公开(公告)号：US20100140667A1

公开(公告)日：2010-06-10

申请号：US12612466

申请日：2009-11-04

Applicant: Kaori TAKIMOTO ,  Masayuki OKADA ,  Takeshi TAKEDA

Inventor： Kaori TAKIMOTO ,  Masayuki OKADA ,  Takeshi TAKEDA

IPC: H01L27/148 ,  H01L21/28

CPC classification number: H01L27/14843 ,  H01L27/14601 ,  H01L27/14623 ,  H01L27/14683

Abstract: Disclosed herein is a solid-state imaging device including a first transfer electrode portion and a second transfer electrode portion having a pattern area rate higher than that of the first transfer electrode portion. The first transfer electrode portion includes a plurality of first transfer electrodes having a single-layer structure of metal material. The second transfer electrode portion includes a plurality of second transfer electrodes having a single-layer structure of polycrystalline silicon or amorphous silicon.

Abstract translation: 本文公开了一种固态成像装置，其包括第一转印电极部分和第二转印电极部分，其图案面积率高于第一转印电极部分的图案面积率。 第一转印电极部分包括具有单层金属材料结构的多个第一转印电极。 第二转移电极部分包括具有多晶硅或非晶硅的单层结构的多个第二转移电极。

公开(公告)号：US20090212218A1

公开(公告)日：2009-08-27

申请号：US12424565

申请日：2009-04-16

Applicant: Koji HAYASHI ,  Takeshi TAKEDA

Inventor： Koji HAYASHI ,  Takeshi TAKEDA

IPC: G01J5/00

CPC classification number: G01J1/04 ,  G01J1/0271 ,  G01J1/0407 ,  G01J2001/0276

Abstract: A small infrared sensor has a wide infrared light-receiving area (viewing angle), high electromagnetic shielding characteristics, and excellent electromagnetic-wave resistance characteristics. In the infrared sensor, supporting portions are disposed at four corners of a substantially rectangular opening in a package. The supporting portions support an optical filter, disposed so as to cover the opening, at positions that are lower than an upper end of an inner peripheral wall defining the opening. While the optical filter is supported by the supporting portions as a result of inserting a portion of a surface side of the optical filter facing the supporting portions into the opening, the optical filter is secured to the package. The optical filter and the package are joined and secured, and electrically connected to each other through a conductive adhesive.

Abstract translation: 小型红外线传感器具有宽的红外光接收面积（视角），高电磁屏蔽特性和优异的电磁波电阻特性。 在红外传感器中，支撑部分设置在包装件中的大致矩形开口的四个角处。 所述支撑部支撑设置成覆盖所述开口的光学过滤器，所述光学过滤器位于比限定所述开口的内周壁的上端低的位置处。 当由于将滤光器的面对支撑部分的表面侧的一部分插入到开口中而由支撑部分支撑滤光器时，滤光器固定在封装上。 光学滤波器和封装被接合并固定，并通过导电粘合剂彼此电连接。

公开(公告)号：US20080087824A1

公开(公告)日：2008-04-17

申请号：US11937218

申请日：2007-11-08

Applicant: Koji HAYASHI ,  Takeshi TAKEDA

Inventor： Koji HAYASHI ,  Takeshi TAKEDA

IPC: G01J5/00

CPC classification number: G01J1/04 ,  G01J1/0271 ,  G01J1/0407 ,  G01J2001/0276

Abstract: A small infrared sensor has a wide infrared light-receiving area (viewing angle), high electromagnetic shielding characteristics, and excellent electromagnetic-wave resistance characteristics. In the infrared sensor, supporting portions are disposed at four corners of a substantially rectangular opening in a package. The supporting portions support an optical filter, disposed so as to cover the opening, at positions that are lower than an upper end of an inner peripheral wall defining the opening. While the optical filter is supported by the supporting portions as a result of inserting a portion of a surface side of the optical filter facing the supporting portions into the opening, the optical filter is secured to the package. The optical filter and the package are joined and secured, and electrically connected to each other through a conductive adhesive.

