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公开(公告)号：US10717157B2
公开(公告)日：2020-07-21
申请号：US15523714
申请日：2014-11-05
发明人： Takahiro Hattori , Hiroyoshi Kawasaki , Hiroshi Okada , Takahiro Roppongi , Daisuke Soma , Isamu Sato
IPC分类号： B23K35/00 , B23K35/26 , C22C13/00 , B23K35/02 , B23K35/30 , C25D17/16 , C25D7/06 , C25D5/12 , B22F1/02 , B22F9/08 , C25D7/00 , C22F1/08 , C25D3/60
摘要： Provided is a solder material having oxidation resistance at the time of melting solder or after melting it, as well as managing a thickness of oxide film at a fixed value or less before melting the solder. A Cu core ball 1A is provided with a Cu ball 2A for keeping a space between a semiconductor package and a printed circuit board and a solder layer 3A that covers the Cu ball 2A. The solder layer 3A is composed of Sn or a solder alloy whose main component is Sn. For the Cu core ball 1A, lightness is equal to or more than 65 in the L*a*b* color space and yellowness is equal to or less than 7.0 in the L*a*b* color space, and more preferably, the lightness is equal to or more than 70 and the yellowness thereof is equal to or less than 5.1.
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2.发明申请公开(公告)号：US20180015572A1
公开(公告)日：2018-01-18
申请号：US15539323
申请日：2015-12-24
发明人： Hiroyoshi Kawasaki , Shigeki Kondo , Atsushi Ikeda , Takahiro Roppongi , Takashi Hagiwara , Daisuke Soma , Kaichi Tsuruta , Isamu Sato , Yuji Kawamata
摘要： Provided herein is a solder material that includes a spherical core that provides space between a joint object and another object to be joined to the joint object and a solder coated layer that has a melting point at which a core layer of the core is not melted. The solder coated layer includes Sn as a main ingredient and 0 to 2 mass % of Ag, and coats the core. The solder coated layer has an average grain diameter of crystal grains of 3 μm or less, and the solder material has a spherical diameter of 1 to 230 μm and a sphericity of 0.95 or more.
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公开(公告)号：US09802251B2
公开(公告)日：2017-10-31
申请号：US15116280
申请日：2014-02-04
发明人： Hiroyoshi Kawasaki , Takashi Akagawa , Yuichi Koikeda , Atsushi Ikeda , Masaru Sasaki , Takahiro Roppongi , Daisuke Soma , Isamu Sato
IPC分类号： B22F1/00 , B22F1/02 , B23K35/22 , C25D7/00 , C22C19/03 , C22F1/00 , C22F1/10 , B23K35/30 , B23K35/02
CPC分类号： B22F1/02 , B22F1/0048 , B22F1/0074 , B22F2301/15 , B22F2302/45 , B23K35/025 , B23K35/22 , B23K35/262 , B23K35/3033 , B23K35/3612 , B23K35/3616 , B23K35/362 , C22C1/0425 , C22C19/03 , C22F1/00 , C22F1/10 , C25D7/00
摘要： Provided are a Ni ball, a Ni core ball, a solder joint, solder paste and foamed solder which are superior in the impact resistance to dropping and can inhibit any occurrence of a poor joints. An electronic component 60 is constructed by joining a solder bump 30 of a semiconductor chip 10 to an electrode 41 of a printed circuit board 40 with solder paste 12, 42. The solder bump 30 is formed by joining an electrode 11 of the semiconductor chip 10 to the Ni ball 20. The Ni ball 20 according to the present invention contains purity which is equal to or higher than 99.9% and equal to or lower than 99.995%, sphericity which is equal to or higher than 0.90, and Vickers hardness which is equal to or higher than 20HV and equal to or less than 90HV.
