METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING APPARATUS AND SEMICONDUCTOR DEVICE

    公开(公告)号:US20210167022A1

    公开(公告)日:2021-06-03

    申请号:US17108187

    申请日:2020-12-01

    Inventor: Paolo CREMA

    Abstract: A leadframe has a die pad area and an outer layer of a first metal having a first oxidation potential. The leadframe is placed in contact with a solution containing a second metal having a second oxidation potential, the second oxidation potential being more negative than the first oxidation potential. Radiation energy is then applied to the die pad area of the leadframe contacted with the solution to cause a local increase in temperature of the leadframe. As a result of the temperature increase, a layer of said second metal is selectively provided at the die pad area of the leadframe by a galvanic displacement reaction. An oxidation of the outer layer of the leadframe is then performed to provide an enhancing layer which counters device package delamination.

    High voltage startup booster
    415.
    发明授权

    公开(公告)号:US11018578B1

    公开(公告)日:2021-05-25

    申请号:US16671002

    申请日:2019-10-31

    Abstract: An electronic device includes a circuit board that manages supply of electricity to the electronic device. The circuit board includes an integrated circuit and an external capacitor coupled to a supply terminal of the circuit board. During a startup operation of the integrated circuit, the integrated circuit supplies a first charging current to charge the capacitor to a supply voltage value. The circuit board includes a boost circuit that receives a portion of the first charging current and outputs a second charging current that augments charging of the capacitor. The second charging current is an amplification of the first charging current. The integrated circuit enables operation of the electronic device after the capacitor is charged to the supply voltage value.

    HIGH VOLTAGE STARTUP BOOSTER
    419.
    发明申请

    公开(公告)号:US20210135568A1

    公开(公告)日:2021-05-06

    申请号:US16671002

    申请日:2019-10-31

    Abstract: An electronic device includes a circuit board that manages supply of electricity to the electronic device. The circuit board includes an integrated circuit and an external capacitor coupled to a supply terminal of the circuit board. During a startup operation of the integrated circuit, the integrated circuit supplies a first charging current to charge the capacitor to a supply voltage value. The circuit board includes a boost circuit that receives a portion of the first charging current and outputs a second charging current that augments charging of the capacitor. The second charging current is an amplification of the first charging current. The integrated circuit enables operation of the electronic device after the capacitor is charged to the supply voltage value.

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