公开(公告)号：US20220214223A1

公开(公告)日：2022-07-07

申请号：US17613222

申请日：2020-05-21

Applicant: NEXTINPUT, INC.

Inventor： Ali FOUGHI ,  Julius Minglin TSAI ,  Christopher EDWARDS

IPC: G01J5/20 ,  G01J5/00 ,  G01J5/02 ,  G01J5/58

Abstract: Described herein is a sensor in chip scale package form factor. For example, a non-vacuum packaged sensor chip described herein includes a substrate, and a sensing element arranged on the substrate. The sensing element is configured to change resistance with temperature. Additionally, the non-vacuum packaged sensor chip includes an absorbing layer configured to absorb middle infrared (“MIR”) radiation.

公开(公告)号：US11243125B2

公开(公告)日：2022-02-08

申请号：US16485026

申请日：2018-02-09

Applicant: NEXTINPUT, INC.

Inventor： Julius Minglin Tsai ,  Ryan Diestelhorst ,  Dan Benjamin

IPC: G01L1/16 ,  G01L1/18 ,  G01L5/00 ,  B81B3/00

Abstract: Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor including both piezoresistive and piezoelectric sensing elements and integrated with complementary metal-oxide-semiconductor (“CMOS”) circuitry on the same chip. The sensor employs piezoresistive strain gauges for static force and piezoelectric strain gauges for dynamic changes in force. Both piezoresistive and piezoelectric sensing elements are electrically connected to integrated circuits provided on the same substrate as the sensing elements. The integrated circuits can be configured to amplify, digitize, calibrate, store, and/or communicate force values electrical terminals to external circuitry.

公开(公告)号：US10831292B2

公开(公告)日：2020-11-10

申请号：US15500986

申请日：2015-08-04

Applicant: NEXTINPUT, INC.

Inventor： Ian Douglas Campbell ,  Ryan Matthew Diestelhorst

IPC: G06F3/041

Abstract: An example force sensitive touch panel device can include a device body; a touch surface for receiving a touch force; a sensor for sensing touch force that is arranged between the device body and the touch surface; and a membrane configured to mechanically isolate the device body and the touch surface. Additionally, the membrane can apply a preload force to the sensor.

公开(公告)号：US10466119B2

公开(公告)日：2019-11-05

申请号：US15178976

申请日：2016-06-10

Applicant: NextInput, Inc.

Inventor： Ian Campbell ,  Ryan Diestelhorst ,  Dan Benjamin ,  Steven S. Nasiri

IPC: G01L25/00 ,  G01L1/18 ,  G01L1/26

Abstract: An example MEMS force sensor is described herein. The MEMS force sensor can include a cap for receiving an applied force and a sensor bonded to the cap. A trench and a cavity can be formed in the sensor. The trench can be formed along at least a portion of a peripheral edge of the sensor. The cavity can define an outer wall and a flexible sensing element, and the outer wall can be arranged between the trench and the cavity. The cavity can be sealed between the cap and the sensor. The sensor can also include a sensor element formed on the flexible sensing element. The sensor element can change an electrical characteristic in response to deflection of the flexible sensing element.

公开(公告)号：US10126183B2

公开(公告)日：2018-11-13

申请号：US15486632

申请日：2017-04-13

Applicant: NextInput, Inc.

Inventor： Ian Campbell ,  Ryan Diestelhorst ,  Jeremy Crank

IPC: G01L1/04 ,  G06F3/041

Abstract: An example actuator device for a force sensor is described herein. The device can include a device body, a force concentrator element, an overload protection element, one or more legs, and an attachment layer for attaching the device to a substrate. An example method for assembling a force sensing system is also described herein. Further, an example method for protecting a force sensor from excessive forces or displacement is described herein.

公开(公告)号：US09902611B2

公开(公告)日：2018-02-27

申请号：US15111044

申请日：2015-01-13

Applicant: NextInput, Inc.

