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公开(公告)号：US11439364B2
公开(公告)日：2022-09-13
申请号：US15638331
申请日：2017-06-29
Applicant: BFLY Operations, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
IPC: A61B8/00 , G01S15/89 , A61B8/14 , G01S15/02 , G01S7/52 , B81C1/00 , B06B1/02 , A61N7/02 , A61N7/00 , H04R1/00 , A61B8/08
Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the “ultrasound-on-a-chip” solution disclosed herein.
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公开(公告)号：US11354926B2
公开(公告)日：2022-06-07
申请号：US16705504
申请日：2019-12-06
Applicant: BFLY Operations, Inc.
Inventor： Jianwei Liu , Keith G. Fife , Sarp Satir
Abstract: Aspects of the technology described herein relate to sensing a fingerprint of a subject via an ultrasound fingerprint sensor. Certain aspects relate to transmitting and receiving ultrasound data at multiple different frequencies to provide sensing data from different depths within the skin of the subject. Since different ultrasound frequencies are expected to penetrate a subject's skin to different degrees, sensing a finger at multiple ultrasound frequencies may provide information on different physical aspects of the finger. For instance, sound ultrasound frequencies may sense a surface of the skin, whereas other ultrasound frequencies may penetrate through one or more of the epidermal, dermal or subcutaneous layers. The ultrasound fingerprint apparatus may have utility in various applications, including but not limited to mobile electronic devices, such as mobile phones or tablet computers, a laptop computer or biometric access equipment.
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公开(公告)号：US11350911B2
公开(公告)日：2022-06-07
申请号：US16513677
申请日：2019-07-16
Applicant: BFLY Operations, Inc.
Inventor： Kailiang Chen , Keith G. Fife
Abstract: A time gain compensation (TGC) circuit for an ultrasound device includes a first amplifier having an integrating capacitor and a control circuit configured to generate a TGC control signal that controls an integration time of the integrating capacitor, thereby controlling a gain of the first amplifier. The integration time is an amount of time an input signal is coupled to the first amplifier before the input signal is isolated from the first amplifier.
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公开(公告)号：US11294044B2
公开(公告)日：2022-04-05
申请号：US16109457
申请日：2018-08-22
Applicant: BFLY Operations, Inc.
Inventor： Kailiang Chen , Tyler S. Ralston , Keith G. Fife
Abstract: Circuitry for ultrasound devices is described. A multilevel pulser is described, which can provide bipolar pulses of multiple levels. The multilevel pulser includes a pulsing circuit and pulser and feedback circuit. Symmetric switches are also described. The symmetric switches can be positioned as inputs to ultrasound receiving circuitry to block signals from the receiving circuitry.
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公开(公告)号：US12263506B2
公开(公告)日：2025-04-01
申请号：US18530629
申请日：2023-12-06
Applicant: BFLY OPERATIONS, INC.
Inventor： Lingyun Miao , Keith G. Fife , Jianwei Liu , Jonathan M. Rothberg
Abstract: An ultrasound transducer device made by a process that includes the steps of forming depositing a first layer on a substrate, depositing a second layer on the first layer, patterning the second layer at a region corresponding to a location of a transducer cavity, depositing a third layer that refills regions created by patterning the second layer, planarizing the third layer to a top surface of the second layer, removing the second layer, conformally depositing a fourth layer over the first layer and the third layer, defining the transducer cavity in a support layer formed over the fourth layer; and bonding a membrane to the support layer.
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Patent Agency Ranking
公开(公告)号：US20240416385A1
公开(公告)日：2024-12-19
申请号：US18813377
申请日：2024-08-23
Applicant: BFLY Operations, Inc
Inventor： Lingyun Miao , Jianwei Liu , Keith G. Fife
Abstract: A method of forming an ultrasonic transducer device includes forming and patterning a film stack over a substrate, the film stack comprising a metal electrode layer and a chemical mechanical polishing (CMP) stop layer formed over the metal electrode layer; forming an insulation layer over the patterned film stack; planarizing the insulation layer to the CMP stop layer; measuring a remaining thickness of the CMP stop layer; and forming a membrane support layer over the patterned film stack, wherein the membrane support layer is formed at thickness dependent upon the measured remaining thickness of the CMP stop layer, such that a combined thickness of the CMP stop layer and the membrane support layer corresponds to a desired transducer cavity depth.
