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41.
公开(公告)号:US12247142B2
公开(公告)日:2025-03-11
申请号:US17626238
申请日:2020-07-10
Applicant: Bostik, Inc. , Bostik, SA
Inventor: Kimberly E. Secrist , Steven D. Gray , Naji Hussein
IPC: B32B41/00 , A61F13/539 , C09J5/06 , C09J123/12
Abstract: A hot melt adhesive composition comprises a polypropylene homopolymer having a DSC melting point of less than 100° C.; a butene-based copolymer; and a plasticizer. The butene-based copolymer may comprise a butene-rich amorphous poly-alpha olefin, such as a butene-propylene copolymer, or a semi-crystalline copolymer, such as a butene-ethylene copolymer. The hot melt adhesive is especially useful for bonding substrates which swell or elongate significantly in use. Such uses include adhering superabsorbent polymers to a substrate or adhering together two substrates at least one of which having superabsorbent polymers, such as the top and bottom layer of an absorbent core of a disposable hygiene article, such as a diaper, feminine sanitary napkin, and adult incontinence pad. The hot melt adhesive composition, which does not contain a tackifier, demonstrates suitable elongation at break and stress at yield, with a sufficiently low viscosity, to stabilize an absorbent core having superabsorbent polymers.
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42.
公开(公告)号:US20240148568A1
公开(公告)日:2024-05-09
申请号:US17773084
申请日:2020-10-28
Applicant: Bostik, Inc.
Inventor: Kimberly E. Secrist , Neil G. Janetski , Steven D. Gray
IPC: A61F13/534 , C09J123/14 , C09J123/22 , A61F13/15
CPC classification number: A61F13/534 , C09J123/14 , C09J123/22 , A61F2013/1591 , A61F2013/53445
Abstract: A tackifier-free, hot melt adhesive composition comprises an amorphous, single site-catalyzed, high molecular weight propylene copolymer, preferably with a weight average molecular weight (Mw) greater than 80,000 g/mol; a semicrystalline, single site-catalyzed, low molecular weight propylene copolymer, preferably with an Mw less than 60,000 g/mol; and polyisobutene. The composition may optionally include a plasticizer, a butene-rich copolymer, and an antioxidant. The hot melt adhesive is especially useful for bonding substrates which swell or elongate significantly in use. Such uses include adhering superabsorbent polymers to a substrate or adhering together two substrates, at least one of which has superabsorbent polymers, such as the layers of an absorbent core of a disposable hygiene article, such as a diaper. The composition, which does not contain a tackifier, demonstrates suitable elongation at break, stress retention, and thermal stability, making it well-suited for stabilizing expanded species such as superabsorbent polymers.
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公开(公告)号:US11945977B2
公开(公告)日:2024-04-02
申请号:US16486880
申请日:2018-02-20
Applicant: BOSTIK, INC.
Inventor: Steven D. Gray , Darius K. Deak , Brian R. Minix , Edward P. Tomlinson
IPC: C09J153/02 , C08K3/34 , C08K3/36 , C08K5/00 , C08L25/06 , C09J11/06 , C09J125/06
CPC classification number: C09J153/02 , C08L25/06 , C09J11/06 , C08K3/346 , C08K3/36 , C08K5/0083 , C08L2666/06 , C09J125/06
Abstract: A hot melt adhesive comprises at least one polymer selected from the group consisting of polystyrene, polybutene, polyisobutene, linear low density polyethylene, polypropylene random copolymer, polypropylene, olefin block copolymer, polyolefins, styrene block copolymers, and ethyl vinyl acetate polymers; a tackifying resin; and at least one precisely end-capped polystyrene (PECPS). The use of the styrene-based oligomers and polymers with the precisely controlled end-groups in hot melt adhesive formulations to improve compatibility with polymers and block copolymers frequently used in such adhesives.
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公开(公告)号:US20230313004A1
公开(公告)日:2023-10-05
申请号:US18138249
申请日:2023-04-24
Applicant: Bostik, Inc.
Inventor: Monina D. KANDERSKI , Michael D. VITRANO , David P. KEULER , Deepa PUTHANPARAMBIL , Jacqueline M. LAMBERT , Brian J. MORROW
IPC: C09J167/04 , B65D6/00 , C09J5/06 , C09J141/00
CPC classification number: C09J167/04 , B65D13/04 , C09J5/06 , C09J141/00 , C08K5/0016
Abstract: A hot melt adhesive comprises a polylactide homopolymer or copolymer, such as polylactic acid; sulfonated copolyester; and at least one plasticizer, and is compostable. The plasticizer may be a solid plasticizer, such as a benzoate, and a second plasticizer may also be used. The adhesive is suitable for use in a variety of applications, such as case and carton applications, use with burlap or other compostable substrates for tree bulbs or plant seeds, and use with other compostable films, and is especially appropriate for dual-walled paperboard beverage cups. The adhesive demonstrates good bond performance comparable to non-compostable adhesives over a range of temperatures, reflective of the temperatures of hot and cold beverages.
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公开(公告)号:US20220325145A1
公开(公告)日:2022-10-13
申请号:US17641470
申请日:2020-07-30
Applicant: Bostik, Inc.