Abstract translation: 小型红外线传感器具有宽的红外光接收面积（视角），高电磁屏蔽特性和优异的电磁波电阻特性。 在红外传感器中，支撑部分设置在包装件中的大致矩形开口的四个角处。 所述支撑部支撑设置成覆盖所述开口的光学过滤器，所述光学过滤器位于比限定所述开口的内周壁的上端低的位置处。 当由于将滤光器的面对支撑部分的表面侧的一部分插入到开口中而由支撑部分支撑滤光器时，滤光器固定在封装上。 光学滤波器和封装被接合并固定，并通过导电粘合剂彼此电连接。

公开(公告)号：US20090243017A1

公开(公告)日：2009-10-01

申请号：US12468593

申请日：2009-05-19

Applicant: Takeshi TAKEDA ,  Tadayuki Dofuku ,  Kenji Takeo

Inventor： Takeshi TAKEDA ,  Tadayuki Dofuku ,  Kenji Takeo

IPC: H01L31/0232

CPC classification number: C23F1/02 ,  H01L27/14623 ,  H01L27/14685 ,  H01L27/14812

Abstract: A method of manufacturing a solid state imaging device having a photo-electric conversion portion array and a transfer electrode array, these arrays being provided in parallel to each other, upper surfaces and side wall surfaces of the transfer electrode array being covered with a light-shielding layer, and a transparent layer showing an oxidizing property at the time of film formation, the transparent layer being formed on the photo-electric conversion parts and the light-shielding layer.

Abstract translation: 一种制造具有光电转换部分阵列和转印电极阵列的固态成像装置的方法，这些阵列彼此平行地设置，转印电极阵列的上表面和侧壁表面被发光元件覆盖， 屏蔽层，以及在成膜时显示氧化性的透明层，透明层形成在光电转换部分和遮光层上。

公开(公告)号：US20120319509A1

公开(公告)日：2012-12-20

申请号：US13525025

申请日：2012-06-15

Applicant: Yuji KISHIMA ,  Takeshi TAKEDA

Inventor： Yuji KISHIMA ,  Takeshi TAKEDA

IPC: H02K7/14

CPC classification number: B23B45/02 ,  B23B2260/024 ,  B25B21/00 ,  B25B23/18 ,  B25F5/001 ,  B25F5/008 ,  B25F5/02

Abstract: An electric tool including: a motor; a housing including, a motor housing accommodating the motor, and a handle housing having one end connected to the motor housing and another other end configured to be provided with a detachable battery pack; an output part partially accommodated in the motor housing and configured to be driven by the motor; and a control board accommodated in the motor housing and configured to control the motor.

Abstract translation: 一种电动工具，包括：电动机; 壳体，其包括容纳所述马达的马达壳体和具有连接到所述马达壳体的一端的手柄壳体，以及构造成设置有可拆卸电池组的另一端; 输出部分部分地容纳在电动机壳体中并构造成由电动机驱动; 以及容纳在马达壳体中并被配置为控制马达的控制板。

公开(公告)号：US20110129950A1

公开(公告)日：2011-06-02

申请号：US13017876

申请日：2011-01-31

Applicant: Takeshi TAKEDA ,  Tadayuki DOFUKU ,  Kenji TAKEO

Inventor： Takeshi TAKEDA ,  Tadayuki DOFUKU ,  Kenji TAKEO

IPC: H01L33/00

CPC classification number: C23F1/02 ,  H01L27/14623 ,  H01L27/14685 ,  H01L27/14812

Abstract: A method of manufacturing a solid state imaging device having a photo-electric conversion portion array and a transfer electrode array, these arrays being provided in parallel to each other, upper surfaces and side wall surfaces of the transfer electrode array being covered with a light-shielding layer, and a transparent layer showing an oxidizing property at the time of film formation, the transparent layer being formed on the photo-electric conversion parts and the light-shielding layer.

Abstract translation: 一种制造具有光电转换部分阵列和转印电极阵列的固态成像装置的方法，这些阵列彼此平行地设置，转印电极阵列的上表面和侧壁表面被发光元件覆盖， 屏蔽层，以及在成膜时显示氧化性的透明层，透明层形成在光电转换部分和遮光层上。

公开(公告)号：US20100203671A1

公开(公告)日：2010-08-12

申请号：US12769265

申请日：2010-04-28

Applicant: Takeshi TAKEDA

Inventor： Takeshi TAKEDA

IPC: H01L31/18

CPC classification number: H01L27/14636 ,  H01L27/14683

Abstract: A solid-state imaging device includes a semiconductor substrate, one or more wiring interlayer films disposed on or above the semiconductor substrate, and one or more metal wires embedded in the wiring interlayer films. The one or more wiring interlayer films are composed of a diffusion preventing material that prevents the diffusion of the metal wire.

Abstract translation: 固态成像装置包括半导体基板，设置在半导体基板上或上方的一个或多个布线中间膜，以及嵌入布线中间膜中的一个或多个金属线。 一个或多个布线中间膜由阻止金属线扩散的防扩散材料构成。