公开(公告)号：US11700471B2

公开(公告)日：2023-07-11

申请号：US17804274

申请日：2022-05-26

Applicant: Apple Inc.

Inventor： Edward Siahaan ,  Daniel R. Bloom ,  Jason J. LeBlanc ,  Phillip Qian

IPC: H04R25/00 ,  H04R1/10 ,  H04R5/033 ,  H04R5/04 ,  G10K11/178

CPC classification number: H04R1/1008 ,  H04R1/105 ,  H04R1/1033 ,  H04R1/1041 ,  H04R1/1066 ,  H04R1/1075 ,  H04R1/1083 ,  H04R5/0335 ,  H04R5/04 ,  G10K11/17861 ,  G10K11/17873

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20220386009A1

公开(公告)日：2022-12-01

申请号：US17804274

申请日：2022-05-26

Applicant: APPLE INC.

Inventor： Edward Siahaan ,  Daniel R. Bloom ,  Jason J. LeBlanc ,  Phillip Qian

IPC: H04R1/10 ,  H04R5/033 ,  H04R5/04

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US11457300B2

公开(公告)日：2022-09-27

申请号：US17023239

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Dustin A. Hatfield ,  Michael B. Minerbi ,  Eugene Antony Whang ,  Benjamin A. Shaffer ,  Edward Siahaan ,  Daniel R. Bloom

IPC: H04R25/00 ,  H04R1/10 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

公开(公告)号：US11375306B2

公开(公告)日：2022-06-28

申请号：US16878565

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Esge B. Andersen ,  Miikka O. Tikander ,  Jared M. Kole ,  Daniel R. Bloom ,  Onur I. Ilkorur ,  Eugene Antony Whang ,  Christopher S. Erickson ,  Rajesh Anantharaman ,  Edwin J. Corona Aparicio

IPC: H04R25/00 ,  H04R1/10 ,  H04R5/033 ,  H04R5/04 ,  G10K11/178

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20220086549A1

公开(公告)日：2022-03-17

申请号：US17023239

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Dustin A. Hatfield ,  Michael B. Minerbi ,  Eugene Antony Whang ,  Benjamin A. Shaffer ,  Edward Siahaan ,  Daniel R. Bloom

IPC: H04R1/10 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

公开(公告)号：US20220085843A1

公开(公告)日：2022-03-17

申请号：US17469001

申请日：2021-09-08

Applicant: Apple Inc.

Inventor： Daniel R. Bloom ,  Chelsea E. Wojeski ,  Edward Siahaan ,  Nathan Morris ,  Ryan S. Haley ,  Tian Shi Li ,  Toni Ristoski

IPC: H04B1/3827

Abstract: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.

公开(公告)号：US11252492B2

公开(公告)日：2022-02-15

申请号：US16878547

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Jared M. Kole ,  Daniel R. Bloom ,  Audrey L. Sheng ,  Tian Shi Li ,  Eugene Antony Whang

IPC: H04R1/10 ,  H04R5/033 ,  H04R5/04 ,  G10K11/178

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US11240585B2

公开(公告)日：2022-02-01

申请号：US17023237

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Jeffrey J. Terlizzi ,  Kathleen A. Bergeron ,  Ali N. Ergun ,  Dustin A. Hatfield ,  Ethan L. Huwe ,  Todd P. Marco ,  Jason Joseph LeBlanc ,  Robert D. Zupke ,  Michael B. Minerbi ,  Prathamesh R. Bhagwat ,  Daniel R. Bloom

IPC: H04R25/00 ,  H04R1/10

Abstract: A personal audio device (e.g., headphones, earphones) can have an earpiece (e.g., an ear cup or earbud) with a removable cushioning member (e.g., headphone cushions or ear tips for earbuds). The cushioning member can include an identification tag that encodes identification data for the cushioning member. When the cushioning member is attached to the earpiece, the identification tag is brought into proximity with a tag sensor in the earpiece and the earpiece can read the identification tag to determine identification data for the cushioning member. The identification data can be used to modify a behavior of the earpiece and/or of a host device communicably coupled to the earpiece.

公开(公告)号：US11134328B2

公开(公告)日：2021-09-28

申请号：US16878556

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Jared M. Kole ,  Daniel R. Bloom ,  Audrey L. Sheng ,  Tian Shi Li ,  Eugene Antony Whang ,  Edward Siahaan ,  Phillip Qian ,  Alex C. Hellwig ,  Oliver M. Hewitt ,  Yuta Kuboyama ,  Christopher S. Erickson ,  Sneha Kadetotad ,  Edwin J. Corona Aparicio ,  Rajesh Anantharaman ,  Jacob E. Mattingley ,  Tsu-Hui Lin ,  Robert D. Zupke ,  Dustin A. Hatfield ,  Axit H. Patel

IPC: H04R1/10 ,  H04R5/033 ,  H04R5/04 ,  G10K11/178

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US11109135B1

公开(公告)日：2021-08-31

申请号：US17023234

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Edwin J. Corona Aparicio ,  Daniel R. Bloom ,  Jason Joseph LeBlanc

IPC: H04R25/00 ,  H04R1/10

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.