Abstract:
A thyristor based semiconductor device includes a thyristor having cathode, P-base, N-base and anode regions disposed in electrical series relationship. The N-base region for the thyristor has a cross-section that defines an inverted “T” shape, wherein a buried well in semiconductor material forms is operable as a part of the N-base. The stem to the inverted “T” shape extends from the upper surface of the semiconductor material to the buried well. The P-base region for the thyristor extends laterally outward from a side of the stem that is opposite the anode region of the thyristor, and is further bounded between the buried well and a surface of the semiconductor material. A thinned portion for the N-base is defined between the cathode region of the thyristor and the buried well, and may include supplemental dopant of concentration greater than that for some other portion of the N-base.
Abstract:
In a method of fabricating a semiconductor memory device, a thyristor may be formed in a layer of semiconductor material. Carbon may be implanted and annealed in a base-emitter junction region for the thyristor to affect leakage characteristics. The density of the carbon and/or a bombardment energy and/or an anneal therefore may be selected to establish a low-voltage, leakage characteristic for the junction substantially greater than its leakage absent the carbon. In one embodiment, an anneal of the implanted carbon may be performed in common with an activation for other implant regions the semiconductor device.
Abstract:
In a method of fabricating a semiconductor memory device, a thyristor may be formed in a layer of semiconductor material. Carbon may be implanted and annealed in a base-emitter junction region for the thyristor to affect leakage characteristics. The density of the carbon and/or a bombardment energy and/or an anneal therefore may be selected to establish a low-voltage, leakage characteristic for the junction substantially greater than its leakage absent the carbon. In one embodiment, an anneal of the implanted carbon may be performed in common with an activation for other implant regions the semiconductor device.
Abstract:
A first and a second set of memory cells are connected to the same first word line and second word line. At the commencement of data writing, the first word line is set up. The first set of memory cells is read and temporarily stored into a buffer. At about the same time, the bit lines of the second set of memory cells is set up. After completion of reading of the first set of memory cells, the bit lines of this set of memory cells are set up (while the setting up of the bit lines of the second set of memory cells continues). After the bit lines of both sets of memory cells are set up, the second word line is pulsed. At this time, written into both sets of memory cells begins, which comprises data previously read from the first set of memory cells and new data to be written into the second set of memory cells. It is found that this method reduces the overall write time.
Abstract:
A semiconductor device includes a thyristor body having at least one region in a substrate. According to an example embodiment of the present invention, a trench is in a substrate and adjacent to a thyristor body region in the substrate. The trench is lined with an insulative material and further includes conductive material that is insulated from the thyristor body region in the substrate by the liner material. A conductive thyristor control port is located in the trench and adapted for capacitively coupling to the thyristor body region in the substrate and to control current in the thyristor body by causing an outflow of minority carriers in the thyristor. With this approach, conductive material can be used to fill a portion of the trench while using the trench portion including the conductive material to electrically isolate a portion of the thyristor body in the substrate. This approach is particularly useful, for example, in high-density applications where insulative trenches having high aspect ratios are desired.
Abstract:
A thyristor-based semiconductor device is formed having a thyristor, a pass device and an emitter region buried in a substrate and below at least one other vertically-arranged contiguous region of the thyristor that is at least partially below an upper surface of the substrate. According to an example embodiment of the present invention, a conductor, such as a polysilicon pillar formed in a trench, extends through the substrate and to the buried emitter region of the thyristor. In one implementation, a portion of the conductor includes a reduced-resistance material, such as a salicide, that is adapted to reduce the resistance of an electrical connection made to the buried emitter region via the conductor. This is particularly useful, for example, in connecting the buried emitter region to a power supply at a reduced resistance (e.g., as compared to the resistance that would be exhibited, were the reduced-resistance material not present).
Abstract:
Switching operations, such as those used in memory devices, are enhanced using a thyristor-based semiconductor device adapted to switch between a blocking state and a conducting state. According to an example embodiment of the present invention, a thyristor-based semiconductor device includes a thyristor having first and second base regions coupled between first and second emitter regions, respectively. A first control port capacitively couples a first signal to the first base region, and a second control port capacitively couples a second signal to the second base region. Each of the first and second signals have a charge that is opposite in polarity, and the opposite polarity signals effect the switching of the thyristor at a lower power, relative to the power that would be required to switch the thyristor having only one control port. In this manner, power consumption for a switching operation can be reduced, which is useful, for example, to correspond with reduced power supplied to other devices in a semiconductor device employing the thyristor.
Abstract:
A reference cell produces a reference current that is about half of the current produced by a memory cell. The reference cell is essentially the same as the memory cell with an additional current reduction device that can be a transistor. Adjusting a reference voltage applied to the transistor allows the reference current to be varied. A control circuit to produce the reference voltage includes dedicated memory and reference cells and a feedback circuit that compares the two cell' currents. The feedback circuit applies the reference voltage to the reference cell of the control circuit and adjusts the reference voltage until the current from the reference cell is about half of th current from the memory cell. The reference voltage is then applied to other reference cells in a memory array.
Abstract:
A semiconductor device includes a thyristor body having at least one region in a substrate. According to an example embodiment of the present invention, a trench is in a substrate and adjacent to a thyristor body region in the substrate. The trench is lined with an insulative material and further includes conductive material that is insulated from the thyristor body region in the substrate by the liner material. A conductive thyristor control port is located in the trench and adapted for capacitively coupling to the thyristor body region in the substrate and to control current in the thyristor body by causing an outflow of minority carriers in the thyristor. With this approach, conductive material can be used to fill a portion of the trench while using the trench portion including the conductive material to electrically isolate a portion of the thyristor body in the substrate. This approach is particularly useful, for example, in high-density applications where insulative trenches having high aspect ratios are desired.
Abstract:
Parasitic current leakage from a thyristor-based semiconductor device is inhibited. According to an example embodiment of the present invention, a thyristor-based semiconductor device includes a thyristor body portion and a control port located in a substrate, the control port being adapted for capacitively coupling to the thyristor body portion for controlling current flow therein. The substrate further includes a doped circuit region separated by a channel region from another doped region of similar polarity in the substrate. The control port faces the channel region in the substrate, and the channel region is susceptible to current leakage in response to voltage pulses being applied to the control port for controlling current flow in the thyristor. The device is arranged such that such current leakage in the channel is inhibited while pulses are applied to the control port for controlling current flow in the thyristor; the parasitic current leakage between the doped circuit region and the doped region in the substrate is inhibited.