-
公开(公告)号：US11359302B2
公开(公告)日：2022-06-14
申请号：US17126275
申请日：2020-12-18
申请人： ASM IP Holding B.V.
发明人： Ippei Yanagisawa
摘要： Examples of a susceptor for supporting a substrate includes a base metal formed of aluminum or a material containing aluminum, an anodized layer covering a surface of the base metal and having cracks therein, and a CF coating of polymer provided in the cracks such that the exposure of the base metal is avoided.
-
公开(公告)号：US10851464B1
公开(公告)日：2020-12-01
申请号：US15560270
申请日：2016-05-10
发明人： Yuichi Kobayashi , Kiyokazu Nakane
摘要： According to the method for producing chromium plated parts, a plurality of workpieces are immersed in a chromium plating bath, a plating treatment is performed by using a pulse current, and chromium plating layers that have compressive residual stress and suppressed cracking are deposited on surfaces of the plurality of workpieces. A direct current from plating separation lower limit current density up to a range in which the chromium plating layers have compressive residual stress is superimposed during downtime of application of the pulse current.
-
公开(公告)号：US20190127873A1
公开(公告)日：2019-05-02
申请号：US16228527
申请日：2018-12-20
CPC分类号： C25D17/16 , C25D3/38 , C25D7/123 , C25D17/001 , C25D21/12 , H01L21/67011 , H01L22/12
摘要： Disclosed herein are methods for electroplating which employ seed layer detection. Such methods may operate by selecting a wafer, illuminating one or more points within an interior region of the wafer surface, measuring a first set of one or more in-process color signals from the one or more points within the interior region, illuminating one or more points within an edge region of the wafer surface, measuring a second set of one or more in-process color signals from the one or more points within the edge region, each color signal having one or more color components, calculating a metric indicative of a difference between the color signals in the first and second sets of in-process color signals, determining whether an acceptable seed layer is present on the wafer based on whether the metric is within a predetermined range, and repeating the foregoing for one or more additional wafers.
-
公开(公告)号：US09822460B2
公开(公告)日：2017-11-21
申请号：US14160471
申请日：2014-01-21
CPC分类号： C25D17/16 , C25D3/38 , C25D7/123 , C25D17/001 , C25D21/12 , H01L21/67011 , H01L22/12
摘要： Disclosed herein are methods and apparatuses for electroplating which employ seed layer detection. Such methods and related apparatuses may operate by selecting a wafer for processing, measuring from its surface one or more in-process color signals having one or more color components, calculating one or more metrics, each metric indicative of the difference between one of the in-process color signals and a corresponding set of reference color signals, determining whether an acceptable seed layer is present on the wafer surface based on whether a predetermined number of the one or more metrics are within an associated predetermined range which individually corresponds to that metric, and either electroplating the wafer when an acceptable seed layer is present or otherwise designating the wafer unacceptable for electroplating. The foregoing may then be repeated for one or more additional wafers to electroplate multiple wafers from a set of wafers.
-
公开(公告)号：US09175398B2
公开(公告)日：2015-11-03
申请号：US14310246
申请日：2014-06-20
IPC分类号： C23C18/16 , G07D7/12 , C25D5/02 , C25D3/12 , C25D3/22 , C25D3/38 , C25D5/10 , C25D15/00 , C25D17/16 , G07D5/00 , C23C18/31 , G07F7/08
CPC分类号： C25D7/00 , B32B15/01 , C23C18/1637 , C23C18/1646 , C23C18/1653 , C23C18/1662 , C23C18/31 , C23C18/36 , C25D3/12 , C25D3/22 , C25D3/38 , C25D3/58 , C25D5/02 , C25D5/10 , C25D7/005 , C25D15/00 , C25D17/16 , G07D5/00 , G07D7/12 , G07F7/0813 , Y10T428/12493
摘要： Formation of an authentication element by deposition of a metal layer with embedded particles on a metal substrate, wherein the embedded particles are configured to convert energy from one wavelength to another. The embedded particles may be upconverters, downconverters, or phosphorescent phosphors, which can be detected and measured with analytical equipment when deposited in the metal layer. A metal substrate may include coinage.
摘要翻译： 通过在金属基底上沉积具有嵌入的颗粒的金属层来形成认证元件，其中嵌入的颗粒被配置成将能量从一个波长转换成另一个波长。 嵌入的颗粒可以是上变频器，下变频器或磷光荧光体，其可以在沉积在金属层中时用分析设备检测和测量。 金属基底可以包括造币。
-
公开(公告)号：US20150308010A1
公开(公告)日：2015-10-29
申请号：US14691465
申请日：2015-04-20
申请人： EBARA CORPORATION
发明人： Ryuya KOIZUMI
CPC分类号： C25D17/06 , C25D17/00 , C25D17/001
摘要： A substrate processing method which can improve a throughput by simultaneously processing various types of substrates is disclosed. The substrate processing method includes: dividing substrate holders into a first group and a second group; assigning each one of the substrate holders to either a first recipe or a second recipe; calculating a total transporting time in each of all possible transporting orders of transporting substrates and the substrate holders for performing a first process according to the first recipe and a second process according to the second recipe; determining a transporting order that provides a shortest total transporting time; and performing the first process on one or a plurality of substrates using substrate holders belonging to the first group and performing the second process on one or a plurality of substrates using substrate holders belonging to the second group while transporting the substrates according to the determined transporting order.