Inventor： Amnon Brosh ,  Ryan Diestelhorst ,  Steven Nasiri

IPC: B81B3/00 ,  B81C1/00 ,  G01L1/18 ,  G01L1/20

CPC classification number: B81B3/0056 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81C1/00626 ,  G01L1/18 ,  G01L1/205 ,  G01L9/0047 ,  G01L9/0048

Abstract: Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.

公开(公告)号：US20170308197A1

公开(公告)日：2017-10-26

申请号：US15492127

申请日：2017-04-20

Applicant: NextInput, Inc.

Inventor： Ian Campbell ,  Ryan Diestelhorst

IPC: G06F3/044

Abstract: An example force-sensitive electronic device is described herein. The device can include a device body, a touch surface bonded to the device body in a bonded region that is arranged along a peripheral edge of the touch surface, and a plurality of force sensors that are arranged between the device body and the touch surface. Each of the plurality of force sensors can be spaced apart from the bonded region.

公开(公告)号：US12203819B2

公开(公告)日：2025-01-21

申请号：US18535230

申请日：2023-12-11

Applicant: NextInput, Inc.

Inventor： Julius Minglin Tsai ,  Dan Benjamin

IPC: G01L1/22 ,  G01L1/16 ,  G01L1/18

Abstract: MEMS force sensors for providing temperature coefficient of offset (TCO) compensation are described herein. An example MEMS force sensor can include a TCO compensation layer to minimize the TCO of the force sensor. The bottom side of the force sensor can be electrically and mechanically mounted on a package substrate while the TCO compensation layer is disposed on the top side of the sensor. It is shown the TCO can be reduced to zero with the appropriate combination of Young's modulus, thickness, and/or thermal coefficient of expansion (TCE) of the TCO compensation layer.

公开(公告)号：US11965787B2

公开(公告)日：2024-04-23

申请号：US17860941

申请日：2022-07-08

Applicant: NextInput, Inc.

Inventor： Julius Minglin Tsai ,  Ryan Diestelhorst ,  Dan Benjamin

IPC: G01L1/00 ,  B81B3/00 ,  B81C1/00 ,  G01L1/18 ,  G01L1/26

CPC classification number: G01L1/18 ,  B81B3/0021 ,  B81C1/00595 ,  G01L1/26 ,  B81B2203/0127 ,  B81C2201/014

Abstract: An example microelectromechanical system (MEMS) force sensor is described herein. The MEMS force sensor can include a sensor die configured to receive an applied force. The sensor die can include a first substrate and a second substrate, where a cavity is formed in the first substrate, and where at least a portion of the second substrate defines a deformable membrane. The MEMS force sensor can also include an etch stop layer arranged between the first substrate and the second substrate, and a sensing element arranged on a surface of the second substrate. The sensing element can be configured to convert a strain on the surface of the membrane substrate to an analog electrical signal that is proportional to the strain.

公开(公告)号：US11914777B2

公开(公告)日：2024-02-27

申请号：US16645650

申请日：2018-09-07

Applicant: NEXTINPUT, INC.

Inventor： Julius Minglin Tsai ,  Albert Bergemont ,  Christopher Edwards ,  Ali Foughi

IPC: G06F3/01 ,  G01L5/1627 ,  H10N30/20 ,  H10N30/853 ,  B81B7/00 ,  B06B1/06

CPC classification number: G06F3/016 ,  B06B1/0644 ,  B06B1/0688 ,  B81B7/008 ,  G01L5/1627 ,  H10N30/20 ,  H10N30/8536 ,  H10N30/8542 ,  H10N30/8554

Abstract: Integrated systems for force or strain sensing and haptic feedback are described herein. An example force-haptic system can include a sensor chip configured to receive an applied force, where the sensor chip includes at least one sensing element and an integrated circuit. The force-haptic system can also include a haptic actuator configured to convert an electrical excitation signal into mechanical vibration. Further, the force-haptic system can include a circuit board, where the sensor chip and the haptic actuator are electrically and mechanically coupled to the circuit board. The integrated circuit can be configured to process an electrical signal received from the at least one sensing element and to output the electrical excitation signal.