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公开(公告)号：US11986349B2
公开(公告)日：2024-05-21
申请号：US16401630
申请日：2019-05-02
Applicant: BFLY OPERATIONS, INC.
Inventor： Keith G. Fife , Jianwei Liu , Joseph Lutsky , Sarp Satir , Jungwook Yang
CPC classification number: A61B8/4483 , A61B8/06 , B06B1/00 , B06B1/0292 , A61B8/4444 , A61B8/483 , A61B8/5207 , B06B2201/76
Abstract: An ultrasound device is described. The ultrasound device may include a cavity, a membrane, and a sensing electrode. When an electrical signal is applied to the sensing electrode and a static bias is applied to the membrane, the membrane vibrates within the cavity and produces ultrasonic signals. The cavity, the membrane, and the sensing electrode may be considered a capacitive micromachined ultrasonic transducer (CMUT). The sensing electrode may be shaped as a ring, whereby the central portion of the sensing electrode is removed. Removal of the central portion of the sensing electrode may reduce the parasitic capacitance without substantially affecting the production of ultrasonic signals by the CMUT. This, in turn, can result in an increase in the signal-to-noise ratio (SNR) of the ultrasonic signals. The ultrasound device may further include a bond pad configured for wire bonding, and a trench electrically isolating the bond pad from the membrane.
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公开(公告)号：US20240120891A1
公开(公告)日：2024-04-11
申请号：US18389875
申请日：2023-12-20
Applicant: BFLY OPERATIONS, INC.
Inventor： Kailiang Chen , Keith G. Fife , Nevada J. Sanchez , Andrew J. Casper , Tyler S. Ralston
CPC classification number: H03F3/16 , A61B5/6801 , A61B8/4444 , G01S7/52025 , H03F1/086 , H03F3/45183 , A61B8/5207 , H03F2203/45726
Abstract: A variable current trans-impedance amplifier (TIA) for an ultrasound device is described. The TIA may be coupled to an ultrasonic transducer to amplify an output signal of the ultrasonic transducer representing an ultrasound signal received by the ultrasonic transducer. During acquisition of the ultrasound signal by the ultrasonic transducer, one or more current sources in the TIA may be varied.
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公开(公告)号：US20240100566A1
公开(公告)日：2024-03-28
申请号：US18530629
申请日：2023-12-06
Applicant: BFLY OPERATIONS, INC.
Inventor： Lingyun Miao , Keith G. Fife , Jianwei Liu , Jonathan M. Rothberg
CPC classification number: B06B1/0292 , B81B3/001 , B81C1/00984 , B81B2203/0127 , B81B2203/0315 , B81B2203/0392 , B81C2201/0109 , B81C2201/0125 , B81C2201/0176
Abstract: An ultrasound transducer device made by a process that includes the steps of forming depositing a first layer on a substrate, depositing a second layer on the first layer, patterning the second layer at a region corresponding to a location of a transducer cavity, depositing a third layer that refills regions created by patterning the second layer, planarizing the third layer to a top surface of the second layer, removing the second layer, conformally depositing a fourth layer over the first layer and the third layer, defining the transducer cavity in a support layer formed over the fourth layer; and bonding a membrane to the support layer.
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公开(公告)号：US20240100565A1
公开(公告)日：2024-03-28
申请号：US18523949
申请日：2023-11-30
Applicant: BFLY OPERATIONS, INC.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
CPC classification number: B06B1/02 , B06B1/0292 , B81B3/0021 , B81B7/0077 , B81C1/00158 , G10K9/12 , G10K11/18 , B81B2203/0127 , B81B2203/0315 , B81B2207/015 , B81C2201/013 , B81C2203/0118 , B81C2203/0735 , B81C2203/0771
Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.
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