公开(公告)号：US08544374B2

公开(公告)日：2013-10-01

申请号：US12095413

申请日：2006-12-01

申请人： Masao Yamamoto ,  Atsushi Tabata

发明人： Masao Yamamoto ,  Atsushi Tabata

IPC分类号： B31B1/25

CPC分类号： B28D1/225 ,  B28D7/043 ,  C03B33/027 ,  C03B33/037 ,  C03B33/10 ,  Y10T83/0333 ,  Y10T83/0341 ,  Y10T83/0385 ,  Y10T83/9403

摘要： A tip 14 is rotatably attached to a tip holder 10. The tip holder 10 is made into a cylindrical shape and its end has an installation part 16. An opening is arranged at a holder joint. The tip holder 10 is attracted by a magnet for attachment so that detaching and attaching can be performed easily. Tip offset data is recorded as a 2-dimensional code 17 on the surface of the tip holder 10. When replacing the tip holder, the offset data is read out and inputted to a scribe device, thereby canceling the offset. This eliminates the operation required for correction when attaching/detaching the tip holder and enables easy tip replacement during a short time of device stop.

公开(公告)号：USD678924S1

公开(公告)日：2013-03-26

申请号：US29377979

申请日：2010-10-28

申请人： Masanobu Soyama

设计人： Masanobu Soyama

公开(公告)号：US08348115B2

公开(公告)日：2013-01-08

申请号：US10533650

申请日：2003-11-04

申请人： Haruo Wakayama

发明人： Haruo Wakayama

IPC分类号： B26F3/00

CPC分类号： C03B33/093 ,  B23K26/40 ,  B23K2103/50 ,  C03B33/027 ,  C03B33/091 ,  Y10T83/0341 ,  Y10T225/12 ,  Y10T225/321

摘要： A vertical crack is generated at a desired position on a brittle material substrate S by making a wheel tip 5a of a glass cutter 5 move while being in contact with the substrate surface by a load which does not allow the wheel tip 5a to damage the surface, using an armature 6 applying an abrupt impact force for generating the vertical crack having a predetermined depth, to the glass cutter 5 moving on the substrate. A scribe line is formed as the vertical crack is urged to extend along a planned scribe line, due to a stress gradient exerted onto the vertical crack and occurring between a compressive stress in an irradiation area on the substrate at which a laser beam is irradiated from a laser beam oscillator 8 and a tensile stress in a cooling area made by a cooling medium released from a cooling nozzle 7.

摘要翻译： 在脆性材料基板S上的期望位置产生垂直裂纹，通过使玻璃切割器5的轮胎末端5a与基板表面接触而移动，该载荷不允许轮胎末端5a损伤表面 使用施加突然冲击力的电枢6将具有预定深度的垂直裂纹施加到在基板上移动的玻璃切割器5。 由于施加在垂直裂纹上的应力梯度，在沿着激光束照射的基板上的照射区域中的压缩应力之间发生垂直裂纹，因此垂直裂纹被推动沿着计划划线延伸，形成划痕线 激光束振荡器8和由从冷却喷嘴7释放的冷却介质制成的冷却区域中的拉伸应力。

公开(公告)号：US20110167979A1

公开(公告)日：2011-07-14

申请号：US12981218

申请日：2010-12-29

申请人： Toshio AKAI ,  Keitaro OKAMOTO ,  Masanobu SOYAMA

发明人： Toshio AKAI ,  Keitaro OKAMOTO ,  Masanobu SOYAMA

IPC分类号： B26D3/06

CPC分类号： B28D5/00 ,  H01L21/67092 ,  H01L31/046 ,  H01L31/188 ,  H01L31/208 ,  Y02E10/50 ,  Y02P70/521 ,  Y10T83/0304

摘要： There is provided a groove machining tool supported in a holder and caused to move together with the holder in relative fashion along a scheduled scribe line over an integrated thin-film solar cell substrate to form a groove. The groove machining tool includes a tool body supported in the holder, and a blade tip part formed in a distal part of the tool body. The blade tip part includes a blade extending along a direction intersecting a direction of movement of the tool, at a first end along the direction of movement of the tool. The blade is tilted backward from the direction of movement of the tool in relation to a direction orthogonal to the direction of movement of the groove tool, as viewed from a bottom face of the blade tip part.

