Abstract:
A method for measuring surface topography characterized by making multiple scans of the surface with a laser scanning unit and utilizing the multiple scans to create representations of the surface's topography. The surface topography data can also be used to calculate the compressive or tensile stress caused by a thin film applied to the surface of a semiconductor wafer. The apparatus of the present invention scans a laser beam across a surface in an x direction, and detects displacements of a reflected portion of the laser beam in a z direction. A pair of photodetectors are used to translate z direction displacements of the reflected beam into analog signals which are digitized and input into a microcomputer for analysis. The multiple scans of the surface are preferably accomplished by placing the workpiece on a pedestal which can be rotated to various angular positions.
Abstract:
An integrated modular multiple chamber vacuum processing system is disclosed. The system includes a load lock, may include an external cassette elevator, and an internal load lock wafer elevator, and also includes stations about the periphery of the load lock for connecting one, two or several vacuum process chambers to the load lock chamber. A robot is mounted within the load lock and utilizes a concentric shaft drive system connected to an end effector via a dual four-bar link mechanism for imparting selected R-.theta. movement to the blade to load and unload wafers at the external elevator, internal elevator and individual process chambers. The system is uniquely adapted for enabling various types of IC processing including etch, deposition, sputtering and rapid thermal annealing chambers, thereby providing the opportunity for multiple step, sequential processing using different processes.
Abstract:
A magnetically-enhanced, variable magnetic field, RIE mode plasma etch process for etching materials such as dielectrics and polycrystalline, is disclosed. The variable magnetic field permits optimization of selected characteristics such as etch rate, etch selectivity, ion bombardment and radiation damage, etch uniformity, and etch anisotropy.
Abstract:
An optical data recording system in which during recording the writing beam is made to move at the same velocity as the recording medium whereby motion blur is minimized or reduced. Movement of the writing beam at the same velocity as the recording medium is achieved by supplying a constantly varying frequency RF signal to an acousto-optic device which deflects (diffracts) the writing beam in accordance with the instantaneous frequency of the RF signal. The acousto-optic device can also be utilized to amplitude modulate the writing beam.
Abstract:
The device described herein includes self-adhering graphics presented in a multiple perspectives so that when applied to structural containers, such as cardboard boxes, the containers are transformed, child playthings.
Abstract:
Described are techniques for clustering a data set of objects. Divide phase processing is performed to partition the data set into two or more partitions forming a hierarchy of the objects. Merge phase processing may be performing using the hierarchy to determine one or more disjoint clusters of objects of the data set. Optional preprocessing may be performed to determine weights for one or more features of an object.
Abstract:
A money laundering prevention program administered by a financial institution. A plurality of risk factors associated with a potential for conducting illicit activities in connection with an account held at the financial institution are identified. The risk factors include jurisdiction-based risk factors, entity type-based risk factors, and/or business type-based risk factors. The risk factors are ranked and, based on the rank, each of the risk factors is assigned to a tier. Each of the tiers represents a level of risk that illicit activities will be conducted in connection with the account.
Abstract:
A spark plug capable of removing the remaining electric charges is proposed. The spark plug can be installed in a vehicle and has an insulating body, a center electrode, a conductive housing and a conductive wire. The center electrode is passed through the insulating body. The conductive housing is disposed outside the insulating body. One end of the conductive wire is connected to the conductive housing and the other end of the conductive wire is fixed on a negative electrode of a battery of the vehicle. Since the electric charges remaining in the spark plug can be removed by the conductive wire after the high-voltage current sent from the ignition system induces the sparks, the present invention can avoid the damage of the spark plug to keep the spark plug in good status, maintain the efficiency of the engine, and make the car safer in usage.
Abstract:
A system and related techniques automatically monitor browser and other sessions to detect the onset of a popup or other automatically generated windows or media. When a popup object is detected, a filter or engine may examine the content of that object to generate an estimate of the desirability of the popup to the user. The content-based evaluation of the popup may examine, for instance, the source of the popup, the type or quantity of embedded image files, text including keywords, embedded links and a variety of other factors to assess the likelihood that the popup was related to the user's legitimate browser activity or otherwise likely to be desired by the user. If not, the platform may suppress the popup or other object without user intervention. In embodiments, the content analysis may be performed by a self-learning network such as a neural network, for instance based on stored feedback from a collection of users, or otherwise.
Abstract:
A wafer handling and testing apparatus and method include a station for supporting a wafer carrier, such as a cassette or pod, that holds one or more wafers, where the carrier can be moved in a z-direction. A wafer handling assembly is moveable in an x-direction and removes a wafer from the wafer carrier. The handling assembly includes an end effector and a sensor for detecting an edge of the wafer. A chuck includes a platform that is movable in a z-direction and is used to lift the wafer from the handling assembly and rotate the wafer so that the sensor maps the edge of the wafer. The wafer is then centered on the platform, lowered onto the chuck, and is tested by a test head that is preferably coupled to the handling assembly.