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公开(公告)号：US20170246711A1
公开(公告)日：2017-08-31
申请号：US15116271
申请日：2014-02-04
CPC分类号： B23K35/0244 , B22F1/0048 , B22F1/02 , B22F1/025 , B23K35/025 , B23K35/22 , B23K35/302 , C22C1/0425 , C22C9/00 , C22C9/02 , C22F1/00 , C22F1/08 , C25D7/00
摘要： Provided are a Cu ball, a Cu core ball, a solder joint, solder paste and foamed solder, which are superior in the impact resistance to dropping and can inhibit any occurrence of poor joints a junction defect. An electronic component 60 is constructed by joining a solder bump 30 of a semiconductor chip 10 to an electrode 41 of a printed circuit board 40 with solder paste 12, 42. The solder bump 30 is formed by joining an electrode 11 of the semiconductor chip 10 to the Cu ball 20. The Cu ball 20 according to the present invention contains purity which is equal to or higher than 99.9% and equal to or lower than 99.995%, sphericity which is equal to or higher than 0.95, and Vickers hardness which is equal to or higher than 20 HV and equal to or less than 60 HV.
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公开(公告)号：US09511438B2
公开(公告)日：2016-12-06
申请号：US14352507
申请日：2012-10-18
发明人： Issaku Sato , Akira Takaguchi , Isamu Sato , Takashi Nauchi
CPC分类号： B23K1/20 , B22D17/2023 , B23K3/0623 , B23K3/0638 , B23K3/085 , H01L24/11 , H01L24/741 , H01L2224/11312 , H01L2224/1132 , H01L2224/11848 , H01L2224/742 , H05K3/3468 , H01L2924/00012
摘要： Provided is a solder bump forming method that enables micro-solder bumps to be formed without the possibility of occurrence of a bridge due to excess molten solder. An injection head 11 for supplying molten solder has a nozzle 16 brought into contact with a mask with openings that is disposed over a substrate 8. After completing a supply operation, the injection head 11 is forcedly cooled by heat transfer from a cooling unit 13 through a heater unit 12 whose operation has been stopped. Molten solder 15 in the cooled injection head 11 does not drool from the nozzle 16 when the injection head 11 moves up.
摘要翻译： 提供了一种焊料凸块形成方法，其能够形成微焊料凸块，而不会由于过量熔融焊料而发生桥接。 用于供应熔融焊料的注射头11具有与设置在基板8上的开口的掩模接触的喷嘴16.在完成供给操作之后，通过从冷却单元13的热传递强制冷却喷射头11， 其操作已经停止的加热器单元12。 当注射头11向上移动时，冷却的注射头11中的熔融焊料15不会从喷嘴16流出。
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公开(公告)号：US20160148885A1
公开(公告)日：2016-05-26
申请号：US14899378
申请日：2013-06-19
发明人： Hiroyoshi Kawasaki , Tomohiko Hashimoto , Atsushi Ikeda , Takahiro Roppongi , Daisuke Soma , Isamu Sato , Yuji Kawamata
IPC分类号： H01L23/00 , C22C13/00 , C22C9/00 , H05K3/34 , B23K35/02 , B23K35/30 , B23K35/26 , H01L23/498 , C22C43/00
CPC分类号： H01L24/13 , B22F1/025 , B23K35/0244 , B23K35/26 , B23K35/262 , B23K35/30 , B23K35/302 , C22C9/00 , C22C13/00 , C22C43/00 , C23C28/021 , H01L23/49816 , H01L23/556 , H01L24/11 , H01L24/14 , H01L2224/111 , H01L2224/1112 , H01L2224/13014 , H01L2224/13016 , H01L2224/13111 , H01L2224/13147 , H01L2224/13347 , H01L2224/13411 , H01L2224/13611 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/16227 , H01L2924/1434 , H01L2924/3841 , H05K3/3457 , H05K2203/041 , H01L2924/01082 , H01L2924/01083 , H01L2924/01047 , H01L2924/01029 , H01L2924/01049 , H01L2924/00012 , H01L2924/00014 , H01L2924/01028 , H01L2924/01027 , H01L2924/01051 , H01L2924/01032 , H01L2924/01015 , H01L2924/01026 , H01L2924/01079 , H01L2924/01092 , H01L2924/0109 , H01L2924/01033 , H01L2924/0105 , H01L2924/01048 , H01L2924/01016 , H01L2924/01203 , H01L2924/01204 , H01L2924/0103
摘要： A Cu core ball is provided that prevents any soft errors and decreases any connection failure. The Cu core ball includes a solder plating film formed on the surface of a Cu ball that is a Sn solder plating film or is made of a lead-free solder alloy, a principal ingredient of which is Sn. The solder plating film contains U of 5 ppb or less and Th of 5 ppb or less. The Cu ball has a purity of not less than 99.9% Cu and not more than 99.995% Cu. Pb and/or Bi contents therein are at a total of 1 ppm or more. The sphericity thereof is 0.95 or more. The obtained Cu core ball has an α dose of 0.0200 cph/cm2 or less.