摘要翻译： 提供了一种支撑在保持器中的凹槽加工工具，并使其与保持器一起沿着整体式薄膜太阳能电池基板上的预定切割线一起移动以形成凹槽。 凹槽加工工具包括支撑在保持器中的工具主体和形成在工具主体的远端部分中的刀片尖部。 叶片尖端部分包括在沿着工具的移动方向的第一端沿着与工具的移动方向相交的方向延伸的叶片。 从叶片前端部的底面观察，叶片相对于与槽工具的移动方向正交的方向从工具的移动方向向后方倾斜。

公开(公告)号：US07975589B2

公开(公告)日：2011-07-12

申请号：US11988193

申请日：2006-07-06

申请人： Kazuya Maekawa ,  Haruo Wakayama

发明人： Kazuya Maekawa ,  Haruo Wakayama

IPC分类号： B26F3/00

CPC分类号： B28D1/225 ,  C03B33/033 ,  C03B33/07 ,  C03B33/107 ,  Y10T29/49 ,  Y10T83/0385 ,  Y10T83/9403 ,  Y10T225/12 ,  Y10T225/321

摘要： A scribing wheel for a brittle material includes a circumferential ridgeline in which two truncated cones have connected bottoms so as to share a rotational axis. Alternating notches and protrusions are formed along the circumference ridgeline. The protrusion are portions of the ridgeline remaining after the ridgeline is notched. The length of the notches is less than that of the protrusions so that a catch on the surface is improved while lowering the high penetrability.

摘要翻译： 用于脆性材料的划线轮包括圆周棱线，其中两个截锥体具有连接的底部以共享旋转轴线。 沿着圆周棱线形成交替的凹口和突起。 突出部是在脊线被切口后残留的脊线的部分。 凹口的长度小于突起的长度，从而在降低高穿透性的同时提高了表面上的卡扣。

公开(公告)号：US20110095062A1

公开(公告)日：2011-04-28

申请号：US12910242

申请日：2010-10-22

申请人： Kazuya MAEKAWA

发明人： Kazuya MAEKAWA

IPC分类号： B26F3/00

CPC分类号： C03B33/10 ,  C03B33/033 ,  Y10T225/12 ,  Y10T225/379

摘要： [Object] To provide a breaking apparatus with which a substrate can be divided with a smaller breaking load.[Means for Achieving Object] The breaking apparatus has: a table 12 on which a brittle material substrate is placed; a roller head 40 for supporting a freely rotatable roller 32 which makes contact with the substrate and has a vibration actuator 38 for vibrating the roller in the direction in which it is pressed against the substrate; and a moving mechanism 22 for moving the roller head over the surface of the substrate, and a scribe line S is created on a first surface of a brittle material substrate, and a roller is rolled along the scribe line but on a second surface that is on the opposite side from the first surface while pressed against the substrate with the roller being vibrated in the direction in which the roller is pressed against the substrate, and thus the substrate is divided along the scribe line.

摘要翻译： 本发明提供一种能够以较小的断裂载荷分割基板的断开装置。 实现对象的手段破碎装置具有：放置有脆性材料基板的工作台12; 用于支撑与基板接触的可自由旋转的辊32的滚子头40，并具有振动致动器38，该振动致动器38使辊沿其压靠在基板上的方向振动; 以及用于将辊头移动到基板的表面上的移动机构22，并且在脆性材料基板的第一表面上形成划线S，并且沿着划线滚动辊，但是在第二表面上是 在辊被压靠在基板上的方向上振动的同时在与第一表面相对的一侧上压制基板，从而沿着划线划分基板。

公开(公告)号：US07851241B2

公开(公告)日：2010-12-14

申请号：US10509895

申请日：2003-04-01

申请人： Kazuya Maekawa ,  Hiroshi Soyama

发明人： Kazuya Maekawa ,  Hiroshi Soyama

IPC分类号： H01L21/00 ,  H01L21/30

CPC分类号： C03B33/10 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/033 ,  C03B33/074 ,  C03B33/107 ,  Y02P40/57 ,  Y10T83/0333 ,  Y10T83/0385

摘要： There are provided a scribing step of performing scribing in a state in which a protective material is applied on at least one surface of a brittle material substrate, and a first scribing device that performs this scribing step. Accordingly, it is possible to form a vertical crack that reaches deep inside of the substrate, while effectively removing cullets produced at the time of severing the substrate, thus performing precise severing along a scribe line.

