公开(公告)号：US08293585B2

公开(公告)日：2012-10-23

申请号：US12769265

申请日：2010-04-28

Applicant: Takeshi Takeda

Inventor： Takeshi Takeda

IPC: H01L21/00

CPC classification number: H01L27/14636 ,  H01L27/14683

Abstract: A solid-state imaging device includes a semiconductor substrate, one or more wiring interlayer films disposed on or above the semiconductor substrate, and one or more metal wires embedded in the wiring interlayer films. The one or more wiring interlayer films are composed of a diffusion preventing material that prevents the diffusion of the metal wire.

Abstract translation: 固态成像装置包括半导体基板，设置在半导体基板上或上方的一个或多个布线中间膜，以及嵌入布线中间膜中的一个或多个金属线。 一个或多个布线中间膜由阻止金属线扩散的防扩散材料构成。

公开(公告)号：US08057723B2

公开(公告)日：2011-11-15

申请号：US11704359

申请日：2007-02-09

Applicant: Takeshi Takeda ,  Makoto Kitamura ,  Nihei Kaishita

Inventor： Takeshi Takeda ,  Makoto Kitamura ,  Nihei Kaishita

IPC: B29C45/14

CPC classification number: B29C45/14221 ,  B29C45/14655

Abstract: Provides is a method of manufacturing an insert-molded article enabling to perform resin molding and tie bar cutting in one step and so as not to expose the cut planes of the tie bars to the external surface of the resin. A lead frame 1 provided with easily breakable notches 3a at positions closer to the metal component than the interfaces of tie bars 3 to be resin molded is prepared and positioned by means of pilot pins 11 provided to a lower mold 10. A metal component 4 is sandwiched between support protrusions 13 and component fixing pins 24 by lowering an upper mold 20 with the lead frame being positioned. Tie bar cutting punches 23 provided to the upper mold 20 are pressed against the tie bars, the tie bars 3 are separated from the metal component 4 by breaking the notches 3a, and the surroundings of the metal component 4 are filled with resin while the molds are closed. By this, the cut surfaces between the metal component 4 and the tie bars 3 are buried in the molded resin 7.

Abstract translation: 提供一种制造插入成型制品的方法，其能够在一个步骤中进行树脂模制和拉杆切割，并且不将连杆的切割面暴露于树脂的外表面。 通过设置在下模具10上的引导销11准备并定位引线框架1，该引线框架1在比待连接条3的树脂模制接口更靠近金属部件的位置处设置容易断裂的切口3a。金属部件4 通过在引线框架定位的同时降低上模20而夹在支撑突起13和部件固定销24之间。 设置在上模具20上的连杆切割冲头23被压靠在拉杆上，通过断开切口3a将连接杆3与金属部件4分离，金属部件4的周围用树脂填充，而模具 关闭。 由此，将金属部件4和连接条3之间的切割面埋设在模制树脂7中。

公开(公告)号：US20110129950A1

公开(公告)日：2011-06-02

申请号：US13017876

申请日：2011-01-31

Applicant: Takeshi TAKEDA ,  Tadayuki DOFUKU ,  Kenji TAKEO

Inventor： Takeshi TAKEDA ,  Tadayuki DOFUKU ,  Kenji TAKEO

IPC: H01L33/00

CPC classification number: C23F1/02 ,  H01L27/14623 ,  H01L27/14685 ,  H01L27/14812

Abstract: A method of manufacturing a solid state imaging device having a photo-electric conversion portion array and a transfer electrode array, these arrays being provided in parallel to each other, upper surfaces and side wall surfaces of the transfer electrode array being covered with a light-shielding layer, and a transparent layer showing an oxidizing property at the time of film formation, the transparent layer being formed on the photo-electric conversion parts and the light-shielding layer.

Abstract translation: 一种制造具有光电转换部分阵列和转印电极阵列的固态成像装置的方法，这些阵列彼此平行地设置，转印电极阵列的上表面和侧壁表面被发光元件覆盖， 屏蔽层，以及在成膜时显示氧化性的透明层，透明层形成在光电转换部分和遮光层上。

公开(公告)号：US07935988B2

公开(公告)日：2011-05-03

申请号：US12468593

申请日：2009-05-19

Applicant: Takeshi Takeda ,  Tadayuki Dofuku ,  Kenji Takeo

Inventor： Takeshi Takeda ,  Tadayuki Dofuku ,  Kenji Takeo

IPC: H01L27/148

CPC classification number: C23F1/02 ,  H01L27/14623 ,  H01L27/14685 ,  H01L27/14812

Abstract: A method of manufacturing a solid state imaging device having a photo-electric conversion portion array and a transfer electrode array, these arrays being provided in parallel to each other, upper surfaces and side wall surfaces of the transfer electrode array being covered with a light-shielding layer, and a transparent layer showing an oxidizing property at the time of film formation, the transparent layer being formed on the photo-electric conversion parts and the light-shielding layer.

