Abstract:
A touch module disposed on a display panel of a touch display is provided. The touch module includes a glass substrate, a polymer layer, a lateral-side light sensor and a vertical-side light sensor. The polymer layer is transparent and flexible. The lateral-side and the vertical-side light sensors are sandwiched between the glass substrate and the polymer layer, and disposed on a lateral edge and a vertical edge of the substrate. A transparent transmission layer is formed between the glass substrate and the polymer layer. When a touch event is triggered on the polymer layer, the backlight corresponding to the touch point is transformed into a side-oriented backlight, which is transmitted in the transparent transmission layer and captured by the lateral-side and the vertical-side light sensor.
Abstract:
A handheld electronic device and an operating method thereof are provided. The handheld electronic device includes a first body, a second body, and a moving assembly. The moving assembly includes a sliding module and at least one rotating module. The sliding module is coupled to the second body, wherein the second body is moveable between a first position and a second position. The rotating module is coupled between the first body and the sliding module so that the second body is rotated relative to the first body. The second body is automatically rotated from the second position to a third position to form a first angle with the first body. The second body can be rotated between the third position and a fourth position to form a second angle with the first body, wherein the second angle is greater than the first angle.
Abstract:
A semiconductor material structure includes at least one region capable of generating electrons and holes each having an associated mean kinetic energy during operation. A material layer in proximity to the region provides an associated potential energy larger than the mean kinetic energy associated with the generated electrons and the mean kinetic energy associated with the holes.
Abstract:
An optical touch module includes a display panel, an optical sensor and a light emitting unit. The optical sensor is disposed on a corner of the display panel. The light emitting unit is disposed on the optical sensor and includes a light emitting member and a compensating member. The light emitting member emits light with a first light strength along a first direction and light with a second light strength along a second direction, wherein the first light strength is greater than the second light strength. The compensating member is disposed on a side of the light emitting member. After the lights pass through the compensating member, the second light strength is increased.
Abstract:
A receiving system for audio processing includes a first demodulation unit and a second demodulation unit. The first demodulation unit is utilized for receiving an audio signal and generating a first demodulated audio signal. The second demodulation unit is utilized for selectively receiving the audio signal or the first demodulated audio signal according to a setting of a television audio system which the receiving system is applied, and generating a second demodulated audio signal.
Abstract:
A manufacturing process for a printed fabric includes the following steps. A substrate layer and a fabric are provided and the fabric is pasted onto the substrate layer. The substrate layer and the fabric are sent to the printer to perform a UV printing. Thereby, the UV ink printed on the fabric can be suddenly dried to prevent the UV ink from expanding. Therefore, the figures on the printed fabric can be more dedicate, beautiful and clear. The printed fabric can be mass produced by machine to reduce the cost and the manufacturing time. A printed fabric is also provided.
Abstract:
A semiconductor material structure includes at least one region capable of generating electrons and holes each having an associated mean kinetic energy during operation. A material layer in proximity to the region provides an associated potential energy larger than the mean kinetic energy associated with the generated electrons and the mean kinetic energy associated with the holes.
Abstract:
The present invention provides a light source module with high efficiency, super bright LEDs featured with efficient heat dissipation. This invention comprises a printed circuit board installed with an LED array which is composed of multiple emitter LEDs. To achieve efficient effect for heat dissipation, there is more than one hole punctured on the printed circuit board right underneath each emitter LED. The surface of each punctured hole is coated with thermal conductive layer such that the accumulative heat generated by the high power LEDs can be effectively dissipated through the conductive layer.
Abstract:
The present invention provides an LED light source module design featured with efficient heat dissipation. This invention comprises a printed circuit board of thickness less than 400 μm, installed with an LED array which is composed of multiple high powers, super bright emitter LEDs. The thinner version of the printed circuit provides shorter route for faster thermal conductivity; and thus promotes the efficiency for heat dissipation. With its bendable flexibility, the thinner version of the printed circuit board can accommodate and well affix to the inner side of any shape of lighting fixture rack. This further enhances the heat dissipation for varieties of lighting fixture rack design.
Abstract:
The present invention discloses a heat spreader and method for making the heat spreader. The heat spreader comprises: a hollow metallic housing including an upper cover having an inner surface and a lower cover having an inner surface, the upper and lower covers being bonded together along their perimeters defining a cavity; a capillary structure in a form of metallic meshes bonded to the inner surfaces of the upper and lower covers of the metallic housing; a plurality of reinforcing members disposed in the cavity and bonded between the inner surfaces of the upper and lower covers of the metallic housing; and a working fluid receive in the cavity; wherein bonded surfaces between the metallic meshes and the inner surfaces of the metallic housing, the upper cover and the lower cover, and the reinforcing members and the inner surfaces of the metallic housing all are diffusion-bonded interfaces.