公开(公告)号：US20210018676A1

公开(公告)日：2021-01-21

申请号：US16925586

申请日：2020-07-10

Applicant: ASML NETHERLANDS B.V.

Inventor： Hendrik SABERT ,  Patrick Sebastian UEBEL

IPC: G02B6/02 ,  G01K11/32

Abstract: A system and method for providing a radiation source. In one arrangement, the radiation source includes an optical fiber that is hollow, and has an axial direction, a gas that fills the hollow of the optical fiber, and a plurality of temperature setting devices disposed at respective positions along the axial direction of the optical fiber, wherein the temperature setting devices are configured to control the temperature of the gas to locally control the density of the gas.

公开(公告)号：US10892138B2

公开(公告)日：2021-01-12

申请号：US16295971

申请日：2019-03-07

Applicant: ASML Netherlands B.V.

Inventor： Weiming Ren ,  Xuedong Liu ,  Xuerang Hu ,  Zhong-wei Chen

IPC: H01J37/317 ,  H01J37/147 ,  H01J37/30 ,  B82Y40/00 ,  B82Y10/00 ,  H01J37/28

Abstract: The present disclosure proposes a crossover-forming deflector array of an electro-optical system for directing a plurality of electron beams onto an electron detection device. The crossover-forming deflector array includes a plurality of crossover-forming deflectors positioned at or at least near an image plane of a set of one or more electro-optical lenses of the electro-optical system, wherein each crossover-forming deflector is aligned with a corresponding electron beam of the plurality of electron beams.

公开(公告)号：US20210003927A1

公开(公告)日：2021-01-07

申请号：US17023474

申请日：2020-09-17

Applicant: ASML NETHERLANDS B.V.

Inventor： Davit Harutyunyan ,  Fei Jia ,  Frank Staals ,  Fuming Wang ,  Hugo Thomas Looijestijn ,  Cornelis Johannes Rijnierse ,  Maxim Pisarenco ,  Roy Werkman ,  Thomas Theeuwes ,  Tom Van Hemert ,  Vahid Bastani ,  Jochem Sebastiaan Wildenberg ,  Everhardus Cornelis Mos ,  Erik Johannes Maria Wallerbos

IPC: G03F7/20 ,  G05B13/04

Abstract: A method, system and program for determining a fingerprint of a parameter. The method includes determining a contribution from a device out of a plurality of devices to a fingerprint of a parameter. The method includes obtaining parameter data and usage data, wherein the parameter data is based on measurements for multiple substrates having been processed by the plurality of devices, and the usage data indicates which of the devices out of the plurality of the devices were used in the processing of each substrate; and determining the contribution using the usage data and parameter data.

公开(公告)号：US20210003924A1

公开(公告)日：2021-01-07

申请号：US17022910

申请日：2020-09-16

Applicant: ASML Netherlands B.V.

Inventor： Patricius Aloysius Jacobus TINNEMANS ,  Arie Jeffrey DEN BOEF ,  Armand Eugene Albert KOOLEN ,  Nitesh PANDEY ,  Vasco Tomas TENNER ,  Willem Marie Julia Marcel COENE ,  Patrick WARNAAR

IPC: G03F7/20 ,  G01B11/06 ,  G01B11/02 ,  G01N21/47 ,  G01N21/95 ,  G03F9/00

Abstract: Described is a metrology system for determining a characteristic of interest relating to at least one structure on a substrate, and associated method. The metrology system comprises a processor being configured to computationally determine phase and amplitude information from a detected characteristic of scattered radiation having been reflected or scattered by the at least one structure as a result of illumination of said at least one structure with illumination radiation in a measurement acquisition, and use the determined phase and amplitude to determine the characteristic of interest.

公开(公告)号：US10886093B2

公开(公告)日：2021-01-05

申请号：US16703729

申请日：2019-12-04

Applicant: ASML Netherlands B.V.

Inventor： Ronald Van Der Wilk

IPC: H01J5/46 ,  C03C27/04 ,  H01J5/36 ,  H01J9/28

Abstract: A feedthrough for providing an electrical connection is provided. The feedthrough comprises a conductor and a quartz or a glass structure configured to surround at least a portion of the conductor and provide isolation to the conductor. The conductor and the quartz or glass structure may be coaxially arranged. The feedthrough can provide an electrical connection between an inside and outside of a vacuum chamber that contains a sample.