摘要翻译： 提供了在将脆性材料基板的至少一个表面上施加保护材料的状态下进行划线的划线工序，以及进行该划线工序的第一划线装置。 因此，可以形成到底板深处的垂直裂纹，同时有效地去除在切割基板时产生的碎片，从而沿划线执行精确切断。

公开(公告)号：US07816623B2

公开(公告)日：2010-10-19

申请号：US11976403

申请日：2007-10-24

申请人： Yasuhide Otsu ,  Tatsuo Eda

发明人： Yasuhide Otsu ,  Tatsuo Eda

IPC分类号： B23K26/04

CPC分类号： B23K26/0736 ,  B23K26/0604 ,  B23K26/0608 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  C03B33/093

摘要： In a method for processing brittle material, a laser light from a laser light source irradiates the brittle material and transports an irradiating position of the laser light along a predetermined line, wherein the laser light L from a plurality of laser light sources 11, 12 . . . m1, m2 . . . mn is irradiated simultaneously onto the surface of the brittle material W, and an irradiating range of the laser light, which is set to a predetermined shape, is moved over the surface of the brittle material. Furthermore, a plurality of optical wave guides 10 . . . 10 that guide the laser light from the laser light sources 11, 12 . . . m1, m2 . . . mn to the brittle material are provided, and composite laser light L irradiates the surface of the brittle material, with these optical wave guides 10 . . . 10 bundled together.

摘要翻译： 在脆性材料的加工方法中，来自激光光源的激光照射脆性材料，并沿着预定的线传送激光的照射位置，其中来自多个激光光源11,12的激光L。 。 。 m1，m2。 。 。 mn同时照射到脆性材料W的表面上，并且将设定为预定形状的激光的照射范围移动到脆性材料的表面上。 此外，多个光波导10。 。 。 10，其引导来自激光光源11,12的激光。 。 。 m1，m2。 。 。 提供了脆性材料，并且复合激光L利用这些光波导10照射脆性材料的表面。 。 。 10捆绑在一起

公开(公告)号：US07814819B2

公开(公告)日：2010-10-19

申请号：US12687488

申请日：2010-01-14

申请人： Hiroshi Soyama

发明人： Hiroshi Soyama

IPC分类号： B31B1/25 ,  B26D1/12

CPC分类号： C03B33/107 ,  B28D1/225 ,  C03B33/027 ,  C03B33/10 ,  Y10T83/037 ,  Y10T83/0385 ,  Y10T83/9377 ,  Y10T83/9457 ,  Y10T83/9464

摘要： A rotating shaft (23) is inserted through an axial center of a cutter wheel tip for scribing a brittle object. The rotating shaft (23) is integrally provided with the cutter wheel tip. The rotating shaft (23) is inserted into supporting holes (14) provided in side walls (11) of a tip holder (11) so as to be supported. A groove (13) is formed in an upper portion of each supporting hole (14) along an axial direction of the supporting hole (14).

摘要翻译： 旋转轴（23）穿过切割轮末端的轴心插入，用于划伤脆性物体。 旋转轴（23）与切割轮末端一体地设置。 旋转轴（23）插入到设置在尖端保持器（11）的侧壁（11）中的支撑孔（14）中以被支撑。 沿着支撑孔（14）的轴向在每个支撑孔（14）的上部形成有槽（13）。

公开(公告)号：US07723212B2

公开(公告)日：2010-05-25

申请号：US11572931

申请日：2005-07-29

申请人： Koji Yamamoto ,  Noboru Hasaka

发明人： Koji Yamamoto ,  Noboru Hasaka

IPC分类号： H01L21/00

CPC分类号： C03B33/093 ,  B23K26/40 ,  B23K2103/50 ,  B28D1/221 ,  B28D5/0011

摘要： A method for forming a median crack and an apparatus for forming a median crack are provided, where the formation of a deep, straight median crack is possible, and an excellent broken surface of a brittle substrate can be gained as a result of breaking. In the method for forming a median crack in a brittle substrate, the brittle substrate is irradiated with a laser beam along a laser-scribe line to be formed with median cracks on the brittle substrate so as to be heated to a temperature that is no higher than its melting temperature, and thereby, a median crack is created along the laser-scribe line to be formed with median cracks and expanded starting from a notch that has been formed in the brittle substrate, and this method for forming a median crack in a brittle substrate is characterized in that high temperature portions that receive intense radiation from a laser beam, and low temperature portions that receive faint radiation from a laser beam are alternately formed along the laser-scribe line to be formed with median cracks.

摘要翻译： 提供了形成中间裂纹的方法和形成中间裂纹的装置，其中可以形成深的直的中间裂纹，并且作为断裂的结果可以获得脆性基底的优异的破裂表面。 在脆性基板中形成中值裂纹的方法中，沿着激光划线对激光束照射脆性基板，在脆性基板上形成中等裂纹，加热至不高于 比其熔融温度高，从而沿着激光划线产生中间裂缝，以形成中间裂纹，并从形成在脆性基板中的切口开始膨胀，并且该方法用于形成中间裂纹 脆性基板的特征在于，接收来自激光束的强烈辐射的高温部分和从激光束接收微弱辐射的低温部分沿着激光划线交替地形成以形成中间裂纹。