Abstract:
A thyristor tile includes first and second PNP tiles and first and second NPN tiles. Each PNP tile is adjacent to both NPN tiles, and each NPN tile is adjacent to both PNP tiles. A thyristor includes a plurality of PNP tiles and a plurality of NPN tiles. The PNP and NPN tiles are arranged in an alternating configuration in both rows and columns. The PNP tiles are oriented perpendicular to the NPN tiles. Interconnect layers have a geometry that enables even distribution of signals to the PNP and NPN tiles.
Abstract:
In one embodiment, a Light Emitting Diode (LED) driving device for driving a plurality of LEDs has a switching matrix utilizing a plurality of one of a turn off thyristors or turn off triacs coupled to the plurality of LEDs. A controller is coupled to the switching matrix responsive to a voltage of a rectified AC halfwave, wherein combinations of the plurality of LEDs are altered to ensure a maximum operating voltage of the plurality of LEDs is not exceeded. A current limiting device is coupled to the combinations of the plurality of LED to regulate current.In a second embodiment an offline charge pump utilizes a switching matrix to recombine capacitors in accordance with the voltage on the AC half wave and then in accordance with a desired output voltage to feed a load, such that said recombinations occur at a frequency much higher than the frequency of the AC rectified half wave such that charge is “pumped” from the input at one voltage to the output at another voltage through the AC halfwave while providing a constant output voltage to the load.
Abstract:
A power rectifier includes a stage having a first Tunneling Field-Effect Transistor (“TFET”) having a source, a gate, and a drain, a second TFET having a source, a gate, and a drain, a third TFET having a source, a gate, and a drain, and a fourth TFET having a source, a gate, and a drain such that the source of the first TFET, the source of the second TFET, the gate of the third TFET, and the gate of the fourth TFET are connected, the gate of the first TFET, the gate of the second TFET, the source of the third TFET and the source of the fourth TFET are connected, the drain of the first TFET and the drain of the third TFET are connected, and the drain of the second TFET and the drain of the fourth TFET are connected. Alternative embodiments are also disclosed.
Abstract:
In one embodiment, a Light Emitting Diode (LED) driving device for driving a plurality of LEDs has a switching matrix utilizing a plurality of one of a turn off thyristors or turn off triacs coupled to the plurality of LEDs. A controller is coupled to the switching matrix responsive to a voltage of a rectified AC halfwave, wherein combinations of the plurality of LEDs are altered to ensure a maximum operating voltage of the plurality of LEDs is not exceeded. A current limiting device is coupled to the combinations of the plurality of LED to regulate current.In a second embodiment an offline charge pump utilizes a switching matrix to recombine capacitors in accordance with the voltage on the AC half wave and then in accordance with a desired output voltage to feed a load, such that said recombinations occur at a frequency much higher than the frequency of the AC rectified half wave such that charge is “pumped” from the input at one voltage to the output at another voltage through the AC halfwave while providing a constant output voltage to the load.
Abstract:
According to an embodiment, a rectifier circuit includes a first diode, a switching element, and a second diode. The first diode is connected between a first terminal and a second terminal so that a direction toward the first terminal from the second terminal is in a forward direction. The switching element has a first main electrode connected to the first terminal, a second main electrode connected to a cathode of the first diode, and a gate electrode connected to an anode of the first diode. The second diode is connected in parallel with respect to the switching element so that a direction toward the first terminal from the cathode of the first diode is in a forward direction, between the first main electrode and the second main electrode of the switching element.
Abstract:
Circuits, integrated circuits, apparatuses, and methods, such as those for protecting circuits against electrostatic discharge events are disclosed. In an example method, a thyristor is triggered to conduct current from a signal node to a reference voltage node using leakage currents provided by a transistor formed in a semiconductor doped well shared with the base of the thyristor. The leakage currents are responsive to a noise event (e.g., electrostatic discharge (ESD) event) at the signal node, and increase the voltage of the semiconductor doped well to forward bias the base and the collector of the thyristor. The triggered thyristor conducts the current resulting from the ESD event to the reference voltage node.
Abstract:
A process for fabricating a semiconductor device includes depositing n-type dopant on a p-type substrate, implanting n-type material into the substrate, and growing an n-type epitaxial layer atop the n+ layer. Trenches surrounding the device region are formed and an n+ layer on the sidewalls of the trenches is formed. The trenches are filled by growing a layer of thermal oxide on the sidewalls of the trenches and deposition of plasma enhanced oxide or polysilicon into the trenches, and planarizing the top surface. n+ region of the device is formed by forming an oxide layer on the top surface of the device layer and etching the oxide, depositing n-type dopant material and driving in by high temperature diffusion. p+ region of the device is formed by etching the oxide, depositing p-type dopant material and driving in by high temperature diffusion so that the breakdown voltage is set for circuit protection.
Abstract translation:一种用于制造半导体器件的工艺包括在p型衬底上沉积n型掺杂剂,将n型材料注入到衬底中,以及在n +层顶上生长n型外延层。 形成围绕器件区域的沟槽,并形成沟槽侧壁上的n +层。 通过在沟槽的侧壁上生长一层热氧化物并且将等离子体增强的氧化物或多晶硅沉积到沟槽中并平坦化顶表面来填充沟槽。 n +区域通过在器件层的顶表面上形成氧化物层并蚀刻氧化物,沉积n型掺杂剂材料并通过高温扩散进行而形成。 通过蚀刻氧化物,沉积p型掺杂剂材料并通过高温扩散驱动来形成器件的p +区,从而设置用于电路保护的击穿电压。
Abstract:
A thyristor device includes a semiconductor body and a conductive anode. The semiconductor body has a plurality of doped layers forming a plurality of dopant junctions and includes an optical thyristor, a first amplifying thyristor, and a switching thyristor. The conductive anode is disposed on a first side of the semiconductor body. The optical thyristor is configured to receive incident radiation to generate a first electric current, and the first amplifying thyristor is configured to increase the first electric current from the optical thyristor to at least a threshold current. The switching thyristor switches to the conducting state in order to conduct a second electric current from the anode and through the semiconductor body.
Abstract:
A semiconductor apparatus includes: a first transistor; a second transistor having a higher withstand voltage than the first transistor, a source of the second transistor coupled to a drain of the first transistor, a gate of the second transistor coupled to a source of the first transistor; a third transistor having a higher withstand voltage than the first transistor and a drain of the third transistor coupled to a drain of the second transistor; and a comparator that compares a source voltage of the first transistor with a source voltage of the third transistor, and controls a gate voltage of the first transistor.
Abstract:
A low forward voltage drop transient voltage suppressor utilizes a low-reverse-voltage-rated PN diode electrically connected in parallel to a high-reverse-voltage-rated Schottky rectifier in a single integrated circuit device. The transient voltage suppressor is ideally suited to fix the problem of high forward voltage drop of PN diodes and high leakage of low reverse breakdown of Schottky rectifiers. The low-reverse-voltage PN rectifier can be fabricated through methods such as 1) double layers of epi (with higher concentration layer epi in the bottom) or 2) punch through design of PN diode by base with compression.