公开(公告)号：US20100203671A1

公开(公告)日：2010-08-12

申请号：US12769265

申请日：2010-04-28

Applicant: Takeshi TAKEDA

Inventor： Takeshi TAKEDA

IPC: H01L31/18

CPC classification number: H01L27/14636 ,  H01L27/14683

Abstract: A solid-state imaging device includes a semiconductor substrate, one or more wiring interlayer films disposed on or above the semiconductor substrate, and one or more metal wires embedded in the wiring interlayer films. The one or more wiring interlayer films are composed of a diffusion preventing material that prevents the diffusion of the metal wire.

Abstract translation: 固态成像装置包括半导体基板，设置在半导体基板上或上方的一个或多个布线中间膜，以及嵌入布线中间膜中的一个或多个金属线。 一个或多个布线中间膜由阻止金属线扩散的防扩散材料构成。

公开(公告)号：US07763855B2

公开(公告)日：2010-07-27

申请号：US12233901

申请日：2008-09-19

Applicant: Koji Hayashi ,  Hitoshi Taga ,  Takeshi Takeda

Inventor： Koji Hayashi ,  Hitoshi Taga ,  Takeshi Takeda

IPC: G01J5/04 ,  G02B7/02

CPC classification number: H01L31/0203 ,  H01L31/02162 ,  H01L31/09 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An economical and highly reliable infrared sensor with a wide field of view and a method for economically manufacturing a highly reliable infrared sensor with a wide field of view includes a package having supporting portions that support an optical filter at a location below the upper surfaces of sidewalls of the package and recessed portions that communicate with gaps between side surfaces of the optical filter supported by the supporting portions and the sidewalls of the package. An adhesive is supplied to the recessed portions while the optical filter is supported by the supporting portions such that the adhesive flows into the gaps between the optical filter and the sidewalls of the package by capillary action and such that the optical filter is fixed to an opening of the package via the adhesive. The optical filter is fixed to the package via the adhesive by applying the adhesive such that the adhesive spreads over substantially the entire circumference of the optical filter.

Abstract translation: 具有宽视野的经济且高度可靠的红外传感器和用于经济地制造具有宽视野的高度可靠的红外传感器的方法包括具有支撑部分的封装，所述支撑部分在侧壁的上表面下方的位置处支撑滤光器 以及与由支撑部分支撑的滤光器的侧表面与封装的侧壁之间的间隙连通的凹部。 粘合剂被供给到凹部，同时滤光器被支撑部支撑，使得粘合剂通过毛细管作用流入滤光器和封装的侧壁之间的间隙中，并且使得滤光器固定到开口 的包装。 通过施加粘合剂将滤光器通过粘合剂固定到包装上，使得粘合剂在光学滤光器的基本上整个圆周上扩展。

公开(公告)号：US20090263929A1

公开(公告)日：2009-10-22

申请号：US12382713

申请日：2009-03-23

Applicant: Takeshi Takeda ,  Yukihiro Ando ,  Masaki Okamoto ,  Masayuki Okada ,  Kaori Takimoto ,  Katsuhisa Kugimiya ,  Tadayuki Kimura

Inventor： Takeshi Takeda ,  Yukihiro Ando ,  Masaki Okamoto ,  Masayuki Okada ,  Kaori Takimoto ,  Katsuhisa Kugimiya ,  Tadayuki Kimura

IPC: H01L31/00

CPC classification number: H01L27/14812 ,  H01L27/14831

Abstract: A method for producing a solid-state imaging device includes steps of: forming transfer electrodes on a substrate having a plurality of light-sensing portions through a gate insulating layer so that the light-sensing portions are exposed; forming a planarized insulating layer on the substrate to cover the transfer electrodes formed on the substrate; forming openings in the planarized insulating layer so that each of the transfer electrodes is partly exposed out of the planarized insulating layer at a predetermined position; forming a wiring material layer so that the openings are filled with the wiring material layer; forming a resist layer on the wiring material layer; exposing and developing the resist layer so that only the resist layer in a predetermined area covering the openings is left; and patterning the wiring material layer using the exposed and developed resist layer to form connection wirings connected to the transfer electrodes by the openings.

