ISOLATOR CIRCUIT
    32.
    发明公开
    ISOLATOR CIRCUIT 审中-公开

    公开(公告)号:US20240305274A1

    公开(公告)日:2024-09-12

    申请号:US18179482

    申请日:2023-03-07

    IPC分类号: H03H11/02 H03K5/01 H03K19/21

    摘要: In some examples, an apparatus includes an isolating transformer and a grounding circuit. The isolating transformer has first and second coils separated by an isolation barrier, the first coil having first and second terminals. The grounding circuit is coupled to the first and second terminals. The grounding circuit is configured to couple the first and second terminals to a ground terminal during a first time period. The grounding circuit is also configured to decouple the first and second terminals from the ground terminal during a second time period.

    Radio frequency circuit, radio frequency module, and communication device

    公开(公告)号:US11936355B2

    公开(公告)日:2024-03-19

    申请号:US17452429

    申请日:2021-10-27

    发明人: Shou Matsumoto

    IPC分类号: H03H11/02 H03F3/24 H04B1/44

    摘要: A filter allows a transmission signal in a predetermined frequency band to pass from a second input-output terminal to a first input-output terminal and allows a reception signal in the predetermined frequency band to pass from the first input-output terminal to the second input-output terminal. A first common terminal of a first switch is connected to the second input-output terminal. A second terminal and a first terminal of the first switch are exclusively connectable to the first common terminal. A second common terminal of a second switch is connected to a ground terminal of the filter. A second selection terminal and a first selection terminal of the second switch are exclusively connected to the second common terminal. Of the first selection terminal and the second selection terminal, only the first selection terminal is connected to a ground with a reactive element interposed therebetween.

    JOINING DEVICE AND METHOD FOR MANUFACTURING JOINED OBJECT

    公开(公告)号:US20230053736A1

    公开(公告)日:2023-02-23

    申请号:US17796612

    申请日:2021-02-04

    IPC分类号: B23K11/26 H03H11/02

    摘要: A joining device includes: a first circuit in which a primary-side winding of a first transformer and a first capacitor are connected; a second circuit in which a primary-side winding of a second transformer and a second capacitor are connected; an electrode connected to secondary-side winding of the first transformer and secondary-side winding of the second transformer; and a charge switch configured to switch between energization/de-energization of the first and second capacitors from a power supply without the transformers being interposed. The first circuit has a first discharge switch and the second circuit has a second discharge switch. A method for manufacturing a joined object includes, by using the joining device, supplying an object to be joined to be sandwiched by the electrode; causing a current to flow through the electrode that sandwiches the object to be joined to join the object to be joined.

    Matched filter bank
    38.
    发明授权

    公开(公告)号:US11533207B2

    公开(公告)日:2022-12-20

    申请号:US17050244

    申请日:2019-04-24

    发明人: Daniel Ryan Wei Li

    摘要: A radio receiver comprises a matched filter bank and a decision unit. The matched filter bank has a plurality of filter modules for generating correlation-strength data from a sampled radio signal, each filter module being configured to cross-correlate the sampled signal with data representing a respective filter sequence. The decision unit is configured to use the correlation-strength data to generate a sequence of decoded symbols from the sampled signal. The matched filter bank and/or decision unit are configured to determine the value of each symbol in the sequence in part based on the value of a respective earlier decoded symbol from the sequence of decoded symbols.

    High-frequency module
    40.
    发明授权

    公开(公告)号:US11245386B2

    公开(公告)日:2022-02-08

    申请号:US14170248

    申请日:2014-01-31

    发明人: Daisuke Tokuda

    摘要: A high-frequency module includes a semiconductor chip device that is mounted on an external circuit substrate by wire bonding. A switch forming section, a power amplifier forming section and a low noise amplifier forming section, realized by a group of FETs, which are active elements, are formed in the semiconductor chip device. Flat plate electrodes, which form capacitors are formed in the semiconductor chip device. Conductor wires that connect the external circuit substrate and the semiconductor chip device function as inductors. A group of passive elements that includes inductors and capacitors is formed. As a result, a high-frequency module that can be reduced in size while still obtaining the required transmission characteristic is realized.