摘要翻译： 提供铜芯球，防止任何软错误并减少任何连接故障。 铜芯球包括在作为Sn焊料镀覆膜的Cu球的表面上形成的焊锡镀膜，或者由主要成分为Sn的无铅焊料合金制成。 焊锡镀膜含有5ppb以下的U，5ppb以下的U。 Cu球的纯度为99.9％以上，Cu不大于99.995％。 其中Pb和/或Bi含量总共为1ppm以上。 其球形度为0.95以上。 得到的Cu芯球的α剂量为0.0200cph / cm 2以下。
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7.发明授权Core ball, solder paste, formed-solder, flux-coated core ball and solder joint 有权芯球，焊膏，成形焊料，助焊剂芯球和焊点公开(公告)号：US09278409B2
公开(公告)日：2016-03-08
申请号：US14613175
申请日：2015-02-03
发明人： Hiroyoshi Kawasaki , Shigeki Kondo , Atsushi Ikeda , Takahiro Roppongi , Daisuke Soma , Isamu Sato
IPC分类号： H01B5/00 , B32B15/04 , B23K35/02 , B23K35/26 , B23K35/30 , C22C9/00 , C22C13/00 , C22C13/02 , H01B1/02 , H01L23/00
CPC分类号： B23K35/025 , B23K35/0244 , B23K35/262 , B23K35/302 , C22C9/00 , C22C12/00 , C22C13/00 , C22C13/02 , C22F1/08 , H01B1/02 , H01L24/13 , H01L2224/13014 , H01L2224/13147 , H01L2224/13561 , H01L2224/13611 , H01L2224/13655 , H01L2224/13657 , H01L2924/01015 , H01L2924/01026 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01082 , H01L2924/01083 , H01L2924/0109 , H01L2924/01092 , H01L2924/014 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/01028 , H01L2924/00011
摘要： A core ball wherein a junction melting temperature and a low alpha dose are set for suppressing a soft error generation and solving a mounting problem. A metallic powder as a core is a sphere. A pure degree of a Cu ball of the metallic powder is equal to or higher than 99.9% but equal to or less than 99.995%. A contained amount of one of Pb and Bi or a total contained amount of Pb and Bi is equal to or higher than 1 ppm. A sphericity of the Cu ball is at least 0.95. A solder plating film for coating the Cu ball comprises Sn—Bi based alloy. U contained in the solder plating film is equal to or less than 5 ppb and Th is equal to or less than 5 ppb. An alpha dose of the core ball is equal to or less than 0.0200 cph/cm2.