Abstract translation: 一种制造固态成像装置的方法，包括以下步骤：通过栅极绝缘层，在具有多个光检测部分的基板上形成转印电极，使得光敏部分露出; 在所述基板上形成平坦化的绝缘层，以覆盖形成在所述基板上的转移电极; 在平坦化绝缘层中形成开口，使得每个传输电极在预定位置部分地暴露在平坦化绝缘层之外; 形成布线材料层，使得开口被布线材料层填充; 在所述布线材料层上形成抗蚀剂层; 曝光和显影抗蚀剂层，使得仅保留覆盖开口的预定区域中的抗蚀剂层; 并使用曝光和显影的抗蚀剂层图案化布线材料层，以形成通过开口连接到转印电极的连接布线。

公开(公告)号：US07210222B2

公开(公告)日：2007-05-01

申请号：US10758094

申请日：2004-01-16

Applicant: Keizo Izumida ,  Takeshi Takeda ,  Kazuyuki Nakano

Inventor： Keizo Izumida ,  Takeshi Takeda ,  Kazuyuki Nakano

IPC: H05K3/30

CPC classification number: H05K13/08 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53261

Abstract: The present invention provides a power supply control method which is executed by the electronic component mounting apparatus. A drive power source and a control power source are separately connected and shut-off in accordance with a command from a control device to each of component feed drive parts for driving component feed devices, a component transfer drive device for driving a component transfer device, and a circuit board positioning drive device for driving a circuit board positioning device. The control device detects an individual occurrence of a halt condition of each of constituent parts of an electronic component mounting apparatus and shuts off a drive power source to the drive device in the halt condition. Thus, wasteful power consumption is eliminated and production is continued with a necessary minimum power.

Abstract translation: 本发明提供一种由电子部件安装装置执行的电源控制方法。 驱动电源和控制电源根据从控制装置到用于驱动部件供给装置的各个部件供给驱动部的命令分开连接和切断，用于驱动部件传送装置的部件传送驱动装置， 以及用于驱动电路板定位装置的电路板定位驱动装置。 控制装置检测电子部件安装装置的各构成部件的停止状态的个别发生，并且在停止状态下将驱动电源切断到驱动装置。 因此，消除浪费的功率消耗，并以必要的最小功率继续生产。

公开(公告)号：US20070051874A1

公开(公告)日：2007-03-08

申请号：US11511643

申请日：2006-08-29

Applicant: Takeshi Takeda ,  Tadayuki Dofuku ,  Kenji Takeo

Inventor： Takeshi Takeda ,  Tadayuki Dofuku ,  Kenji Takeo

IPC: C23F1/00 ,  H01L27/00 ,  H01L29/76 ,  H01L21/302

CPC classification number: C23F1/02 ,  H01L27/14623 ,  H01L27/14685 ,  H01L27/14812

Abstract: A method of manufacturing a solid state imaging device having a photo-electric conversion portion array and a transfer electrode array, these arrays being provided in parallel to each other, upper surfaces and side wall surfaces of the transfer electrode array being covered with a light-shielding layer, and a transparent layer showing an oxidizing property at the time of film formation, the transparent layer being formed on the photo-electric conversion parts and the light-shielding layer.

Abstract translation: 一种制造具有光电转换部分阵列和转印电极阵列的固态成像装置的方法，这些阵列彼此平行地设置，转印电极阵列的上表面和侧壁表面被发光元件覆盖， 屏蔽层，以及在成膜时显示氧化性的透明层，透明层形成在光电转换部分和遮光层上。

公开(公告)号：US07181191B2

公开(公告)日：2007-02-20

申请号：US10518442

申请日：2003-06-17

Applicant: Takeshi Takeda ,  Tetsuo Wakabayashi

Inventor： Takeshi Takeda ,  Tetsuo Wakabayashi

IPC: H04M7/20 ,  G05B11/01

CPC classification number: H01R13/70 ,  H04M11/007

Abstract: A power source cut-off system enabling the user to cut off power supply from an outlet even when user is out comprises an outlet tap for supplying power to an electric apparatus by connecting it to a home commercial power source and a telephone set for controlling this outlet tap and connected to an external telephone line. The outlet tap comprises an outlet to which the electric apparatus is connected, a power cut-off means for cutting off the power source at this outlet, a reception means for receiving a radio signal transmitted from the external telephone set, and a control means for cutting off the power source at the outlet by the power source cut-off device according to the radio signal received by this reception means. The telephone set comprises a control signal reception means for receiving a control signal transmitted via an external communication apparatus, and a transmission means for transmitting a radio signal to the outlet tap on the basis of the control receiving means.

Abstract translation: 一种电源切断系统，使得用户即使当用户离开时也能够切断来自出口的电源，包括通过将电源连接到家用商业电源向电气设备供电的出口抽头和用于控制该电源的电话机 插座并连接到外部电话线。 出口龙头包括连接电气设备的出口，用于在该出口处切断电源的电源切断装置，用于接收从外部电话机发送的无线电信号的接收装置，以及用于 根据由该接收装置接收到的无线电信号，通过电源切断装置切断出口处的电源。 电话机包括用于接收经由外部通信装置发送的控制信号的控制信号接收装置，以及用于基于控制接收装置将无线电信号发送到出口抽头的发送装置。