公开(公告)号：US10884342B2

公开(公告)日：2021-01-05

申请号：US15771585

申请日：2016-10-07

Applicant: ASML NETHERLANDS B.V.

Inventor： Martinus Gerardus Maria Johannes Maassen ,  Reinder Teun Plug ,  Kaustuve Bhattacharyya

IPC: G03F7/20 ,  G06F30/39 ,  G06F119/18

Abstract: A metrology system can be integrated within a lithographic apparatus to provide integrated metrology within the lithographic process. However, this integration can result in a throughput or productivity impact of the whole lithographic apparatus which can be difficult to predict. It is therefore proposed to acquire throughput information associated with a throughput of a plurality of substrates within a lithographic apparatus, the throughput information including a throughput parameter, and predict, using a throughput simulator, a throughput using the throughput parameter as an input parameter. The throughput simulator may be calibrated using the acquired throughput information. The impact of at least one change of a throughput parameter on the throughput of the lithographic apparatus may be predicted using the throughput simulator.

公开(公告)号：US10859930B2

公开(公告)日：2020-12-08

申请号：US16665022

申请日：2019-10-28

Applicant: ASML NETHERLANDS B.V.

Inventor： Jasper Menger ,  Paul Cornelis Hubertus Aben ,  Everhardus Cornelis Mos

IPC: G03F9/00

Abstract: Offline metrology measurements are performed on substrates that have been subjected to lithographic processing. Model parameters are calculated by fitting the measurements to an extended high-order substrate model defined using a combination of basis functions that include an edge basis function related to a substrate edge. A radial edge basis function may be expressed in terms of distance from a substrate edge. The edge basis function may, for example, be an exponential decay function or a rational function. Lithographic processing of a subsequent substrate is controlled using the calculated high-order substrate model parameters, in combination with low-order substrate model parameters obtained by fitting inline measurements to a low order model.

公开(公告)号：US10859923B2

公开(公告)日：2020-12-08

申请号：US16792267

申请日：2020-02-16

Applicant: ASML Netherlands B.V.

Inventor： Gonzalo Roberto Sanguinetti ,  Murat Bozkurt ,  Maurits Van Der Schaar ,  Arie Jeffrey Den Boef

IPC: G03B27/54 ,  G03F7/20 ,  G01B11/27

Abstract: Overlay error of a lithographic process is measured using a plurality of target structures, each target structure having a known overlay bias. A detection system captures a plurality of images (740) representing selected portions of radiation diffracted by the target structures under a plurality of different capture conditions (λ1, λ2). Pixel values of the captured images are combined (748) to obtain one or more synthesized images (750). A plurality of synthesized diffraction signals are extracted (744) from the synthesized image or images, and used to calculate a measurement of overlay. The computational burden is reduced compared with extracting diffraction signals from the captured images individually. The captured images may be dark-field images or pupil images, obtained using a scatterometer.

公开(公告)号：US20200379358A1

公开(公告)日：2020-12-03

申请号：US16999140

申请日：2020-08-21

Applicant: ASML Netherlands B.V.

Inventor： Erik Willem Bogaart

IPC: G03F7/20 ,  G03F9/00

Abstract: A lithographic apparatus includes a number of sensors for measuring positions of features on a substrate prior to applying a pattern. Each sensor includes an imaging optical system. Position measurements are extracted from pixel data supplied by an image detector in each sensor. The imaging optical system includes one or more light field modulating elements and the processor processes the pixel data as a light-field image to extract the position measurements. The data processor may derive from each light-field image a focused image of a feature on the substrate, measuring positions of several features simultaneously, even though the substrate is not at the same level below all the sensors. The processor can also include corrections to reduce depth dependency of an apparent position of the feature include a viewpoint correction. The data processor can also derive measurements of heights of features on the substrate.

公开(公告)号：US10852646B2

公开(公告)日：2020-12-01

申请号：US16300314

申请日：2017-04-20

Applicant: ASML NETHERLANDS B.V.

Inventor： Marinus Jochemsen ,  Scott Anderson Middlebrooks ,  Stefan Hunsche ,  Te-Sheng Wang

IPC: G03F7/20

Abstract: A method including obtaining an image of a plurality of structures on a substrate, wherein each of the plurality of structures is formed onto the substrate by transferring a corresponding pattern of a design layout; obtaining, from the image, a displacement for each of the structures with respect to a reference point for that structure; and assigning each of the structures into one of a plurality of groups based on the displacement.