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公开(公告)号：US20210060714A1
公开(公告)日：2021-03-04
申请号：US16957827
申请日：2018-12-28
摘要： Provided are a resin composition and a soldering flux. The resin composition includes at least one acid and rosin. The acid is selected from a dimer acid which is a reaction product of oleic acid and linoleic acid, a trimer acid which is a reaction product of oleic acid and linoleic acid, a hydrogenated dimer acid obtained by hydrogenating a dimer acid which is a reaction product of oleic acid and linoleic acid, and a hydrogenated trimer acid obtained by hydrogenating a trimer acid which is a reaction product of oleic acid and linoleic acid. A weight ratio of the at least one acid to the rosin is 0.15 or more and 1.00 or less based on the weight of the rosin. The soldering flux is obtained by diluting the resin composition with a solvent.
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公开(公告)号：US20210060713A1
公开(公告)日：2021-03-04
申请号：US16644362
申请日：2018-09-06
IPC分类号： B23K35/362
摘要： A flux is provided which maintains activity by suppressing formation of an ester due to a reaction between an organic acid and a hydroxy group of an alcohol contained in a solvent and improves solderability.
The flux includes: 40 mass % to 90 mass % of water; 2 mass % to 15 mass % of an organic acid; and greater than 0 mass % and less than or equal to 48 mass % of a solvent having a hydroxy group, in which when a molar mass % of all organic acid carboxyl group unit contained in the organic acid is regarded as 100 unit mol %, the content ratio of all carboxylic acid ester unit esterified by the organic acid and the hydroxy group which is contained in the solvent is 0 unit mol % to 50 unit mol %.-
公开(公告)号：US20200376608A1
公开(公告)日：2020-12-03
申请号：US16642288
申请日：2019-02-22
摘要： The present invention provides a solder alloy, a solder paste, a solder ball, a resin flux-cored solder and a solder joint, both of which has the low-melting point to suppress the occurrence of the fusion failure, improves the ductility and the shear strength, and has excellent heat-cycle resistance. The solder alloy comprises an alloy composition composed of 35 to 68 mass % of Bi, 0.1 to 2.0 mass % of Sb, 0.01 to 0.10 mass % of Ni, and a balance of Sn. The alloy composition may contain at least one of Co, Ti, Al and Mn in total amount of 0.1 mass % or less. The solder alloy may be suitably used for a solder paste, a solder ball, a resin flux-cored solder and a solder joint.
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公开(公告)号：US20200376607A1
公开(公告)日：2020-12-03
申请号：US16766259
申请日：2018-11-21
发明人： Hiroyoshi Kawasaki , Hiroki Sudo , Takahiro Roppongi , Hiroshi Okada , Daisuke Soma , Takashi Akagawa , Hiroshi Takahashi , Hiroshi Kawanago , Satoshi Yokota , Osamu Munekata
摘要： The present invention provides a solder material containing Sn or a Sn-containing alloy and 40 to 320 ppm by mass of A, the solder material including an As-enriched layer.
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公开(公告)号：US20200316725A1
公开(公告)日：2020-10-08
申请号：US16754415
申请日：2018-10-10
IPC分类号： B23K35/362 , B23K35/02
摘要： Provided are a flux having improved wetting and spreading properties and capable of suppressing the occurrence of dewetting and a solder paste using this flux. The flux includes a total amount of 0.5 wt % or more and 20 wt % or less of: any of a dimer acid which is a reaction product of oleic acid and linoleic acid, a trimer acid which is a reaction product of oleic acid and linoleic acid, a hydrogenated dimer acid obtained by adding hydrogen to a dimer acid which is a reaction product of oleic acid and linoleic acid, or a hydrogenated trimer acid obtained by adding hydrogen to a trimer acid which is a reaction product of oleic acid and linoleic acid; or two or more of a dimer acid which is a reaction product of oleic acid and linoleic acid, a trimer acid which is a reaction product of oleic acid and linoleic acid, a hydrogenated dimer acid obtained by adding hydrogen to a dimer acid which is a reaction product of oleic acid and linoleic acid, and a hydrogenated trimer acid obtained by adding hydrogen to a trimer acid which is a reaction product of oleic acid and linoleic acid. The solder paste includes this flux and a metal powder.
