公开(公告)号：US20230159754A1

公开(公告)日：2023-05-25

申请号：US17530978

申请日：2021-11-19

申请人： The Boeing Company

发明人： Ying Shi ,  Timothy J. Luchini ,  Marcos Pantoja ,  Alexander M. Rubin

IPC分类号： C08L79/08 ,  C08L71/12 ,  B29C43/00

CPC分类号： C08L79/08 ,  C08L71/12 ,  B29C43/003 ,  B29K2071/12

摘要： A thermoplastic composition includes a thermoplastic polymer and a polyaryletherketone polymer in admixture with the thermoplastic polymer.

公开(公告)号：US20230143277A1

公开(公告)日：2023-05-11

申请号：US17524093

申请日：2021-11-11

申请人： Carbon, Inc.

发明人： Matthew S. Menyo ,  Lloyd M. Robeson

IPC分类号： B29C64/129 ,  C08F2/50 ,  C08L69/00 ,  C08L79/08 ,  B33Y10/00 ,  B33Y70/10

CPC分类号： B29C64/129 ,  C08F2/50 ,  C08L69/00 ,  C08L79/08 ,  B33Y10/00 ,  B33Y70/10 ,  B29K2501/12

摘要： Provided herein according to some embodiments is a dual cure stereolithography resin that includes a Diels-Alder adduct, which adduct is light polymerizable in the first, light, cure to produce an intermediate object, and on heating the intermediate object yields a bis-maleimide that can further react and/or polymerize during the second, heat, cure.

公开(公告)号：US11640111B2

公开(公告)日：2023-05-02

申请号：US16467702

申请日：2018-07-24

申请人： LG CHEM, LTD.

发明人： Min Hyung Lee ,  Dai Seung Choi

IPC分类号： G03F7/037 ,  C08G73/10 ,  C08L79/08 ,  C08G73/22 ,  C09D179/08

摘要： A photosensitive resin composition including a poly(imide-benzoxazine) block copolymer, and a cured film. The poly(imide-benzoxazine) block copolymer included in the photosensitive resin composition enables the formation of a cured film having excellent mechanical and insulation even at a low temperature of less than 200° C.

公开(公告)号：US11639439B2

公开(公告)日：2023-05-02

申请号：US17411065

申请日：2021-08-25

申请人： Prior Company Limited

发明人： Yu Lin Huang ,  I-Ling Chen ,  Cheng-Hsin Tsai

IPC分类号： C08L63/04 ,  C08J5/24 ,  C08L79/08 ,  C08G64/12 ,  C08K5/13

摘要： A thermosetting resin composition and a prepreg are provided. The thermosetting resin composition includes a maleimide resin, a cyanate ester resin, and a crosslinking agent. The crosslinking agent is a silane-modified diallyl bisphenol compound whose structure is represented by Formula (1): in Formula (1), X is a linear or branched C1 to C6 alkyl, cycloalkyl, or sulfonyl group, R1 is a linear or branched C1 to C6 alkyl or aryl group, R2 is a C1 to C6 alkyl group, R3 is a functional group with a crosslinkable double bond, and n+m is a positive integer from 1 to 8.

公开(公告)号：US20230122622A1

公开(公告)日：2023-04-20

申请号：US17966935

申请日：2022-10-17

申请人： SK Innovation Co., Ltd. ,  SK ie technology Co., Ltd.

发明人： Jin Hyung Park ,  Hye Ri Kim ,  Seung Min Jeon

IPC分类号： C08L79/08 ,  C07C233/81 ,  C08J5/18 ,  C07C211/37 ,  C07D493/04

摘要： The present disclosure relates to a composition containing a polyamideimide precursor and/or polyamideimide, a polyamideimide film produced using the composition, and a display device including the polyamideimide film. The polyamideimide film produced using the composition and the display device including the polyamideimide film have excellent mechanical and optical properties.

公开(公告)号：US11629202B2

公开(公告)日：2023-04-18

申请号：US16474971

申请日：2018-01-03

申请人： Carbon, Inc.

