公开(公告)号：US20080006917A1

公开(公告)日：2008-01-10

申请号：US11470494

申请日：2006-09-06

Applicant: Ya-Chi Chen ,  Chun-Ying Lin ,  Yu-Ren Chen ,  I-Hsin Mao

Inventor： Ya-Chi Chen ,  Chun-Ying Lin ,  Yu-Ren Chen ,  I-Hsin Mao

IPC: H01L23/02

CPC classification number: H01L23/4951 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/4911 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A chip package structure including a chip, a lead frame, first bonding wires and second bonding wires is provided. The chip has an active surface, first bonding pads and second bonding pads, wherein the first bonding pads and the second bonding pads are disposed on the active surface. The chip is fixed below the lead frame, and the lead frame includes inner leads and bus bars. The inner leads and the bus bars are disposed above the active surface of the chip, and the bus bars are located between the inner leads and the corresponding first bonding pads. The first bonding wires respectively connect the first bonding pads and the bus bars. The second bonding wires respectively connect the bus bars and a part of the inner leads. The third bonding wires respectively connect the second bonding pads and the other of the inner leads.

Abstract translation: 提供了包括芯片，引线框架，第一接合线和第二接合线的芯片封装结构。 芯片具有有源表面，第一接合焊盘和第二接合焊盘，其中第一接合焊盘和第二接合焊盘设置在有源表面上。 芯片固定在引线框架下方，引线框架包括内部引线和母线。 内引线和母线设置在芯片的有效表面之上，并且母线位于内引线和相应的第一焊盘之间。 第一接合线分别连接第一接合焊盘和母线。 第二接合线分别连接母线和内引线的一部分。 第三接合线分别连接第二接合焊盘和另一个内部引线。

公开(公告)号：US20070237839A1

公开(公告)日：2007-10-11

申请号：US11392698

申请日：2006-03-30

Applicant: Chia-Li Wei ,  Meng-Hwan Lee ,  Chun-Ying Lin ,  Jay Hua ,  Ying-Chieh Tsai

Inventor： Chia-Li Wei ,  Meng-Hwan Lee ,  Chun-Ying Lin ,  Jay Hua ,  Ying-Chieh Tsai

IPC: A61K36/53

CPC classification number: A61K36/45

Abstract: A method for treating/relief of women's menstruation pain. The pain is reduced or relieved by externally administering an effective amount of an essential oil obtained from origanum, anthopogan, perrila, herba moslae, elemi, cuban oregano and/or a combination thereof.

Abstract translation: 治疗/缓解妇女月经痛的方法。 通过外部施用有效量的从orig um，ant an，ila ila，，ae ae ele an an an ore o an an an is The The The The The The The。。。。

公开(公告)号：US20070080452A1

公开(公告)日：2007-04-12

申请号：US11514329

申请日：2006-09-01

Applicant: Chen-Ya- Chi ,  Chun-Ying Lin ,  An-Hong Liu ,  Yi-Chang Lee ,  Hsiang-Ming Huang

Inventor： Chen-Ya- Chi ,  Chun-Ying Lin ,  An-Hong Liu ,  Yi-Chang Lee ,  Hsiang-Ming Huang

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/44

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/10977 ,  H05K2203/049 ,  H05K2203/0597 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A bump structure mainly includes a metal core, a buffer encapsulant, and a metal cap where the metal core is a stud bump formed by wire bonding. The buffer encapsulant encapsulates the metal core. A metal cap is formed on the top surface of the buffer encapsulant and is electrically connected to the metal core. Therefore, the bump structure possesses excellent resistance of thermal stress to reduce or even eliminate metal fatigue in the bump without causing electrical shorts in the package.

Abstract translation: 凸块结构主要包括金属芯，缓冲密封剂和金属盖，其中金属芯是通过引线键合形成的柱形凸块。 缓冲密封剂封装金属芯。 金属盖形成在缓冲密封剂的顶表面上并与金属芯电连接。 因此，凸块结构具有优异的热应力阻力，以减少或甚至消除凸块中的金属疲劳，而不会导致封装中的电短路。