摘要翻译： 公开了一种通过同时处理各种基板来提高生产率的基板处理方法。 基板处理方法包括：将基板保持器分成第一组和第二组; 将每个基板保持器分配到第一配方或第二配方; 根据第一配方计算运输基板和用于执行第一处理的基板保持器的所有可能运输顺序中的总运输时间和根据第二配方的第二处理; 确定提供最短总运输时间的运输订单; 以及使用属于第一组的衬底保持器在一个或多个衬底上执行第一处理，并且使用属于第二组的衬底保持器在一个或多个衬底上执行第二过程，同时根据确定的传送顺序传送衬底 。
-
公开(公告)号：US20150206770A1
公开(公告)日：2015-07-23
申请号：US14160471
申请日：2014-01-21
CPC分类号： C25D17/16 , C25D3/38 , C25D7/123 , C25D17/001 , C25D21/12 , H01L21/67011 , H01L22/12
摘要： Disclosed herein are methods and apparatuses for electroplating which employ seed layer detection. Such methods and related apparatuses may operate by selecting a wafer for processing, measuring from its surface one or more in-process color signals having one or more color components, calculating one or more metrics, each metric indicative of the difference between one of the in-process color signals and a corresponding set of reference color signals, determining whether an acceptable seed layer is present on the wafer surface based on whether a predetermined number of the one or more metrics are within an associated predetermined range which individually corresponds to that metric, and either electroplating the wafer when an acceptable seed layer is present or otherwise designating the wafer unacceptable for electroplating. The foregoing may then be repeated for one or more additional wafers to electroplate multiple wafers from a set of wafers.
摘要翻译： 本文公开了采用种子层检测的电镀方法和装置。 这样的方法和相关设备可以通过选择用于处理的晶片来操作，从表面测量具有一个或多个颜色分量的一个或多个处理中颜色信号，计算一个或多个度量，每个度量指示其中的一个 - 处理的颜色信号和相应的一组参考颜色信号，基于所述一个或多个度量的预定数量是否在与所述度量单独对应的相关联的预定范围内，确定晶片表面上是否存在可接受的种子层， 并且当存在可接受的种子层时电镀晶片或以其他方式指定不能用于电镀的晶片。 然后可以对一个或多个另外的晶片重复上述内容以从一组晶片电镀多个晶片。
-
8.发明授权Method of determining operating condition for rotary surface treating apparatus 有权确定旋转表面处理装置的操作条件的方法公开(公告)号：US08702953B2
公开(公告)日：2014-04-22
申请号：US12516269
申请日：2006-12-28
申请人： Yutaka Sugiura , Masanobu Morita
发明人： Yutaka Sugiura , Masanobu Morita
CPC分类号： C25D21/12 , C25D17/00 , C25D17/02 , G05B19/042 , G05B2219/23399 , G05B2219/23448 , G05B2219/25064
摘要： It is an object of the present invention to derive the optimum operating condition parameters for plating operation accurately and efficiently. At first, a preliminary test operation is carried out under the energized condition (S12), then in light of such result, a sequential operations such as a first test operation (step S14) in which no energization is carried out for plurality of operating pattern candidates and a second test operation (step S16) under the energized condition are carried out, and then the optimum operating conditions are registered (step S18).
摘要翻译： 本发明的一个目的是准确有效地导出用于电镀操作的最佳操作条件参数。 首先，在通电状态下进行预备试验（S12），根据这样的结果，进行对多个工作模式不进行通电的第一试验操作（步骤S14） 执行候选和第二测试操作（步骤S16），然后记录最佳操作条件（步骤S18）。
-
公开(公告)号：US20130280553A1
公开(公告)日：2013-10-24
申请号：US13466409
申请日：2012-05-08
申请人： CHENG-YUNG LEE , SHUN-FA KANG
发明人： CHENG-YUNG LEE , SHUN-FA KANG
CPC分类号： C25D17/20 , C25D5/022 , Y10T428/12493 , Y10T428/12778
摘要： A workpiece has a glossy coating layer disposed thereon. A barrel plating device is electrified with an alternating current, which has a voltage between 1V and 100V, a current density between 0.02 A/dm2 and 50 A/dm2, and a frequency between 1 Hz to 60 KHz. The alternating current is rectified by a low ripple DC rectifier into a direct current whose ripple coefficient is between 0.3% and 26%. Thereby, a surface of the workpiece is electroplated with the glossy coating layer, which contributes to a glossy and even effect on the surface of the workpiece.
摘要翻译： 工件具有设置在其上的光泽涂层。 桶式电镀装置通电，电压为1V至100V，电流密度为0.02A / dm2至50A / dm2，频率为1 Hz至60 KHz。 交流电流由低纹波直流整流器整流为纹波系数在0.3％至26％之间的直流电流。 因此，工件的表面用光泽涂层电镀，这有助于对工件表面的光泽和均匀的影响。
-
公开(公告)号：US07811440B2
公开(公告)日：2010-10-12
申请号：US11494672
申请日：2006-07-28
申请人： Kou Onodera , Hiroshi Shindo , Takashi Sakurai
发明人： Kou Onodera , Hiroshi Shindo , Takashi Sakurai
IPC分类号： C25D17/16
CPC分类号： C25D17/16 , C25D5/08 , C25D17/002 , C25D21/10
摘要： A plating apparatus performs a plating process while placing a work in a pod disposed in a plating bath storing a plating solution. The pod has a pair of meshes that allow the plating solution to pass but substantially inhibit the work from passing. The plating apparatus is provided with a solution flowing mechanism for flowing the plating solution out of the pod through one of the pair of meshes.
摘要翻译： 电镀装置在将工件放置在容纳电镀溶液的电镀槽中的容器中进行电镀处理。 荚具有一对允许电镀溶液通过但大大抑制工作通过的网状物。 电镀装置设置有溶液流动机构，用于使电镀液通过一对网格之一流出荚果。
-
-
-
-
-
-
-
-
-
搜索结果
133 条记录 (耗时 0.025 秒)