发明人： Matthew S. Menyo ,  Lloyd M. Robeson

IPC分类号： C08F2/48 ,  B33Y10/00 ,  B33Y70/00 ,  B29C64/129 ,  C08L33/12 ,  C08F2/60 ,  B33Y40/00 ,  B29C64/124 ,  B29C64/35 ,  C08F222/26 ,  C08L33/14 ,  C08L35/02 ,  C08L63/00 ,  C08L69/00 ,  C08L79/08 ,  C08L81/06 ,  C08F222/40 ,  B29K501/12

摘要： Provided herein according to some embodiments is a dual cure stereolithography resin that includes thermoplastic particles, which thermoplastic particles are insoluble in the resin and insoluble during a first, light, cure in which an intermediate object is produced, but then dissolve or swell in the intermediate object during the second, heat, cure.

公开(公告)号：US20230110450A1

公开(公告)日：2023-04-13

申请号：US17873856

申请日：2022-07-26

申请人： University of Cincinnati

发明人： Jude Onwuegbu Iroh ,  Xuemei Cui ,  Shengdong Xiao ,  Ruchinda S. Gooneratne

IPC分类号： C09D179/08 ,  C08L79/08

摘要： A method of making a three-dimensional object comprising one or more polyimide copolymers, polyimide composites or combinations thereof is provided. The method involves 3D printing a solution comprising polyamic acid (PAA), tetraethyl orthosilicate (TEOS), and a silane selected from the group consisting of aminopropyl trimethoxysilane (APTMS), aminopropyl triethoxysilane (APTES), N-[3-(trimethoxysilyl)propyl]-ethylene diamine (ETDA), and glycidoxypropyl trimethoxysilane (GPTMS) to produce a three-dimensional form, and thermosetting the three-dimensional form.

公开(公告)号：US20230096745A1

公开(公告)日：2023-03-30

申请号：US17895147

申请日：2022-08-25

申请人： SK Innovation Co., Ltd. ,  SK ie technology Co., Ltd.

发明人： Cheol Min Yun ,  So Young Lee ,  Hye Jin Park ,  Joo Hyun Lee

IPC分类号： C08L79/08 ,  C08J5/18 ,  C08G73/14

摘要： The present disclosure relates to a polyamideimide film-forming composition, a polyamideimide film, a method of preparing a polyamideimide film-forming composition, a method of producing a polyamideimide film, and uses of a polyamideimide film-forming composition and a polyamideimide film. The polyamideimide film according to one embodiment prevents deterioration of colorless and transparent optical properties, has excellent visibility with no optical stains, has excellent heat resistance, is flexible, and has excellent bending properties.

公开(公告)号：US20230095959A1

公开(公告)日：2023-03-30

申请号：US17801575

申请日：2021-02-24

申请人： SUMITOMO BAKELITE CO., LTD.

发明人： Tadasuke Endo ,  Tomomasa Kashino

IPC分类号： C08K3/38 ,  C08L63/00 ,  C08L79/08

摘要： The thermosetting resin composition of the present invention includes an epoxy resin (A), a curing agent (B), and thermally conductive particles (C), in which the epoxy resin (A) includes a mesogen skeleton and has a softening point of 60° C. or lower, and a thermal conductivity λ200 of a cured product of the thermosetting resin composition at 200° C. is 12.0 W/(m·K) or higher.

公开(公告)号：US20230076244A1

公开(公告)日：2023-03-09

申请号：US17785673

申请日：2020-11-30

申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.

发明人： Atsushi SAKAI ,  Yuuki SATO

IPC分类号： C08L79/08 ,  C08L81/10

摘要： A polyimide resin composition containing a polyimide resin (A) and a polyetherimide sulfone resin (B), wherein the polyimide resin (A) contains a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), and a content ratio of the repeating structural unit of the formula (1) with respect to the total of the repeating structural unit of the formula (1) and the repeating structural unit of the formula (2) is 20 to 70 mol %; and a molded article containing the same. (R1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R2 represents a divalent chain aliphatic group having from 5 to 16 carbon atoms; and X1 and X2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring.)