。 通过使用与储存器相关联的至少一个机构来实现水平的粘性材料暴露表面。 该机构构造成使暴露的粘性材料表面平坦化并将暴露的表面保持在基本恒定的水平。 储存器可以被成形为使得粘性材料的暴露表面被供应到精确位置。

公开(公告)号：US20040197485A1

公开(公告)日：2004-10-07

申请号：US10481437

申请日：2004-05-07

Inventor： Xinming Wang ,  Kenichi Abe ,  Koji Mishima

IPC: B05D001/18 ,  B05C003/00

CPC classification number: H01L21/76843 ,  C23C18/1619 ,  C23C18/1669 ,  C23C18/1676 ,  H01L21/288 ,  H01L21/76849 ,  H01L21/76874

Abstract: There is provided a plating apparatus and method which can control the temperature of a plating solution during plating more uniformly and easily form a uniform plated film on the to-be-plated surface of a workpiece, and which can simplify the device and decrease the footprint. The plating apparatus includes: a plating bath of a double bath structure (18) including an inner bath (14) for holding a plating solution and carrying out plating, and an outer bath (26) which surrounds the inner bath (14) and is in fluid communication therewith; and a heating device (30) disposed in the outer bath (26). The plating apparatus may further include means (32) for circulating or stirring the plating solution (12) in the plating bath (18).

Abstract translation: 提供一种电镀装置和方法，其可以在电镀期间更均匀地控制电镀液的温度，并且容易地在待镀覆的表面上形成均匀的镀膜，并且可以简化装置并减少占地面积 。 电镀装置包括：双浴结构（18）的镀浴，包括用于保持电镀液并进行电镀的内浴（14）和围绕内槽（14）的外槽（26），并且是 与其流体连通; 和设置在外槽（26）中的加热装置（30）。 电镀装置还可以包括用于使电镀液（18）中的电镀液（12）循环或搅拌的装置（32）。

公开(公告)号：US20040154535A1

公开(公告)日：2004-08-12

申请号：US10770737

申请日：2004-02-03

Applicant: APPLIED MATERIALS, INC.

Inventor： Guan-Shian Chen ,  Michael X. Yang

IPC: B05C003/00

CPC classification number: H01L21/67173 ,  C23C18/1632 ,  C25D7/123 ,  H01L21/6719 ,  H01L21/6723

Abstract: Embodiments of the invention generally provide a substrate processing system and method. The substrate processing system generally includes two primary components. The first component is an interface section having at least one first substrate transfer robot positioned therein, and the second component is at least one processing module in communication with the interface section, the at least one processing module having a pretreatment and post treatment cell, a processing cell, at a second substrate transfer robot positioned therein. The substrate processing method generally includes transporting a dry substrate to a processing module via a dry interface. Once the substrate is positioned in the processing module, a robot transfers the substrate between a treatment cell and a processing cell contained within the processing module to complete a predetermined sequence of processing steps. Once the processing steps are completed, the treatment cell generally dries the substrate and then the substrate is transferred back to the dry interface.