摘要翻译： 设置结熔融温度和低α剂量的芯球，以抑制软错误产生并解决安装问题。 作为核心的金属粉末是球体。 金属粉末的Cu球的纯度等于或高于99.9％但等于或小于99.995％。 Pb和Bi中的一种或Pb和Bi的总含量的含量等于或高于1ppm。 Cu球的球形度至少为0.95。 用于涂覆Cu球的焊料镀覆膜包括Sn-Bi基合金。 包含在焊料镀膜中的U等于或小于5ppb，Th等于或小于5ppb。 芯球的α剂量等于或小于0.0200cph / cm 2。
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公开(公告)号：US10811376B2
公开(公告)日：2020-10-20
申请号：US15509333
申请日：2014-09-09
IPC分类号： B23K35/00 , H01L23/00 , H01L23/522 , B22F1/00 , H01L23/50 , B23K35/26 , C22C13/00 , C25D5/12 , C22C9/00 , C25D7/00 , C25D5/10 , B23K35/30 , B23K35/02 , B23K35/36 , B32B15/01 , B32B15/20 , H01L23/48 , H05K3/40 , H01B1/02 , H01L21/288 , H01L21/768
摘要： Provided are a Cu column, a Cu core column, a solder joint, and a through-silicon via, which have the low Vickers hardness and the small arithmetic mean roughness. For the Cu column 1 according to the present invention, its purity is equal to or higher than 99.9% and equal to or lower than 99.995%, its arithmetic mean roughness is equal to or less than 0.3 μm, and its Vickers hardness is equal to or higher than 20 HV and equal to or less than 60 HV. Since the Cu column 1 is not melted at a melting temperature in the soldering and a definite stand-off height (a space between the substrates) can be maintained, it is preferably applied to the three dimensional mounting or the pitch narrowing mounting.
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公开(公告)号：US10147695B2
公开(公告)日：2018-12-04
申请号：US14899378
申请日：2013-06-19
发明人： Hiroyoshi Kawasaki , Tomohiko Hashimoto , Atsushi Ikeda , Takahiro Roppongi , Daisuke Soma , Isamu Sato , Yuji Kawamata
IPC分类号： H01L23/00 , B23K35/26 , C22C13/00 , H01L23/556 , B22F1/02 , H01L23/498 , B23K35/02 , B23K35/30 , C22C9/00 , C22C43/00 , C23C28/02 , H05K3/34
摘要： A Cu core ball is provided that prevents any soft errors and decreases any connection failure. The Cu core ball includes a solder plating film formed on the surface of a Cu ball that is a Sn solder plating film or is made of a lead-free solder alloy, a principal ingredient of which is Sn. The solder plating film contains U of 5 ppb or less and Th of 5 ppb or less. The Cu ball has a purity of not less than 99.9% Cu and not more than 99.995% Cu. Pb and/or Bi contents therein are at a total of 1 ppm or more. The sphericity thereof is 0.95 or more. The obtained Cu core ball has an α dose of 0.0200 cph/cm2 or less.
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公开(公告)号：US20170252871A1
公开(公告)日：2017-09-07
申请号：US15327510
申请日：2014-08-29
CPC分类号： B23K35/0244 , B22F1/02 , B22F2999/00 , B23K35/26 , B23K35/262 , B23K35/365 , C22C13/00 , C23C8/10 , C23C8/36 , C23C28/04 , H01L24/11 , H01L24/13 , H01L2224/11318 , H01L2224/1182 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/1312 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/1316 , H01L2224/13561 , H01L2224/13687 , H01L2924/0105 , H01L2924/014 , H01L2924/0544 , C22C1/0483
摘要： Provided is a solder material which enables a growth of an oxide film to be inhibited. A solder ball which is a solder material is composed of a solder layer and a covering layer covering the solder layer. The solder layer is spherical and is composed of a metal material containing an alloy including Sn content of 40% and more. Otherwise the solder layer is composed of a metal material including Sn content of 100%. In the covering layer, a SnO film is formed outside the solder layer, and a SnO2 film is formed outside the SnO film. A thickness of the covering layer is preferably more than 0 nm and equal to or less than 4.5 nm. Additionally, a yellow chromaticity of the solder ball is preferably equal to or less than 5.7.
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