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公开(公告)号：US10792607B2
公开(公告)日：2020-10-06
申请号：US16807390
申请日：2020-03-03
发明人： Tsutomu Hiyama
摘要： To provide a flux recovery device which can remove a flux in a pipe and a method for removing a flux. A flux recovery device 200 according to the present invention recovers a flux from a gaseous mixture containing a flux component, the flux recovery device 200 including: a separation unit 400 configured to separate the flux from the gaseous mixture using water, and to discharge the water containing the flux; a pipe 500 including a second connection port 540, an inclined portion 580, and a first connection port 520, the water containing the flux flowing into the pipe 500 from the second connection port 540, the inclined portion 580 being positioned on a downstream side of the second connection port 540, and extending in a direction intersecting with a vertical line extending in a gravity direction, and the first connection port 520 being positioned on an upstream side of the inclined portion 580; and a pump 220 configured to supply water from the first connection port 520.
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公开(公告)号：US10780530B2
公开(公告)日：2020-09-22
申请号：US16419294
申请日：2019-05-22
发明人： Hiroki Oshima , Takeo Saitoh , Takahiro Nishizaki , Tomohisa Kawanago , Masato Shiratori , Kaichi Tsuruta
IPC分类号： B23K35/00 , B23K35/26 , B23K35/30 , H05K3/34 , B23K101/42
摘要： A solder ball according to the present invention contains 0.2 to 2.2% by mass of Zn, and a balance of Sn, and has a spherical diameter of 0.1 to 120 μm and a yellowness (b*) in an L*a*b* color system of 2.70 or more and 9.52 or less. An oxide film is formed by performing aging treatment. By producing a solder ball having a yellowness of 2.70 or more and 9.52 or less, it is possible to suppress the growth of a Cu3Sn layer and/or a Cu—Zn(—Sn) layer during joining.
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公开(公告)号：US20200282355A1
公开(公告)日：2020-09-10
申请号：US16807390
申请日：2020-03-03
发明人： Tsutomu HIYAMA
摘要： To provide a flux recovery device which can remove a flux in a pipe and a method for removing a flux. A flux recovery device 200 according to the present invention recovers a flux from a gaseous mixture containing a flux component, the flux recovery device 200 including: a separation unit 400 configured to separate the flux from the gaseous mixture using water, and to discharge the water containing the flux; a pipe 500 including a second connection port 540, an inclined portion 580, and a first connection port 520, the water containing the flux flowing into the pipe 500 from the second connection port 540, the inclined portion 580 being positioned on a downstream side of the second connection port 540, and extending in a direction intersecting with a vertical line extending in a gravity direction, and the first connection port 520 being positioned on an upstream side of the inclined portion 580; and a pump 220 configured to supply water from the first connection port 520.
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49.发明授权公开(公告)号：US10717157B2
公开(公告)日：2020-07-21
申请号：US15523714
申请日：2014-11-05
发明人： Takahiro Hattori , Hiroyoshi Kawasaki , Hiroshi Okada , Takahiro Roppongi , Daisuke Soma , Isamu Sato
IPC分类号： B23K35/00 , B23K35/26 , C22C13/00 , B23K35/02 , B23K35/30 , C25D17/16 , C25D7/06 , C25D5/12 , B22F1/02 , B22F9/08 , C25D7/00 , C22F1/08 , C25D3/60
摘要： Provided is a solder material having oxidation resistance at the time of melting solder or after melting it, as well as managing a thickness of oxide film at a fixed value or less before melting the solder. A Cu core ball 1A is provided with a Cu ball 2A for keeping a space between a semiconductor package and a printed circuit board and a solder layer 3A that covers the Cu ball 2A. The solder layer 3A is composed of Sn or a solder alloy whose main component is Sn. For the Cu core ball 1A, lightness is equal to or more than 65 in the L*a*b* color space and yellowness is equal to or less than 7.0 in the L*a*b* color space, and more preferably, the lightness is equal to or more than 70 and the yellowness thereof is equal to or less than 5.1.
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公开(公告)号：US10688603B2
公开(公告)日：2020-06-23
申请号：US16304099
申请日：2017-12-27
IPC分类号： B23K35/36 , B23K35/362 , B23K35/02 , B23K35/26 , B23K35/365 , B23K35/368 , B23K35/40
摘要： A flux for a resin flux cored solder or a flux coated solder, in which scattering of flux and solder in using the solder is suppressed, and a resin flux cored solder or a flux coated solder including such a flux are provided. The flux for a resin flux cored solder can include a rosin resin, an activator, and at least one selected from an acrylic polymer and a vinyl ether polymer, which has a weight average molecular weight of 8000 to 100000, in an amount of 0.1 to 3 mass-% based on the total mass of the flux.
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