Inventor: Brian R. Minix , Steven D. Gray , Miao Hu , Kimberly E. Secrist
IPC: C09J123/12 , C09J7/35 , C09J7/24
Abstract: A hot melt adhesive uses a blend of polymers having controlled stereoerror and comprises a stereoblock polypropylene comprising a first block having an isotactic index of between about 50% and about 95% and a second block having an isotactic index of between about 5% and 50%, wherein the difference between the isotactic indeces of the first block and the second block is at least about 10%. The hot melt adhesive exhibits improved peel and tack properties without compromising shear strength and vice versa.
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公开(公告)号:US20220250372A1
公开(公告)日:2022-08-11
申请号:US17730250
申请日:2022-04-27
Applicant: Bostik, Inc.
Inventor: Kimberly E. Secrist , Ronald F. Graf
Abstract: A method and system of using a polyolefin-based, hot melt adhesive improves creep performance of elastic strands adhered to another substrate. Some deflection, greater than 1°, of the exit angle formed by a line normal to the axis of a neutrally-positioned applicator and the elastic strand extending from the applicator is introduced. Preferably, deflection of the entrance angle is also introduced and a head tilt angle is also provided. The use of deflection improves creep performance or allows for a reduced amount of adhesive to be used to achieve the same or similar creep performance. The elastic strands may be used to form a leg cuff in personal care products, such as diapers, and the substrate to which they are applied could be a polyethylene film or non-woven materials.
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公开(公告)号:US11338565B2
公开(公告)日:2022-05-24
申请号:US15586673
申请日:2017-05-04
Applicant: Bostik, Inc.
Inventor: Kimberly E. Secrist , Ronald F. Graf
Abstract: A method and system of using a polyolefin-based, hot melt adhesive improves creep performance of elastic strands adhered to another substrate. Some deflection, greater than 1°, of the exit angle formed by a line normal to the axis of a neutrally-positioned applicator and the elastic strand extending from the applicator is introduced. Preferably, deflection of the entrance angle is also introduced and a head tilt angle is also provided. The use of deflection improves creep performance or allows for a reduced amount of adhesive to be used to achieve the same or similar creep performance. The elastic strands may be used to form a leg cuff in personal care products, such as diapers, and the substrate to which they are applied could be a polyethylene film or non-woven materials.
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公开(公告)号:US20200079981A1
公开(公告)日:2020-03-12
申请号:US16562748
申请日:2019-09-06
Applicant: BOSTIK, INC.
Inventor: Monina D. Kanderski , Michael D. VITRANO , David P. KEULER , Deepa PUTHANPARAMBIL , Jacqueline M. LAMBERT , Brian J. MORROW
IPC: C09J167/04 , C09J141/00 , B65D6/00 , C09J5/06
Abstract: A hot melt adhesive comprises a polylactide homopolymer or copolymer, such as polylactic acid; sulfonated copolyester; and at least one plasticizer, and is compostable. The plasticizer may be a solid plasticizer, such as a benzoate, and a second plasticizer may also be used. The adhesive is suitable for use in a variety of applications, such as case and carton applications, use with burlap or other compostable substrates for tree bulbs or plant seeds, and use with other compostable films, and is especially appropriate for dual-walled paperboard beverage cups. The adhesive demonstrates good bond performance comparable to non-compostable adhesives over a range of temperatures, reflective of the temperatures of hot and cold beverages.
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公开(公告)号:US10563086B2
公开(公告)日:2020-02-18
申请号:US15469928
申请日:2017-03-27
Applicant: Bostik, Inc.
Inventor: Darius K. Deak , Thomas L. Ruppert , Elaine Lo
IPC: C09D167/02 , B05D3/00 , B05D3/14 , C08J7/04 , C09D167/00
Abstract: A low temperature heat seal coating solution which contains an amorphous or semi-crystalline polyester or co-polyester resin, tackifier, anti-blocking agent, and solvent. The coating solution can be applied to a packaging web such as a foil or film by converters using conventional methods such as gravure, rod, slot die, or printing process. The heal seal coating can be sealed to itself or another substrate to manufacture food packaging bags or pharmaceutical blister packaging. The heat seal temperature can be as low as 70° C. under conventional equipment and conditions in the industry.
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50.
公开(公告)号:US20190233687A1
公开(公告)日:2019-08-01
申请号:US16260577
申请日:2019-01-29
Applicant: Bostik, Inc.
Inventor: Jill Marie Scheu , Kimberly Eileen Secrist , Kathleen M. Farris
IPC: C09J123/16 , C09J5/00 , C09J11/08
CPC classification number: C09J123/16 , B32B27/32 , C08K5/0016 , C08L2205/025 , C09J5/00 , C09J11/08 , C09J123/142 , C09J2205/30 , C09J2400/263 , C09J2423/046 , C08L23/14
Abstract: A hot melt adhesive composition, which may be used as a construction adhesive in hygiene articles, comprises a first polymer comprising a unimodal copolymer of propylene and ethylene and having a weight average molecular weight of between about 5,000 and 60,000 daltons; a second polymer comprising a copolymer of propylene and ethylene and having a weight average molecular weight of at least 100,000 daltons; a tackifying resin having a Ring & Ball softening point of at most 115° C.; and a plasticizer. The composition demonstrates good peel strength and good shear resistance and is sprayable, with a sufficiently low viscosity, at low application temperatures, such as at about 121° C.
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